Bizarre Patents
A method of swing on a swing is disclosed, in which a user positioned on a standard swing suspended by two chains from a substantially horizontal tree branch induces side to side motion by pulling alternately on one chain and then the other.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7420281 | Stacked chip semiconductor device A stacked chip semiconductor device whose size is substantially reduced by high density packaging of two or more semiconductor chips. In the semiconductor device, four semiconductor chips are stacked over a printed wiring board. The bottom semiconductor chip has an ... | 09/02/2008 |
| 7382000 | Semiconductor device A semiconductor device is provided which comprises a connecting lead 4 mounted between a MOS-FET 1 and a regulatory IC 2 on a support plate 3. Connecting lead 4 has a thermally radiative and electrically conductive substrate 6 | 06/03/2008 |
| 7372139 | Semiconductor chip package A semiconductor chip package may include a substrate, which may have bonding pads formed thereon. A semiconductor chip mounted on the substrate may have chip pads, and electrical connections for connecting the chip pads of the semiconductor chip to the substrate bon... | 05/13/2008 |
| 7355264 | Integrated passive devices with high Q inductors The specification describes flip bonded dual substrate inductors wherein a portion of the inductor is constructed on a base IPD substrate, a mating portion of the inductor is constructed on a cover (second) substrate. The cover substrate is then flip bonded to the b... | 04/08/2008 |
| 7342308 | Component stacking for integrated circuit electronic package Component stacking for increasing packing density in integrated circuit packages. In one aspect of the invention, an integrated circuit package includes a substrate, and a plurality of discrete components connected to the substrate and approximately forming a compon... | 03/11/2008 |
| 7247932 | Chip package with capacitor A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor chip connections of one or more primary chips which overlie the window ... | 07/24/2007 |
| 7217587 | MEMS scanning mirror with trenched surface and tapered comb teeth for reducing inertia and deformation A micro-electro-mechanical system (MEMS) device includes a mirror having a top surface with trenches, a beam connected to the mirror, rotational comb teeth connected to the beam, and one or more springs connecting the beam to a bonding pad. The mirror can have a bot... | 05/15/2007 |
| 7208833 | Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate An electronic circuit device comprises: a semiconductor element having a first surface and a second surface, with the first and second surfaces being on first and second sides of the semiconductor element, respectively, and facing in opposite directions; a first ele... | 04/24/2007 |
| 7205646 | Electronic device and chip package The package includes a substrate, a first chip, a second chip, multiple first bumps and multiple second bumps. The substrate has a first region and a second region. The first region is substantially coplanar with the second region. The first bumps connect the first ... | 04/17/2007 |
| 7164201 | Semiconductor module with scalable construction A power semiconductor module with a scalable construction, having a base plate or intended for direct mounting on a heat sink. The module has a framelike housing, a cover, terminal elements, extending to the outside of the housing for load contacts and auxiliary con... | 01/16/2007 |
| 7154171 | Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor A semiconductor stacking structure has a semiconductor device. A flexible substrate is coupled to a bottom surface of the semiconductor device. The flexible substrate is folded over on at least two sides to form flap portions. The flap portions are coupled to an upp... | 12/26/2006 |
| 7138708 | Electronic system for fixing power and signal semiconductor chips An electronic system having a sandwich design and including two carriers, each carrier having a printed circuit layer, the upper printed circuit layer being positioned on different planes. ... | 11/21/2006 |
| 6833285 | Method of making a chip packaging device having an interposer An apparatus is provided for the supply of passive electronic components to a chip containing circuitry capable of operating in a communications system. The invention provides a silicon interposer element chip package which includes a silicon substrate and which is ... | 12/21/2004 |
| 6703703 | Low cost power semiconductor module without substrate A power module for low voltage applications, which does not include an insulated metal substrate is disclosed. The module includes a power shell and a plurality of lead frames each lead frame including a conductive pad on which one or more MOSFETs may be ... | 03/09/2004 |
| 6661317 | Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly A microwave monolithic integrated circuit assembly includes a microwave monolithic integrated circuit having an MMIC circuit plane and having a first region of relatively high heat production and a second region of relatively low heat production. A heat-d... | 12/09/2003 |
| 6654249 | Circuit arrangement A circuit arrangement includes a base body, with one or more substrates, an intermediate-circuit board, a compression device and a driver circuit. Each substrate includes a positive-pole conductive strip, a negative-pole conductive strip, and auxiliary co... | 11/25/2003 |
| 6650559 | Power converting device A radiation container where a noise filter unit is sealed and accommodated with a resinous insulation material having a thermal conductive characteristic nearly equal to that of the radiation container, and a driving unit are directly installed on a radia... | 11/18/2003 |
| 6646884 | Sandwich-structured intelligent power module The power substrate is inserted in a housing (1) as base plate and together with the same forms a standardized power part from whose top side (11) there are projecting terminal pins (5) which are soldered by through-soldering to via holes of the board (4)... | 11/11/2003 |
| 6611051 | Semiconductor device and communication terminal using thereof Wire bonding or printed wiring board leads or, alternatively, lead frames or equivalents thereof are used to electrically connect external electrodes of high withstand voltage capacitors formed on a plurality of semiconductor chips. A driver circuit for s... | 08/26/2003 |
| 6584681 | Method for producing a microelectronic component of sandwich construction A method for producing a microelectronic component of sandwich construction, which includes the steps of providing a first substrate which has a first conductor track plane, providing a plurality of semiconductor chips which have first contact faces elect... | 07/01/2003 |
| 6580316 | Power transistor module, power amplifier and methods in the fabrication thereof The present invention relates to a power transistor module for radio frequency applications, particularly for use in an amplifier stage in a radio base station or a ground transmitter for TV or radio, wherein said power transistor module comprises a suppo... | 06/17/2003 |
| 6576499 | Electronic device assembly and a method of connecting electronic devices constituting the same An electronic device assembly for dense mounting of electronic devices and method of connecting the electronic devices are disclosed. Conductive portions implemented by metal bumps and sealing portions implemented by adhesive seal resin are connected by t... | 06/10/2003 |
| 6541851 | Lead frame for a semiconductor device In a semiconductor device, a lead frame is adhered to a base substrate for heat dissipation via an insulating layer, and an outward guided terminal portion is formed by perpendicularly upwardly bending an end of the lead frame after the mounting of one or... | 04/01/2003 |
| 6535396 | Combination circuit board and segmented conductive bus substrate A combination circuit board (12) and segmented bus structure (54) defines a composite circuit board/bus assembly (52) upon which an electrical circuit may be assembled. The various segments (54a-54f) of bus structure (54) may be variously configured to ac... | 03/18/2003 |
| 6531861 | Movement actuator/sensor systems A sensor system for sensing movement comprises a rod anchored at one end to a base and plurality of strain gauges circumferentially disposed about the rod. The free end of the rod may be subject to forces in various directions. The strain gauges produce s... | 03/11/2003 |
| 6509629 | Power module A control substrate is covered by an electromagnetic shielding member connected to a conductive base plate on which a power insulating substrate is placed. A conductive connecting member through which the electromagnetic shielding member and the conductiv... | 01/21/2003 |
| 6429507 | Electrical device including a leaded cell assembly An electrical device. The electrical device includes a first substrate, a second substrate facing the first substrate, a unpackaged semiconductor die electrically and thermally connected to the first substrate, a first lead electrically connected between ... | 08/06/2002 |
| 6421244 | Power module In a power module, an interconnection terminal (10) is inserted into a through hole (30) and a connector (16) of a control circuit substrate (12) from the side of a lower main surface of the control. circuit substrate (12). Then, the interconnection termi... | 07/16/2002 |
| 6400576 | Sub-package bypass capacitor mounting for an array packaged integrated circuit Switching noise within an LGA-packaged or PGA-packaged IC Vdd and IC Vss nodes is reduced by spreading the electrical current in the bypass path to reduce the effective current loop area, and thus reduce the energy stored in the magnetic field surrounding... | 06/04/2002 |
| 6384492 | Power semiconductor packaging Power output switching circuit for use in high current and high frequency applications. The output circuit provides a series of geometrically symmetric, parallel spaced semiconductor converters arranged such that the voltage for each semiconductor output ... | 05/07/2002 |
| 6362964 | Flexible power assembly A flexible power assembly (FPA) provides a new packaging concept suitable for motor control and other functions. An insulated metal substrate (IMS) supports power semiconductor devices and is mounted directly on a heatsink, which supports a circuit board ... | 03/26/2002 |
| 6348672 | Electric heater for a motor vehicle with individually switched branch circuits An electric heater for a motor vehicle uses heat generated by power semiconductors as the heat source. The heat output by the power semiconductors is used directly for heating. The power semiconductors are regulated by circuit regulators to be able to adj... | 02/19/2002 |
| 6344973 | Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same The invention relates to a power module with a circuit arrangement provided with active semiconductor components and passive components and with a circuit substrate, whereby at least a portion of the active semiconductor components are soldered onto a DCB... | 02/05/2002 |
| 6324072 | Microelectronic component of sandwich construction A microelectronic component of sandwich construction, that includes a first substrate with a first conductor track plane and a second substrate with a second conductor track plane, between which many semiconductor chips are disposed. The contacting of the... | 11/27/2001 |
| 6321443 | Connection substrate The method for the manufacture of multilayer connecting substrates with multiple functions comprises the design of the connecting substrate taking place in functionally separated manner, in that signal conducting substrate parts (19), power supplying subs... | 11/27/2001 |
| 6313520 | Resin-sealed power semiconductor device including substrate with all electronic components for control circuit mounted thereon A resin-sealed power semiconductor device is provided. The thicknesses of a die pad (19) and a lead part (2) are made equal and as great as possible. A thick film substrate (8) is bonded with a bonding layer (20) onto a plurality of supporting inner leads... | 11/06/2001 |
| 6288909 | Conductive via feed through for double-sided modules A double-sided module is provided having electrical substrates on either side of a panel housing which are interconnected by a wire connection from one substrate to a conductor-filled through-channel, or via, in the other substrate. The distances from the... | 09/11/2001 |
| 6285559 | Multichip module A multichip module (MCM) of the present invention includes a first substrate formed with through holes and having shield electrodes arranged therein. At least one semiconductor device is mounted on one major surface of the first substrate and electrically... | 09/04/2001 |
| 6281579 | Insert-molded leadframe to optimize interface between powertrain and driver board An insert-molded leadframe having wire bonding posts formed on an inner portion, device pins formed on an outer portion, and a central portion connecting between the inner portion and the outer portion. Plastic encases the central portion of the conductiv... | 08/28/2001 |
| 6205031 | Electronic control apparatus An electronic control unit having a housing, a substrate, particularly a hybrid, arranged in the housing and having an electronic control circuit. The electronic control unit also includes at least one device plug secured to the housing having contact ele... | 03/20/2001 |
