Class 257/E25.023 - Device consisting of plurality of semiconductor or other solid-state devices or components formed in or on common substrate, e.g., integrated circuit device (EPO)

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: This subclass is indented under subclass E25.022. This subclass
No. of patents: 560
Last issue date: 10/28/2008

«First «Previous1 2 3 4 5 6 7 8 9 10 11 Next»Last»

Number	Title	Issue Date
7443021	Electronic component packaging structure and method for producing the same An electronic component packaging structure, includes: circuit boards each having a wiring at least on a surface thereof; and an electronic component package secured between the circuit boards. The electronic component package includes at least one electronic compon...	10/28/2008
7429781	Memory package A memory chip package with a controller die on a first side of a printed circuit board and a memory die on a second side of the same printed circuit board. The memory chip package is integrated into a microprocessor controlled device or alternatively is integrated i...	09/30/2008
7400032	Module assembly for stacked BGA packages Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrange...	07/15/2008
7388295	Multi-chip module A multi-chip module has at least two semiconductor chips. Each of the semiconductor chips has chip electrodes of the semiconductor chip, electrically conductive interconnections for electrically connection with the chip electrodes, electrically conductive lands for ...	06/17/2008
7385457	Flexible capacitive coupler assembly and method of manufacture A flexible capacitive coupler assembly includes a flexible dielectric substrate assembly having a front surface and a rear surface, the front surface having thereon a macroscopic metal capacitive pad. A package supports the flexible dielectric substrate. An electric...	06/10/2008
7385281	Semiconductor integrated circuit device A COC DRAM including a plurality of stacked DRAM chips is mounted on a motherboard by using an interposer. The interposer includes a Si unit and a PCB. The Si unit includes a Si substrate and an insulating-layer unit in which wiring is installed. The PCB includes a ...	06/10/2008
7385283	Three dimensional integrated circuit and method of making the same A three dimensional integrated circuit structure includes at least first and second devices, each device comprising a substrate and a device layer formed over the substrate, the first and second devices being bonded together in a stack, wherein the bond between the ...	06/10/2008
7375422	Stacked-type semiconductor package Corresponding parts to a first path portion in a first signal transmission path to a first semiconductor chip are an interconnection member and a second path portion a second signal transmission path to a second semiconductor chip and are not formed on the first tap...	05/20/2008
7372139	Semiconductor chip package A semiconductor chip package may include a substrate, which may have bonding pads formed thereon. A semiconductor chip mounted on the substrate may have chip pads, and electrical connections for connecting the chip pads of the semiconductor chip to the substrate bon...	05/13/2008
7368810	Invertible microfeature device packages Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality of device contacts, and a conductive structure electrically connected ...	05/06/2008
7332808	Semiconductor module and method of manufacturing the same A semiconductor module according to the invention includes: an island formed of a conductive material; a plurality of leads disposed in vicinity of the island; a resin sealing body which is mounted on the island and disposed such that a back surface of a circuit boa...	02/19/2008
7317250	High density memory card assembly A high density memory card assembly having application for USB drive storage, flash and ROM memory cards, and similar memory card formats. A cavity is formed through a rigid laminate substrate. First and second digital memory devices (e.g., TSOP packages or bare sem...	01/08/2008
7307340	Wafer-level electronic modules with integral connector contacts An electronic module comprises a monolithic microelectronic substrate including at least one integrated circuit die, e.g., a plurality of unseparated memory dice or a mixture of different types of integrated circuit dice. The monolithic substrate further includes a ...	12/11/2007
7294928	Components, methods and assemblies for stacked packages A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly e...	11/13/2007
7291926	Multi-chip package structure The present invention relates to a multi-chip package structure, comprising a first substrate, a first chip, a sub-package and a first molding compound. The first chip is attached to the first substrate. The first molding compound encapsulates the first chip, the su...	11/06/2007
7285850	Support elements for semiconductor devices with peripherally located bond pads A support structure for a semiconductor device with peripherally disposed contacts includes a support substrate and at least one conductive column protruding from the support substrate. The at least one conductive column is configured to contact an outer connector o...	10/23/2007
7262498	Assembly with a ring and bonding pads formed of a same material on a substrate An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material. ...	08/28/2007
7259451	Invertible microfeature device packages Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality of device contacts, and a conductive structure electrically connected ...	08/21/2007
7247934	Multi-chip semiconductor package A multi-chip semiconductor package and a fabrication method thereof are provided. At least one first chip is mounted on and electrically connected to an upper surface of a substrate via solder bumps. A preformed package structure having a second chip and a first enc...	07/24/2007
7235871	Stacked microelectronic dies An assembly of microelectronic devices and method for forming an assembly of microelectronic devices. In one embodiment, the method includes positioning a first packaged microelectronic device adjacent to a support member having support member circuitry, with the fi...	06/26/2007
7227252	Semiconductor component having stacked, encapsulated dice and method of fabrication A semiconductor component includes a substrate and multiple stacked, encapsulated semiconductor dice on the substrate. A first die is back bonded to the substrate and encapsulated in a first encapsulant, and a second die is back bonded to the first encapsulant. The ...	06/05/2007
7215022	Multi-die module A multi-die module is electrically connected to both an unpackaged die and a packaged die as disclosed herein. The multi-die module has a footprint that is the same as conventional multi-die packages, which do not include packaged die, thereby allowing the multi-die...	05/08/2007
7208824	Land grid array module Disclosed is a land grid array module comprising: a substrate; a plurality of active and passive components mounted on both sides of the substrate; and a molding compound for encapsulating the both sides of the substrate with the active and passive components mounte...	04/24/2007
7190060	Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same A three-dimensional stacked semiconductor package device includes first and second semiconductor package devices and a conductive bond. The first device includes a first insulative housing, a first semiconductor chip and a first lead that is bent outside the first i...	03/13/2007
7170183	Wafer level stacked package Disclosed are a wafer level stacked package and its manufacturing method. As one example, in such a wafer level stacked package, a first semiconductor die is electrically connected to an upper surface of a substrate and a second semiconductor die is electrically con...	01/30/2007
7145226	Scalable microelectronic package using conductive risers This invention relates to an apparatus and methods for increasing the microelectronic package density by stacking multiple microelectronic packages in an array and controlling package to package scalability without stressing the carrier substrates and without limiti...	12/05/2006
7138710	Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument A semiconductor device includes a semiconductor substrate in which an integrated circuit is formed, a through-hole electrode which is formed through first and second surfaces of the semiconductor substrate and includes a first projecting section which projects from ...	11/21/2006
7134194	Method of developing an electronic module An electronic module and method that enable circuitry required by one form of the module (e.g., a developmental unit) to be omitted in a second form of the module (e.g., a production unit), without necessitating additional changes in the module. The electronic modul...	11/14/2006
7129583	Multi-chip package structure The present invention relates to a multi-chip package structure, comprising a first substrate, a first chip, a sub-package and a first molding compound. The first chip is attached to the first substrate. The first molding compound encapsulates the first chip, the su...	10/31/2006
7098528	Embedded redistribution interposer for footprint compatible chip package conversion An embedded redistribution interposer is disclosed for providing footprint compatible chip package migration in which a die designed to be mounted into chip package is originally implemented using a first type of silicon platform and is subsequently redesigned for a...	08/29/2006
7091588	Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation A primary side circuit and a secondary side circuit are provided on first and second semiconductor substrates, respectively. A first capacitive insulator on the first substrate electrically insulates and isolates between the primary and secondary side circuits while...	08/15/2006
6700783	Three-dimensional stacked heat spreader assembly for electronic package and method for assembling A three-dimensional stacked heat spreader assembly is provided which includes an upper heat spreader of generally rectangular shape having a first edge portion extending downwardly; a lower heat spreader of generally rectangular shape having a second edge...	03/02/2004
6696754	Semiconductor module including a plurality of semiconductor devices detachably A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably....	02/24/2004
6696765	Multi-chip module A multi-chip module has at least two semiconductor chips. Each of the semiconductor chips has chip electrodes of the semiconductor chip, electrically conductive interconnections for electrically connection with the chip electrodes, electrically conductive...	02/24/2004
6693363	Ball grid array chip packages having improved testing and stacking characteristics A stackable ball grid array (BGA) or fine ball grid array (FBGA) semiconductor package particularly suitable for board-on-chip or chip-on-board applications in which a low-profile BGA or FBGA semiconductor package is needed. The stackable ball grid array ...	02/17/2004
6693346	Semiconductor memory module having double-sided stacked memory chip layout In the present invention, memory chips are stuck together in stacked fashion by TAB (tape automated bonding), and a multiple memory chip and lead complex like an SOP (small out-line package) is formed of the chips and leads, whereby a memory module of hig...	02/17/2004
6690088	Integrated circuit package stacking structure A stack of integrated circuits in thin small outline packages (TSOP's) is constructed with an air space in between adjacent packages. The TSOP's have a plurality of connection terminals extending therefrom. A lead frame is disposed adjacent to the package...	02/10/2004
6686222	Stacked semiconductor device manufacturing method In a semiconductor device manufacturing method, a semiconductor element is mounted on a substrate including first connection electrodes, first interconnections electrically connected to the first connection electrodes and a first alignment mark with the s...	02/03/2004
6684493	Vertically mountable interposer, assembly and method A support assembly for mounting a semiconductor device vertically relative to a carrier substrate is disclosed. The support assembly includes an interposer to which the semiconductor device is attached. The support assembly also includes traces carried on...	02/03/2004
6686655	Low profile multi-IC chip package connector A low profile multi-IC chip package for high-speed applications comprises a connector for electrically connecting the equivalent outer leads of a set of stacked primary semiconductor packages. In one embodiment, the connector comprises a two-part sheet of...	02/03/2004

«First «Previous1 2 3 4 5 6 7 8 9 10 11 Next»Last»

PatentStorm

Bizarre Patents

PatentStorm News

Class 257/E25.023 - Device consisting of plurality of semiconductor or other solid-state devices or components formed in or on common substrate, e.g., integrated circuit device (EPO)