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A kissing shield comprised of a thin, flexible membrane and a frame or holder.
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| Number | Title | Issue Date |
| 7193307 | Multi-layer FET array and method of fabricating A power array includes a plurality of FET power assemblies and each FET power assembly has at least one field effect transistor mounted to a ciruit board. The circuit boards are arranged atop each other. A power supply pin extends through the circuit boards and is c... | 03/20/2007 |
| 7061094 | Multilayer printed circuit board including first and second signal traces and a first ground trace A multilayer printed circuit board (PCB) includes a substrate; a ground layer having edges which define a gap portion, the ground layer being provided on a bottom face of the substrate; and at least two signal traces and provided on a top face of the substrate so as... | 06/13/2006 |
| 6492720 | Flat-type semiconductor stack In a flat-type semiconductor stack formed by alternately stacking flat-type semiconductor devices (1) and heat-radiating elements (2), a projecting pin (7) is provided on a contact surface of at least one flat-type semiconductor device (1) while a positio... | 12/10/2002 |
| 5309011 | Wafer scale or full wafer memory system, packaging method thereof, and wafer processing method employed therein To achieve higher packaging density and one wafer level for a full-sized wafer memory, or wafer-scale integration memory system, the wafers are vertically stacked with each other at a predetermined interval. A packaging technique is improved in such a way... | 05/03/1994 |
| 5191224 | Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein To achieve higher packaging density and one wafer level for a full-sized wafer memory, or wafer-scale integration memory system, the wafers are vertically stacked with each other at a predetermined interval. A packaging technique is improved in such a way... | 03/02/1993 |
| 4126883 | Pressure-mounted semiconductive structure A semiconductive structure comprised of a semiconductive element, feed electrodes and other related components thereof, each provided with an aperture aligned with the aperture of the other elements and a single clamping bolt means positioned through the ... | 11/21/1978 |
