Class 257/E25.031 - Containers (EPO)

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: This subclass is indented under subclass E25.029. This subclass
No. of patents: 118
Last issue date: 09/23/2008

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Number	Title	Issue Date
7427810	Semiconductor device including semiconductor element mounted on another semiconductor element A semiconductor device including a first semiconductor element mounted on a first surface of second semiconductor element, wherein solder balls are formed on the first surface of the second semiconductor element such that the first surface includes an area without s...	09/23/2008
7402884	Low crosstalk substrate for mixed-signal integrated circuits An integrated circuit laminate with a metal substrate for use with high performance mixed signal integrated circuit applications. The metal substrate provides substantially improved crosstalk isolation, enhanced heat sinking and an easy access to a true low impedanc...	07/22/2008
7400035	Semiconductor device having multilayer printed wiring board A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support body, and a semiconductor chip provided on the first substrate exposed ...	07/15/2008
7355264	Integrated passive devices with high Q inductors The specification describes flip bonded dual substrate inductors wherein a portion of the inductor is constructed on a base IPD substrate, a mating portion of the inductor is constructed on a cover (second) substrate. The cover substrate is then flip bonded to the b...	04/08/2008
7352068	Multi-chip module A multi-chip module is provided which allows memory space extension to improve function and performance. A first semiconductor chip is mounted on a mounting substrate, and a first semiconductor memory chip is mounted over the first semiconductor chip. A second semic...	04/01/2008
7342308	Component stacking for integrated circuit electronic package Component stacking for increasing packing density in integrated circuit packages. In one aspect of the invention, an integrated circuit package includes a substrate, and a plurality of discrete components connected to the substrate and approximately forming a compon...	03/11/2008
7291924	Flip chip stacked package A flip chip stacked package mainly comprises a carrier, a lower chip, an upper chip, a plurality of bumps, a plurality of bonding wires and a supporter. The supporter is attached to the lower surface of the carrier via an adhesive and covers the opening of the carri...	11/06/2007
7285862	Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film The present invention includes the steps of forming a first resin film uncured on a wiring substrate including a wiring pattern, burying an electronic parts having a connection terminal on an element formation surface in the first resin film uncured in a state where...	10/23/2007
7282793	Multiple die stack apparatus employing T-shaped interposer elements Multiple integrated circuit devices in a stacked configuration that use a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof are disclosed. ...	10/16/2007
7230320	Electronic circuit device with reduced breaking and cracking In an electronic circuit device including a substrate including a front surface on which an electronic circuit element is mounted and a reverse surface opposite to the front surface in a thickness direction of the substrate, an electrically conductive terminal membe...	06/12/2007
7227252	Semiconductor component having stacked, encapsulated dice and method of fabrication A semiconductor component includes a substrate and multiple stacked, encapsulated semiconductor dice on the substrate. A first die is back bonded to the substrate and encapsulated in a first encapsulant, and a second die is back bonded to the first encapsulant. The ...	06/05/2007
RE39628	Stackable flex circuit IC package and method of making same A stackable flex circuit IC package includes a flex circuit comprised of a flexible base with a conductive pattern thereon, and wrapped around at least one end portion of a frame so as to expose the conductive pattern at the edge portion. An IC device is mounted wit...	05/15/2007
7151010	Methods for assembling a stack package for high density integrated circuits Methods for assembling a stack package for a high density IC module on a PCB include the steps of assembling a first layer of the stack package on the PCB, assembling a second layer of the stack package on the first layer and assembling a third layer of the stack pa...	12/19/2006
7148567	Semiconductor integrated circuit device A semiconductor integrated circuit device has two semiconductor integrated circuit chips (20 and 30) respectively provided with a plurality of PADs (40a–40e, 41a–41e and 42a�...	12/12/2006
7138726	Protective interleaf for stacked wafer shipping A package includes a first and a second wafer stored therein in a stacked configuration. The first wafer has interconnection conductor material portions extending from a first surface thereof. The interconnection conductor material portions have a maximum height. An...	11/21/2006
7132746	Electronic assembly with solder-bonded heat sink A process and electronic assembly for conducting heat from a semiconductor circuit device mounted to a substrate. The substrate is supported by a housing member equipped with a heat-conductive member. A surface of the device opposite the substrate is bonded to the h...	11/07/2006
7109576	Semiconductor component having encapsulated die stack A semiconductor component includes a substrate and multiple stacked, encapsulated semiconductor dice on the substrate. A first die is back bonded to the substrate and encapsulated in a first encapsulant, and a second die is back bonded to the first encapsulant. The ...	09/19/2006
6703699	Semiconductor device The present invention has an object to provide a more compact semiconductor device that can be assembled with reduced parts and tasks. The semiconductor device includes a housing having a top and bottom surfaces. Surrounded within the housing is an insula...	03/09/2004
6703703	Low cost power semiconductor module without substrate A power module for low voltage applications, which does not include an insulated metal substrate is disclosed. The module includes a power shell and a plurality of lead frames each lead frame including a conductive pad on which one or more MOSFETs may be ...	03/09/2004
6680532	Multi chip module A multi chip package, which includes a package substrate having a first side and an opposing second side. The first side is for receiving package electrical connections. Integrated circuits are electrically connected and structurally connected by their fi...	01/20/2004
6628526	Electronic device manufacturing method, electronic device and resin filling method The present invention provides an electronic device manufacturing method and an electronic device which make it possible to reduce the waste of materials and the number of manufacturing steps required. Electronic devices are manufactured via a process inc...	09/30/2003
6618267	Multi-level electronic package and method for making same A multi-level package, and method for making same, that offers a small size with compartmentalized areas that allow for radiation shielding is disclosed. In its simplest embodiment, the invention comprises two cards and an interposer interposed between th...	09/09/2003
6613979	Electrical circuit suspension system A device and method wherein electrical components are mechanically suspended and electrically interconnected in an insulative elastomeric body, such as silicone, thereby eliminating the need for a circuit board or other circuit substrate. The device can c...	09/02/2003
6605779	Electronic control unit The present invention protects a thin wire connection from oscillation of a resin protecting an electronic circuit module from vibration, impact, and corrosion. An electronic control unit including an electronic circuit module in which a bare chip is moun...	08/12/2003
6580316	Power transistor module, power amplifier and methods in the fabrication thereof The present invention relates to a power transistor module for radio frequency applications, particularly for use in an amplifier stage in a radio base station or a ground transmitter for TV or radio, wherein said power transistor module comprises a suppo...	06/17/2003
6548328	Circuit device and manufacturing method of circuit device After a trench 54 is formed in a conductive foil 60, the circuit elements are mounted, and the insulating resin is applied on the conductive foil 60 as the support substrate. After being inverted, the conductive foil 60 is polished on the insulating resin...	04/15/2003
6521983	Semiconductor device for electric power A semiconductor device for electric power comprising: a resin case; and a main circuit terminally inserted in the resin case, which main circuit terminal has an end on an outwardly connecting side, wherein the end is bent so as to be in parallel with a re...	02/18/2003
6489686	Multi-cavity substrate structure for discrete devices The distance between a discrete or passive electrical component and an electrical semiconductor device and substrate or carrier is minimized by shortening the lead length connections of the passive component. One or more passive electronic components are ...	12/03/2002
6396125	Semiconductor device A semiconductor device is formed of a casing, a semiconductor element disposed in the casing, and a control terminal assembly situated outside the casing. The control terminal assembly includes control terminals connected to the semiconductor element, and...	05/28/2002
6384492	Power semiconductor packaging Power output switching circuit for use in high current and high frequency applications. The output circuit provides a series of geometrically symmetric, parallel spaced semiconductor converters arranged such that the voltage for each semiconductor output ...	05/07/2002
6339231	Gate commutated turn-off thyristor module A gate terminal plate (1) of a GCT thyristor (90), a connecting substrate (70) of a driving device and a cathode electrode plate (10) are interposed between a set of metal rings (7A) and (7C) fastened to each other with a screw (8). The cathode electrode ...	01/15/2002
6313598	Power semiconductor module and motor drive system A power semiconductor module comprising a power semiconductor element included in a power circuit portion and mounted on a metal base, a first resin molded to the power semiconductor element, a control circuit element disposed on the first resin and inclu...	11/06/2001
6291880	Semiconductor device including an integrally molded lead frame A semiconductor device includes a main circuit part having a semiconductor device formed on an electrode plate of a lead frame and a control circuit part having protective functions, which is integrally molded by a resin mold part into an integral mold st...	09/18/2001
6281579	Insert-molded leadframe to optimize interface between powertrain and driver board An insert-molded leadframe having wire bonding posts formed on an inner portion, device pins formed on an outer portion, and a central portion connecting between the inner portion and the outer portion. Plastic encases the central portion of the conductiv...	08/28/2001
6271607	Sub-assemblies with electronic components, for motor vehicle alternators A regulator sub-assembly for an alternator comprises a substrate having a through aperture, with an integrated circuit component mounted within this aperture, while an elementary electronic component other than an integrated circuit (and being for example...	08/07/2001
6259157	Hybrid integrated circuit device, and method of manufacturing thereof A hybrid integrated circuit device comprising: a substrate having an insulated surface and superior thermal conductivity; conductor patterns provided on the substrate; an element mounted on the surface so as to connect with the conductor patterns through ...	07/10/2001
6228682	Multi-cavity substrate structure for discrete devices The distance between a discrete or passive electrical component and an electrical semiconductor device and substrate or carrier is minimized by shortening the lead length connections of the passive component. One or more passive electronic components are ...	05/08/2001
6166937	Inverter device with cooling arrangement therefor IGBT modules, bus bars and capacitors in an inverter main circuit are secured on the front face of a heat sink and at the back side of the heat sink a water cooling channel is formed to cool the IGBT modules. The bus bars and the capacitor, thereby the si...	12/26/2000
6163456	Hybrid module and methods for manufacturing and mounting thereof In a hybrid module which is mounted on a mother circuit board with a first surface of a substrate opposed to the mother circuit board, a cavity is formed on the first surface, and a heat-generating circuit component is facedown-bonded in the cavity. Heat ...	12/19/2000
6160326	Power semiconductor packaging Power output switching circuit for use in high current and high frequency applications. The output circuit provides a series of geometrically symmetric, parallel spaced semiconductor converters arranged such that the voltage for each semiconductor output ...	12/12/2000

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Class 257/E25.031 - Containers (EPO)