Did You Know...
...that a workman who left the soap mixing machine on too long was responsible for making Ivory Soap? He was so embarrassed by his mistake that he threw the mess in a stream. Imagine his dismay when the evidence of his error floated to the surface! Result: Ivory soap, the soap that floats.
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| Number | Title | Issue Date |
| 7332808 | Semiconductor module and method of manufacturing the same A semiconductor module according to the invention includes: an island formed of a conductive material; a plurality of leads disposed in vicinity of the island; a resin sealing body which is mounted on the island and disposed such that a back surface of a circuit boa... | 02/19/2008 |
| 7105377 | Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process A method and system for universal packaging in conjunction with an automated in-line back-end IC manufacturing process. In one method embodiment, the present invention processes a die-strip through a number of integrated in-line processes that function independently... | 09/12/2006 |
| 6514793 | Stackable flex circuit IC package and method of making same A stackable flex circuit IC package includes a flex circuit comprised of a flexible base with a conductive pattern thereon, and wrapped around at least one end portion of a frame so as to expose the conductive pattern to the edge portion. An IC device is ... | 02/04/2003 |
| 6426549 | Stackable flex circuit IC package and method of making same A stackable flex circuit IC package includes a flex circuit comprised of a flexible base with a conductive pattern thereon, and wrapped around at least one end portion of a frame so as to expose the conductive pattern at the edge portion. An IC device is ... | 07/30/2002 |
| 6426240 | Stackable flex circuit chip package and method of making same A stackable integrated circuit chip package having a flex circuit. The flex circuit itself includes a flexible substrate having opposed, generally planar top and bottom surfaces, and a conductive pattern which is disposed on the bottom surface. The chip p... | 07/30/2002 |
| 6351029 | Stackable flex circuit chip package and method of making same A stackable integrated circuit chip package comprising a flex circuit. The flex circuit itself comprises a flexible substrate having opposed, generally planar top and bottom surfaces, and a conductive pattern which is disposed on the bottom surface. The c... | 02/26/2002 |
| 6323060 | Stackable flex circuit IC package and method of making same A stackable flex circuit IC package includes a flex circuit comprised of a flexible base with a conductive pattern thereon, and wrapped around at least one end portion of a frame so as to expose the conductive pattern at the edge portion. An IC device is ... | 11/27/2001 |
| 6191493 | Resin seal semiconductor package and manufacturing method of the same Bonding pads are formed on a main surface of a semiconductor chip. An insulating layer having openings located on the bonding pads is formed on the main surface of the semiconductor chip. Base metal layers are formed on the bonding pads. A buffer coat fil... | 02/20/2001 |
| 6168970 | Ultra high density integrated circuit packages Thin and durable level-one and level-two integrated circuit packages are provided. A thin and durable level-one package is achieved in one method involving a molding technique of evenly applying molding compound to an integrated circuit die element. The c... | 01/02/2001 |
| 6151220 | Mounting structure for electronic part Leads 106 provided at an electronic part connectors 110 of an electronic part 100, which are electrically connected to a surface of a substrate 120 are structured in such a manner that they are directly connected to a substrate connector formed at the sur... | 11/21/2000 |
| 6137162 | Chip stack package Disclosed is a chip stack package having a remarkably short interconnection paths between the semiconductor chips and external device, and between the respective semiconductor chips. The chip stack package comprises: at least two semiconductor chips dispo... | 10/24/2000 |
| 6072234 | Stack of equal layer neo-chips containing encapsulated IC chips of different sizes Neo-chips suitable for stacking in 3D multi-layer electronic modules are formed by embedding (encapsulating ) IC chips in epoxy material which provides sufficient layer rigidity after curing. The encapsulated chips are formed by placing separate IC chips,... | 06/06/2000 |
| 6049123 | Ultra high density integrated circuit packages Thin and durable level-one and level-two integrated circuit packages are provided. A thin and durable level-one package is achieved in one method involving a molding technique of evenly applying molding compound to an integrated circuit die element. The c... | 04/11/2000 |
| 6025642 | Ultra high density integrated circuit packages Thin and durable level-one and level-two integrated circuit packages are provided. A thin and durable level-one package is achieved in one method involving a molding technique of evenly applying molding compound to an integrated circuit die element. The c... | 02/15/2000 |
| 5953588 | Stackable layers containing encapsulated IC chips Neo-chips suitable for stacking in 3D multi-layer electronic modules are formed by embedding (encapsulating) IC chips in epoxy material which provides sufficient layer rigidity after curing. The encapsulated chips are formed by placing separate IC chips, ... | 09/14/1999 |
| 5757445 | Single crystal silicon tiles for display panels The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors af... | 05/26/1998 |
| 5583335 | Method of making an eye tracking system having an active matrix display An eye tracking system is disclosed which is comprised of an eye tracking module formed of a display joined to a photodetector array. Each pixel in the display is aligned with a corresponding photodetector. An image generated by the display is projected o... | 12/10/1996 |
| 5566051 | Ultra high density integrated circuit packages method and apparatus An ultra-thin level-one integrated circuit package with improved moisture penetration characteristics manufactured using a transfer molded casing with metallic lamination layers is provided. Additionally, a method and apparatus for providing a multiple-el... | 10/15/1996 |
| 5561591 | Multi-signal rail assembly with impedance control for a three-dimensional high density integrated circuit package An electrically and thermally conductive rail assembly with impedance control for interconnecting individual level-one integrated circuit packages within a three-dimensional high density integrated circuit package, and methods of manufacturing same.... | 10/01/1996 |
| 5550711 | Ultra high density integrated circuit packages Thin and durable level-one and level-two integrated circuit packages are provided. A thin and durable level-one package is achieved in one method involving a molding technique of evenly applying molding compound to an integrated circuit die element. The c... | 08/27/1996 |
| 5543664 | Ultra high density integrated circuit package An ultra-thin level-one integrated circuit package with improved moisture penetration characteristics manufactured using a transfer molded casing with metallic lamination layers is provided. Additionally, a method and apparatus for providing a multiple-el... | 08/06/1996 |
| 5514907 | Apparatus for stacking semiconductor chips A multi-chip memory module comprises multiple standard, surface-mount-type memory chips stacked on top of each other, and a pair of printed circuit boards mounted on opposite sides of the memory chips to electrically interconnect the memory chips. Each pr... | 05/07/1996 |
| 5499124 | Polysilicon transistors formed on an insulation layer which is adjacent to a liquid crystal material The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors af... | 03/12/1996 |
| 5499160 | High density integrated circuit module with snap-on rail assemblies A high density integrated circuit module which includes a plurality of stacked integrated circuit packages, wherein each package includes a casing, an integrated circuit die disposed within the casing and a plurality of electrical interconnect leads exten... | 03/12/1996 |
| 5475920 | Method of assembling ultra high density integrated circuit packages A method and apparatus for providing a multiple-element ultra high density level-two integrated circuit modular package utilizing a temporary manufacturing fixture to achieve a stack of individual thin ultra high density integrated circuit packages.... | 12/19/1995 |
| 5446620 | Ultra high density integrated circuit packages Thin and durable level-one and level-two integrated circuit packages are provided. Moisture-barriers may be provided to upper and/or lower surfaces of the thin level-one package. Additionally, a thin level-one package may be constructed with one or more m... | 08/29/1995 |
| 5420751 | Ultra high density modular integrated circuit package A multiple-element modular package is provided which includes a plurality of level-one packages in horizontal or vertical stacked configuration.... | 05/30/1995 |
| 5377031 | Single crystal silicon tiles for liquid crystal display panels including light shielding layers The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors af... | 12/27/1994 |
| 5376561 | High density electronic circuit modules The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of comp... | 12/27/1994 |
| 5377077 | Ultra high density integrated circuit packages method and apparatus Thin and durable level-one and level-two integrated circuit packages are provided. A plurality of level-one integrated circuit packages may be aligned and securely bound in a stacked configuration by use of a flexible high temperature material, such as si... | 12/27/1994 |
| 5367766 | Ultra high density integrated circuit packages method Thin and durable level-one and level-two integrated circuit packages are provided. A thin and durable level-one package is achieved in one method involving a molding technique of evenly applying molding compound to an integrated circuit die element. The c... | 11/29/1994 |
| 5279029 | Ultra high density integrated circuit packages method An ultra-thin level-one integrated circuit package with improved moisture penetration characteristics manufactured using a transfer molded casing with metallic lamination layers is provided. Additionally, a method and apparatus for providing a multiple-el... | 01/18/1994 |
| 5258325 | Method for manufacturing a semiconductor device using a circuit transfer film The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of high density and complexity. Processes include the formation of complex multi-function circuitry on common module substrates using c... | 11/02/1993 |
| 5256562 | Method for manufacturing a semiconductor device using a circuit transfer film The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body.... | 10/26/1993 |
| 4807105 | Circuit arrangement for producing high DC voltage from medium-frequency AC voltage A circuit arrangement consists of one or several high voltage transformers and rectifier systems usable advantageously for the step-up transformation of medium frequency voltages, for rectification, and smoothing. With the use of the circuit arrangement a... | 02/21/1989 |
| 4670678 | Rotating rectifying device for the excitation of a synchronous machine Rotating rectifying device for excitation of a synchronous machine. The device includes an armature mounted on the machine shaft in a magnetic field with rotating coils connected to rectifier assemblies mounted on the inside flange surface of a support wh... | 06/02/1987 |
| 4614964 | Coaxial semiconductor package A semiconductor package including a first electrically conductive bus and a second electrically conductive bus spaced from and generally surrounding the first bus in approximately concentric relation thereto. A plurality of generally equally angularly spa... | 09/30/1986 |
| 4441150 | High-voltage rectifier unit A high voltage rectifier unit comprises a vessel filled with an electrically insulating fluid and accommodating a transformer having a sectionalized secondary winding, each section 7 of which is provided with a metallic shield and includes two coils 9, a ... | 04/03/1984 |
| 4321664 | Rectifier assembly with heat sink Two U-shaped sheet metal members having legs through which the cooling air passes have bases onto which at least two of the load current carrying diodes are fastened, the connection between the diodes and the sheet metal members forming the heat sink bein... | 03/23/1982 |
| 4320446 | Cockcroft-Walton voltage multiplying circuit for slim hole well logging tool A Cockcroft-Walton voltage multiplying circuit constructed for use in a slim hole well logging tool includes a plurality of capacitor packages having a first capacitor package, adapted to receive an input voltage, and a last capacitor package. A plurality... | 03/16/1982 |
