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| Number | Title | Issue Date |
| 7378726 | Stacked packages with interconnecting pins A system may include a first integrated circuit package including a first integrated circuit die and a first integrated circuit package substrate defining a first plurality of openings, a second integrated circuit package including a second integrated circuit die an... | 05/27/2008 |
| 7375418 | Interposer stacking system and method The present invention provides a system and method for selectively stacking and interconnecting leaded packaged integrated circuit devices with connections between the feet of leads of an upper IC element and the upper shoulder of leads of a lower IC element while t... | 05/20/2008 |
| 7375420 | Large area transducer array A large area transducer array comprising a substrate having a front side and a backside, a plurality of transducers disposed on the front side of the substrate and patterned in the form of a two-dimensional transducer array in the X-Y plane, a plurality of connector... | 05/20/2008 |
| 7372140 | Memory module with different types of multi chip packages In an embodiment, a memory module includes a first group of multi chip packages, including one or more non-volatile memories, and a second group of multi chip packages, including one or more volatile memories, wherein the first and second groups of multi chip packag... | 05/13/2008 |
| 7355273 | Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. Th... | 04/08/2008 |
| 7355271 | Flexible assembly of stacked chips A three-dimensional package consisting of a plurality of folded integrated circuit chips (100, 110, 120) is described wherein at least one chip provides interconnect pathways for electrical connection to additional chips of the stack, and at least one chip ( | 04/08/2008 |
| 7335974 | Multi stack packaging chip and method of manufacturing the same A multi stack packaging chip and a method of manufacturing the chip are provided. The method includes forming at least one second circuit element on a first wafer; forming a second wafer having a cavity and a one third circuit element formed opposite to the cavity; ... | 02/26/2008 |
| 7309913 | Stacked semiconductor packages A stacked semiconductor package includes a substrate and a first semiconductor device on the substrate. An interposer is supported above the first semiconductor device opposite the substrate. The interposer is electrically connected to the substrate. A second semico... | 12/18/2007 |
| 7304375 | Castellation wafer level packaging of integrated circuit chips Systems and methods for packaging integrated circuit chips in castellation wafer level packaging are provided. The active circuit areas of the chips are coupled to castellation blocks and, depending on the embodiment, input/output pads. The castellation blocks and i... | 12/04/2007 |
| 7301242 | Programmable system in package Some embodiments of the invention provide a programmable system in package (“PSiP”). The PSiP includes a single IC housing, a substrate and several IC's that are arranged within the single IC housing. At least one of the IC's is a configurable IC. In some embodi... | 11/27/2007 |
| 7298037 | Stacked integrated circuit package-in-package system with recessed spacer A stacked integrated circuit package-in-package system is provided forming a first integrated circuit spacer package including a mold compound with a recess provided therein, stacking the first integrated circuit spacer package on an integrated circuit die on a subs... | 11/20/2007 |
| 7298038 | Integrated circuit package system including die stacking An integrated circuit package system including a leadframe having an aperture provided therein and an integrated circuit package mounted to the leadframe over or under the aperture. A die is mounted within the aperture to the integrated circuit package and the die i... | 11/20/2007 |
| 7288835 | Integrated circuit package-in-package system An integrated circuit package-in-package system is provided forming a first integrated circuit package having a first interface, stacking a second integrated circuit package having a second interface above the first integrated circuit package, fitting the first inte... | 10/30/2007 |
| 7282791 | Stacked semiconductor device and semiconductor memory module A semiconductor device module includes a wiring substrate, a plurality of stacked semiconductor devices and a damping impedance circuit. The plurality of stacked semiconductor devices are provided on the wiring substrate and connected with a signal in a stubless man... | 10/16/2007 |
| 7265441 | Stackable single package and stacked multi-chip assembly A stackable packaged chip includes a substrate with a conductive wiring formed therein or thereon. The substrate further includes a plurality of substrate contact pads arranged around a periphery portion of the substrate. A chip mounted on the substrate including co... | 09/04/2007 |
| 7253530 | Method for producing chip stacks A plurality of interconnect layers are produced on a top side of one or two semiconductor chips, and are mutually isolated from one another in each case by insulation layers that are patterned in such a way that an interconnect layer applied as bridge makes contact ... | 08/07/2007 |
| 7247933 | Thin multiple semiconductor die package A method and apparatus for forming a multiple semiconductor die assembly (200, 300, 400) having a thin profile are presented. The semiconductor die assembly (200, 300, 400) comprises a plurality of die packages (100), with each die package (1... | 07/24/2007 |
| 7235870 | Microelectronic multi-chip module A method of fabricating a microelectronic multi-chip module comprises: providing a cavity down ball grid array having a die and solder balls on a die side thereof; providing a package including at least one die thereon on a die side thereof; stacking the package ont... | 06/26/2007 |
| 7187068 | Methods and apparatuses for providing stacked-die devices Methods and apparatuses to provide a stacked-die device comprised of stacked sub-packages. For one embodiment of the invention, each sub-package has interconnections formed on the die-side of the substrate for interconnecting to another sub-package. The dies and ass... | 03/06/2007 |
| 7157787 | Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices A method of vertically stacking wafers is provided to form three-dimensional (3D) wafer stack. Such method comprising: selectively depositing a plurality of metallic lines on opposing surfaces of adjacent wafers; bonding the adjacent wafers, via the metallic lines, ... | 01/02/2007 |
| 7119425 | Stacked multi-chip semiconductor package improving connection reliability of stacked chips The chip package includes a first and second semiconductor chip. The first semiconductor chip has a first connection structure that electrically connects to a bond pad on a first surface of the first semiconductor chip. The second semiconductor chip has a second con... | 10/10/2006 |
| 7119429 | 3-D stackable semiconductor package A 3-D stackable semiconductor package includes a first component and a second component. The semiconductor package is formed by stacking the back of the first component and the back of the second component together. The metal pads on the surfaces of the first compon... | 10/10/2006 |
| 6642545 | Semiconductor light emitting device A semiconductor light emitting device including a first semiconductor light emitting chip in which a first semiconductor light emitting layer is formed on a first substrate, a second semiconductor light emitting chip in which a second semiconductor light ... | 11/04/2003 |
| 6639251 | Light emitting element array module and printer head and micro-display using the same A light emitting element array module includes a board; a silicon base having a first side, a second side opposite to the first side and adhered to the board, a third side having a first angle with the second side, a fourth side substantially in parallel ... | 10/28/2003 |
| 6636185 | Head-mounted display system A head mounted display system including a high resolution active matrix display which reduces center of gravity offset in a compact design. The active matrix display can be either a liquid crystal display or a light emitting display.... | 10/21/2003 |
| 6635987 | High power white LED lamp structure using unique phosphor application for LED lighting products Phosphor application for high power LED lamps for use in lighting products includes a lensing structure and a phosphor layer applied to at least one side of the lensing structure. The lensing structure is positioned in the LED lamp so that emitted light f... | 10/21/2003 |
| 6633120 | LED lamps A high power LED lamp has a GaN chip placed over an AlGaInP chip. A reflector is placed between the two chips. Each of the chips has trenches diverting light for output. The chip pair can be arranged to produce white light having a spectral distribution i... | 10/14/2003 |
| 6627953 | High density electronic circuit modules The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of comp... | 09/30/2003 |
| 6593978 | Method for manufacturing active matrix liquid crystal displays The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors af... | 07/15/2003 |
| 6563139 | Package structure of full color LED form by overlap cascaded die bonding The present invention discloses a light source of full color LED (light emitted diode) by using die bond and packaging technology. A first mono-color LED chip with reflective metal on the bottom and transparent metal-oxide on the top of the chip is bonded... | 05/13/2003 |
| 6525464 | Stacked light-mixing LED A stacked light-mixing LED includes a main body, more than one connecting parts, a first chip, and a second chip. Two lights with different wavelength in the visible light spectrum area, such as the yellow light and the blue light, or the green light and ... | 02/25/2003 |
| 6521940 | High density electronic circuit modules The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of comp... | 02/18/2003 |
| 6486929 | Bonded layer semiconductor device The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body. TFT's activate display electrodes formed adjacent the transistors af... | 11/26/2002 |
| 6424020 | High Density electronic circuit modules The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of comp... | 07/23/2002 |
| 6414783 | Method of transferring semiconductors A display panel is formed using essentially single crystal thin-film material that is transferred to substrates for display fabrication. The transfer includes the step of transferring the semiconductor regions onto a stretchable substrate. The resulting c... | 07/02/2002 |
| 6403985 | Method of making light emitting diode displays Light emitting diodes (LEDs) and LED bars and LED arrays formed of semiconductive material, such as III-V, and particularly AlGaAs/CaAs material, are formed in very thin structures using organometallic vapor deposition (OMCVD). Semiconductor p-n junctions... | 06/11/2002 |
| 6320568 | Control system for display panels A control apparatus for an active matrix liquid crystal display device is fabricated with the active matrix as a single integrated SOI circuit. The control apparatus and the active matrix are lifted from a silicon substrate and transferred to a glass subs... | 11/20/2001 |
| 6317175 | Single crystal silicon arrayed devices with optical shield between transistor and substrate A display panel is formed using a single crystal thin-film transistors that are transferred to substrates for display fabrication. Pixel arrays form light valves or switches that can be fabricated with control electronics in the thin-film material prior t... | 11/13/2001 |
| 6232136 | Method of transferring semiconductors A display panel is formed using essentially single crystal thin-film material that is transferred to substrates for display fabrication. The transfer includes the step of transferring the semiconductor regions onto a stretchable substrate. The resulting c... | 05/15/2001 |
| 6143582 | High density electronic circuit modules The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of comp... | 11/07/2000 |
