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| Number | Title | Issue Date |
| 7408262 | Semiconductor integrated circuit device A semiconductor integrated circuit device includes a semiconductor chip, a memory cell array arranged on the semiconductor chip and first and second decoder strings arranged along both ends of the memory cell array. The arrangement position of the first decoder stri... | 08/05/2008 |
| 7402884 | Low crosstalk substrate for mixed-signal integrated circuits An integrated circuit laminate with a metal substrate for use with high performance mixed signal integrated circuit applications. The metal substrate provides substantially improved crosstalk isolation, enhanced heat sinking and an easy access to a true low impedanc... | 07/22/2008 |
| 7385281 | Semiconductor integrated circuit device A COC DRAM including a plurality of stacked DRAM chips is mounted on a motherboard by using an interposer. The interposer includes a Si unit and a PCB. The Si unit includes a Si substrate and an insulating-layer unit in which wiring is installed. The PCB includes a ... | 06/10/2008 |
| 7382000 | Semiconductor device A semiconductor device is provided which comprises a connecting lead 4 mounted between a MOS-FET 1 and a regulatory IC 2 on a support plate 3. Connecting lead 4 has a thermally radiative and electrically conductive substrate 6 | 06/03/2008 |
| 7355264 | Integrated passive devices with high Q inductors The specification describes flip bonded dual substrate inductors wherein a portion of the inductor is constructed on a base IPD substrate, a mating portion of the inductor is constructed on a cover (second) substrate. The cover substrate is then flip bonded to the b... | 04/08/2008 |
| 7332806 | Thin, thermally enhanced molded package with leadframe having protruding region A semiconductor die package. It includes (a) a semiconductor die including a first surface and a second surface, (b) a source lead structure including protruding region having a major surface, the source lead structure being coupled to the first surface, (c) a gate ... | 02/19/2008 |
| 7232708 | Multi-mode integrated circuit structure A multi-mode integrated circuit structure. In one embodiment, an integrated circuit structure includes a first die having at least one first component disposed on a face, the first die fabricated using a first process that is optimal for operating the component in a... | 06/19/2007 |
| 7215023 | Power module A power module includes at least one carrier body for mounting at least one power component thereon, and at least one energy storage component. For this purpose, a hybrid circuit is arranged as a thick film circuit on at least one of the carrier bodies, and the hybr... | 05/08/2007 |
| 7205673 | Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing A bond pad structure which includes an aluminum bond pad which include one or more dopants that effectively control the growth of IMC to a nominal level in spite of high tensile stresses in the wafer. For example, aluminum can be doped with 1–2 atomic % of Mg. Alt... | 04/17/2007 |
| 6685817 | Method and apparatus for controlling plating over a face of a substrate According to aspect of the invention, a plating system is provided which includes a tank for containing a plating solution, a shaft extending into the tank, and a substrate holder mounted to the shaft. The shaft and the tank are rotatable relative to one ... | 02/03/2004 |
| 6669489 | Interposer, socket and assembly for socketing an electronic component and method of making and using same Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board or other electronic component. In an embodiment, resilient contact structures extend through a support substrate, an... | 12/30/2003 |
| 6655023 | Method and apparatus for burning-in semiconductor devices in wafer form Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connect... | 12/02/2003 |
| 6649978 | Semiconductor module having multiple semiconductor chips A multiple semiconductor chip (multi-chip) module includes at least an output semiconductor chip and a control semiconductor chip mounted on an electrically conductive heat sink. The output semiconductor chip may have a bulk substrate configuration and th... | 11/18/2003 |
| 6646321 | Power transistor with internally combined low-pass and band-pass matching stages RF power transistor provided with an internal shunt inductor, characterized in that the shunt is produced in two separated, capacitors (Cb, Cp), each internally bonded to the transistor internal active die (AD) through internal leads (Li, Ld1), one of whi... | 11/11/2003 |
| 6624648 | Probe card assembly A probe card assembly includes a probe card, a space transformer, and an interposer disposed between the space transformer and the probe card. Suitable mechanisms for adjusting the orientation of the space transformer without changing the orientation of t... | 09/23/2003 |
| 6615485 | Probe card assembly and kit, and methods of making same A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereo... | 09/09/2003 |
| 6611434 | Stacked multi-chip package structure with on-chip integration of passive component A stacked multi-chip package structure with on-chip integration of passive component is proposed, which is characterized in the mounting of passive component on a remaining surface area of the underlying semiconductor chip that is unoccupied by the overly... | 08/26/2003 |
| 6600220 | Power distribution in multi-chip modules A multi-chip module (MCM) having a substrate including a first surface, a second surface and a multi-layer interconnection arrangement disposed between the two surfaces. A high-density thin-film circuit region is provided on the substrate first surface to... | 07/29/2003 |
| 6521997 | Chip carrier for accommodating passive component A chip carrier for accommodating a passive component is proposed, allowing at least a chip to be electrically connected to the chip carrier. At least a pair of spaced-apart solder pads are formed on the chip carrier in no interference with the electrical ... | 02/18/2003 |
| 6486548 | Semiconductor module and power converting apparatus using the module A semiconductor module in which a lead electrode is integrally formed with or pressed into resin separated from a resin case, and a connector securing a pad for bonding a metal wire to the lead electrode is bonded to a substrate with a power semiconductor... | 11/26/2002 |
| 6483328 | Probe card for probing wafers with raised contact elements A probe card is provided for contacting an electric componet with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer with resilient contact elements, such as springs. A probe card is designed to ha... | 11/19/2002 |
| 6476333 | Raised contact structures (solder columns) An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate membe... | 11/05/2002 |
| 6465893 | Stacked chip assembly A semiconductor chip assembly, comprises a first semiconductor chip having a front surface, a rear surface and contacts on the front surface and a second semiconductor chip having a front surface, a rear surface and contacts on the front surface. The rear... | 10/15/2002 |
| 6462950 | Stacked power amplifier module Stacked substrates using passive integration components formed in silicon or stainless steel substrates interconnect with active elements mounted on the surface of the substrate to form a miniaturized power amplification module. Metal filled vias pass thr... | 10/08/2002 |
| 6441483 | Die stacking scheme An improved die stacking scheme is provided. In accordance with one embodiment of the present invention, a multiple die semiconductor assembly is provided comprising a substrate, first and second semiconductor dies, and at least one decoupling capacitor. ... | 08/27/2002 |
| 6433419 | Face-up semiconductor chip assemblies A semiconductor chip is mounted in face-up disposition, with a contact-bearing front surface facing away from a substrate such as a circuit panel, and with a rear face facing toward the substrate. A backing element having terminals is disposed between the... | 08/13/2002 |
| 6433412 | Semiconductor device and a method of manufacturing the same A central portion of a main face of a package substrate 2 is mounted with a memory chip 1 using face down bonding by a flip chip bonding system. Further, a plurality of chip condensers 7 are mounted at vicinities of the memory chip 1. A clearance between ... | 08/13/2002 |
| 6418030 | Multi-chip module A multi-chip module includes bare IC chips mounted on respective areas of a printed wiring board. Outer electrode pads on the peripheries of the board are soldered to another printed wiring board such as a motherboard. Lead pads and the outer electrode pa... | 07/09/2002 |
| 6410960 | Hybrid integrated circuit component A hybrid (composite) integrated circuit element comprises a substrate, a thin film type integrated circuit formed on a substrate through a thin film process, and a lamination type passive circuit element such as a capacitor, inductor, resitance and a comb... | 06/25/2002 |
| 6396137 | Integrated voltage/current/power regulator/switch system and method An integrated voltage/current/power regulator/switch (VCPRS) system and method are disclosed in which regulator/switch circuitry is vertically integrated on top of an existing integrated circuit. The present invention does not require additional integrate... | 05/28/2002 |
| 6392306 | Semiconductor chip assembly with anisotropic conductive adhesive connections A semiconductor chip assembly including a semiconductor chip having contacts on a front surface, an element having terminals thereon and leads connecting the contacts to the terminals, wherein the leads are connected to the chip contacts by Z-conductive a... | 05/21/2002 |
| 6377464 | Multiple chip module with integrated RF capabilities A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated... | 04/23/2002 |
| 6376917 | Semiconductor device A semiconductor device is characterized by mixedly mount a logic chip, an analog chip, a memory chip, etc. by stacking them while stabilizing power supply lines and ground lines of each chip. The semiconductor device has an intermediate substrate having a... | 04/23/2002 |
| 6372527 | Methods of making semiconductor chip assemblies A method of making semiconductor chip assemblies includes providing a semiconductor wafer including a plurality of semiconductor chips having contacts on a contact bearing surface thereof and providing a substrate having a first surface with a plurality o... | 04/16/2002 |
| 6359331 | High power switching module A power switching module includes a substrate having at least one silicon die forming at least one power switching element and having leadframe terminal posts extending away therefrom. A planar negative rail layer providing a negative power supply and inc... | 03/19/2002 |
| 6353540 | Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board. A low-EMI circuit which realizes a high mounting density by converting the potential fluctuation off a power supply layer with respect to a ground layer which occurs on switching an IC device etc., into Joule's heat in the substrate without using any part... | 03/05/2002 |
| 6336269 | Method of fabricating an interconnection element Contact structures formed on an electronic component are useful for connecting the component to other electronic components. A contact tip structure can be formed on a sacrificial substrate, then combined with an interconnection element. A preferred conta... | 01/08/2002 |
| 6330164 | Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device The present invention provides an ancillary electrical component in very close proximity to a semiconductor device, preferably mounted directly to the semiconductor device. In one preferred embodiment, the ancillary electrical component is a capacitor. In... | 12/11/2001 |
| 6323096 | Method for fabricating a flexible interconnect film with resistor and capacitor layers A method for fabricating a flexible interconnect film includes applying a resistor layer over one or both surfaces of a dielectric film; applying a metallization layer over the resistor layer with the resistor layer including a material facilitating adhes... | 11/27/2001 |
| 6279227 | Method of forming a resilient contact structure An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate membe... | 08/28/2001 |
