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| Number | Title | Issue Date |
| 7435997 | Component comprising a large number of light-emitting-diode chips A device (1) with a number of light emitting diode chips (5) in a reflector (3) is formed in such a way that the direct line of sight between the light emitting diode chips (5) is interrupted by a partition (11). This improves the ... | 10/14/2008 |
| 7427810 | Semiconductor device including semiconductor element mounted on another semiconductor element A semiconductor device including a first semiconductor element mounted on a first surface of second semiconductor element, wherein solder balls are formed on the first surface of the second semiconductor element such that the first surface includes an area without s... | 09/23/2008 |
| 7394109 | LED lighting device An LED lighting device comprises a seat with a conductor. A light emitting diode is disposed on the conductor of the seat, and has an upper positive conductive pad, a lower negative conductive pad, and an insulating pad disposed between the positive and negative con... | 07/01/2008 |
| 7358600 | Interposer for interconnecting components in a memory card A circuit module for use in a memory card. The circuit module comprises a base substrate including a plurality of contacts. Attached to the base substrate is a memory die, while attached to the memory die is an interposer having a plurality of terminals electrically... | 04/15/2008 |
| 7358579 | Reducing the actuation voltage of microelectromechanical system switches A microelectromechanical system switch may include a relatively stiff cantilevered beam coupled, on its free end, to a more compliant or flexible extension. A contact may be positioned at the free end of the cantilevered beam. The extension reduces the actuation vol... | 04/15/2008 |
| 7354785 | Electroluminescent light emitting device An electroluminescent device having a light emitting layer (25) containing phosphor particles (31, 32), wherein the phosphor particles protrude from the light emitting layer to cause the surrounding layers to conform to the protrusions, thus increasing... | 04/08/2008 |
| 7323769 | High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package An integrated circuit package is disclosed. The package comprises a plurality of leads, each lead having a first face and a second face opposite to the first face. The package also comprises a die pad having a first face and a second face opposite to the first face.... | 01/29/2008 |
| 7301174 | Light emitting diode strip lamp LED strip lamp comprising a light emitting diode and extruded electrodes characterized in that a shaped electrode of that LED is fixed directly to a diode connecting part on a current supplying conductor, by die bonding or other fixing means, an insulating painted l... | 11/27/2007 |
| 7042089 | Group III nitride compound semiconductor device An object of the present invention is to provide a large-size light-emitting device from which uniform light emission can be obtained. That is, in the present invention, in a device having an outermost diameter of not smaller than 700 μm, a distance from an ... | 05/09/2006 |
| 6700136 | Light emitting device package A light emitting device (LED) package comprises: a thermally conductive layer; an electrically insulating layer having openings extending therethrough; LEDs situated within the openings of the electrically insulating layer and including contact pads; and ... | 03/02/2004 |
| 6696784 | Light emitting diode module A compact LED module capable of preventing electrostatic destruction is provided. This LED module has first, second, and third terminals; first and second light emitting diodes connected between the first and second terminals and also connected in inverse... | 02/24/2004 |
| 6692136 | LED/phosphor-LED hybrid lighting systems A hybrid lighting system for producing white light including at least one light emitting diode and phosphor-light emitting diode. The hybrid lighting system exhibits improved performance over conventional LED lighting systems that use LEDs or phosphor-LED... | 02/17/2004 |
| 6686216 | Electro-optical transceiver system with controlled lateral leakage and method of making it An electro-optical transceiver system with controlled lateral light leakage and a method of making such a system includes a plurality of emitter devices and detector devices including at least one of each, arranged in a planar array for transmitting and r... | 02/03/2004 |
| 6683416 | Device transfer method, and device array method and image display unit production method using the same A method of transferring multiple devices arrayed on a first substrate to a second substrate is provided. The devices on the first substrate are covered with a release agent, and a portion of the release agent, positioned on a device to be transferred is ... | 01/27/2004 |
| 6682207 | Green phosphor converted light emitting diode A light emitting device comprises a light emitting diode that emits primary light and a SrGa2 S4 :Eu2+ phosphor material capable of absorbing at least a portion of the primary light and emitting secondary light. The second... | 01/27/2004 |
| 6673642 | Electro-optical transceiver system with controlled lateral leakage and method of making it An electro-optical transceiver system with controlled lateral light leakage and a method of making such a system includes a plurality of emitter devices and detector devices including at least one of each, arranged in a planar array for transmitting and r... | 01/06/2004 |
| 6670751 | Light emitting diode, light emitting device using the same, and fabrication processes therefor Disclosed is a LED which can be mounted at high density on a large area display. Having a hole for heat sink in the ceramic substrate, the LED is superior in heat sink property. In order to fabricate the light emitting device, first, a secondary ceramic s... | 12/30/2003 |
| 6667497 | LED package A LED package is comprised of a flat panel base and three LED dies. The flat panel base is composed of a first golden film area, a second golden film area, a third golden film area, a fourth golden film area, a first connection area, and a second connecti... | 12/23/2003 |
| 6665170 | Light emitting diode illumination system A light emitting diode illumination system comprises a printed circuit board with score lines allowing a user to break the board into segments. The segments are a plurality of printed circuit boards provided with electrical elements. The electrical elemen... | 12/16/2003 |
| 6656757 | Electro-optical transceiver system with controlled lateral leakage and method of making it An electro-optical transceiver system with controlled lateral light leakage and a method of making such a system includes a plurality of emitter devices and detector devices including at least one of each, arranged in a planar array for transmitting and r... | 12/02/2003 |
| 6657235 | Optical excitation/detection device using discrete photoemitter devices The disclosure is directed toward an optical excitation/detection device that includes an arrayed plurality of photodetectors and discrete photoemitters, as well as a method for making such a device. A CMOS fabricated photodetector array includes an array... | 12/02/2003 |
| 6657236 | Enhanced light extraction in LEDs through the use of internal and external optical elements This invention describes new LEDs having light extraction structures on or within the LED to increase its efficiency. The new light extraction structures provide surfaces for reflecting, refracting or scattering light into directions that are more favorab... | 12/02/2003 |
| 6657382 | Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture A light emitting device and display apparatus using a plurality of light emitting devices can drastically reduce contrast loss due to light from an external source. The light emitting device has (a) light emitting chip(s) and a first layer covering the li... | 12/02/2003 |
| 6652123 | Light emitting diode display having heat sinking circuit rails An LED display panel are mounted with an array of LEDs on a number of metallic partitions, serving as common electrodes foil a line of LEDs as well as heat sinks. Another number of rails serve as common electrodes for another line of LEDs. The metallic pa... | 11/25/2003 |
| 6650048 | Ventilated light emitting diode matrix panel LEDs of a light matrix display are mounted between two metal frames. Each frame has air ducts to circulate air around the LEDs, thereby removing the heat generated in the LEDs and allowing higher intensity light to be emitted.... | 11/18/2003 |
| 6649941 | Method for manufacturing semiconductor device using group III nitride compound A flip-chip-type device is formed from a plurality of flip-chip semiconductor device units integrated together on a common substrate having a Group III nitride compound semiconductor layer. A sealing resin is laminated on a surface of the common substrate... | 11/18/2003 |
| 6638780 | Method for manufacturing light emitting diode devices A plurality of LEDs are mounted on a substrate aggregation, a transparent layer is formed on the substrate aggregation. The transparent layer between adjacent divisions is removed to form an individual transparent layer and to form a groove around the ind... | 10/28/2003 |
| 6639251 | Light emitting element array module and printer head and micro-display using the same A light emitting element array module includes a board; a silicon base having a first side, a second side opposite to the first side and adhered to the board, a third side having a first angle with the second side, a fourth side substantially in parallel ... | 10/28/2003 |
| 6636003 | Apparatus and method for adjusting the color temperature of white semiconduct or light emitters An LED arrangement which produces a color temperature adjustable white light. The LED arrangement includes one or more white LEDs and a first drive circuit operable to supply a first drive current to the one or more white LEDs such that a white light is o... | 10/21/2003 |
| 6635987 | High power white LED lamp structure using unique phosphor application for LED lighting products Phosphor application for high power LED lamps for use in lighting products includes a lensing structure and a phosphor layer applied to at least one side of the lensing structure. The lensing structure is positioned in the LED lamp so that emitted light f... | 10/21/2003 |
| 6634771 | Semiconductor light source using a primary and secondary heat sink combination A semiconductor light source for illuminating a physical space has been invented. In various embodiments of the invention, a semiconductor such as and LED chip, laser chip, LED chip array, laser array, an array of chips, or a VCSEL chip is mounted on a he... | 10/21/2003 |
| 6635902 | Serial connection structure of light emitting diode chip A light emitting diode (LED) device includes a substrate having a major surface on which a number of LED chips are formed and arranged in a two-dimensional array. The LED chips have a p-type semiconductor and an n-type semiconductor. The n-type semiconduc... | 10/21/2003 |
| 6634770 | Light source using semiconductor devices mounted on a heat sink A semiconductor light source for illuminating a physical space has been invented. In various embodiments of the invention, a semiconductor such as and LED chip, laser chip, LED chip array, laser array, an array of chips, or a VCSEL chip is mounted on a he... | 10/21/2003 |
| 6633120 | LED lamps A high power LED lamp has a GaN chip placed over an AlGaInP chip. A reflector is placed between the two chips. Each of the chips has trenches diverting light for output. The chip pair can be arranged to produce white light having a spectral distribution i... | 10/14/2003 |
| 6621223 | Package socket and package legs structure for led and manufacturing of the same The present invention discloses a structure of package socket and package legs for three-primary-color LED and the manufacturing method of this structure. One of the leg forms a die bonding seat and a common negative bonding pad, the other three legs form... | 09/16/2003 |
| 6617786 | Electronic device encapsulated directly on a substrate A method and apparatus for encapsulating one or more small electronic devices, including for example light-emitting diodes, mounted directly on a substrate by providing a three-dimensional formation on the substrate adjacent to the device and injection mo... | 09/09/2003 |
| 6613610 | Image display unit and method of producing image display unit An image display unit and a method of producing the image display unit, wherein the image display unit includes an array of a plurality of light emitting devices for displaying an image, and wherein the method of producing the image display unit employs, ... | 09/02/2003 |
| 6612890 | Method and system for manufacturing electronic packaging units A method and system for fabricating electronic packaging units which include a molded body and a plurality of electrically conductive leads protruding therefrom. The packaging units are made by overlaying lead frames having leads and then depositing moldi... | 09/02/2003 |
| 6611000 | Lighting device A lighting device includes: a plurality of LEDs arranged in an at least two-dimensionally dispersed manner; a transparent resin layer that covers the plurality of LEDs in an integrated form; a photo-detecting unit that detects an intensity of light emitte... | 08/26/2003 |
| 6599769 | Process for mounting device and optical transmission apparatus An optical transmission apparatus applicable to an optical interconnection apparatus for interconnection between stacked IC chips, and a process of mounting elements for manufacturing such an apparatus are disclosed. For example, light emitting elements (... | 07/29/2003 |
