Bizarre Patents
A method to tenderize meat with an explosive shockwave.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7432593 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 10/07/2008 |
| 7427810 | Semiconductor device including semiconductor element mounted on another semiconductor element A semiconductor device including a first semiconductor element mounted on a first surface of second semiconductor element, wherein solder balls are formed on the first surface of the second semiconductor element such that the first surface includes an area without s... | 09/23/2008 |
| 7414299 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 08/19/2008 |
| 7382000 | Semiconductor device A semiconductor device is provided which comprises a connecting lead 4 mounted between a MOS-FET 1 and a regulatory IC 2 on a support plate 3. Connecting lead 4 has a thermally radiative and electrically conductive substrate 6 | 06/03/2008 |
| 7342262 | Split-gate power module for suppressing oscillation therein The invention involves a method of packaging and interconnecting four power transistor dies to operate at a first frequency without oscillation at a second frequency higher than the first frequency but lower than a cutoff frequency of the transistors. The dies are m... | 03/11/2008 |
| 7312473 | Display device and electronic device using the same In display devices using thin film transistors, a graphoepitaxy is used for a semiconductor layer crystallizing process. Thus, a display device in which crystallinity is improved, a variation in characteristics of thin film transistors is reduced, display nonuniform... | 12/25/2007 |
| 7227259 | Low-inductance circuit arrangement for power semiconductor modules A circuit arrangement for a power semiconductor module provides low parasitic inductances and low loss. An electrically insulating substrate supports metallic ribbon connectors which in turn power attached semiconductor components. DC port conducts are positioned in... | 06/05/2007 |
| 6703699 | Semiconductor device The present invention has an object to provide a more compact semiconductor device that can be assembled with reduced parts and tasks. The semiconductor device includes a housing having a top and bottom surfaces. Surrounded within the housing is an insula... | 03/09/2004 |
| 6700194 | Semiconductor device A semiconductor device which satisfies both the requirements for radiation performance and for miniaturization while having a semiconductor element for a heavy current. The semiconductor device has an IGBT element (1) and diode element (2) which are provi... | 03/02/2004 |
| 6700073 | Semiconductor device A silicone resin for sealing a semiconductor chip. A cured silicone resin, which is obtained by curing the silicone resin at a given temperature, has a percent elongation, after fracture, measured at a room temperature, not less than 4% of a penetration n... | 03/02/2004 |
| 6690087 | Power semiconductor module ceramic substrate with upper and lower plates attached to a metal base A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed integrally. The ceramic substrate of the module has a struct... | 02/10/2004 |
| 6670674 | Transistor and power amplifier with improved bandwidth The invention relates to an LDMOS transistor including a gate, source and drain, and an earth plane located under the gate, source and drain. According to the invention, the earth plane is given such an extent in the lateral direction of the transistor th... | 12/30/2003 |
| 6664629 | Semiconductor device A plurality of semiconductor elements are arranged on the top surface of a heat conductive base plate. A resin case is attached to the heat conductive base plate so as to encompass the plurality of semiconductor elements. A metal member including a bridge... | 12/16/2003 |
| 6654249 | Circuit arrangement A circuit arrangement includes a base body, with one or more substrates, an intermediate-circuit board, a compression device and a driver circuit. Each substrate includes a positive-pole conductive strip, a negative-pole conductive strip, and auxiliary co... | 11/25/2003 |
| 6646344 | Composite material, and manufacturing method and uses of same Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied. This compos... | 11/11/2003 |
| 6630734 | Composite material, and manufacturing method and uses of same Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied. This compos... | 10/07/2003 |
| 6625027 | Method for increasing the dielectric strength of isolated base integrated circuits used with variable frequency drives A heat sink structure increasing the dielectric strength of isolation for power integrated circuits is formed from a common layer on which laterally spaced isolated layers for each individual integrated circuit are mounted. At least the isolated layers ar... | 09/23/2003 |
| 6620706 | Condensed memory matrix A condensed memory matrix is fabricated by conductively connecting the attachment bumps of a substrate with the attachment bumps of a wafer of DRAM chips and physically bonding the juxtaposed surfaces of the substrate and the wafer with a dielectric curab... | 09/16/2003 |
| 6617679 | Semiconductor package for multiple high power transistors There is provided by this invention a novel and unique configuration for combining multiple die such as metal oxide field effect transistors (MOSFETS) in high power high frequency applications to prevent internal oscillation. A first embodiment of this in... | 09/09/2003 |
| 6611056 | Composite material, and manufacturing method and uses of same Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied. This compos... | 08/26/2003 |
| 6597585 | Power semiconductor module A power semiconductor module includes a plastic housing, a plurality of connection elements for external main connections and control connections, and at least one ceramic substrate which is provided at least on its top side with a structured metalization... | 07/22/2003 |
| 6577032 | Rectifier unit of vehicle AC generator A rectifier unit of a vehicle AC generator is comprised of a plurality of metal cases, a plurality of pairs of first and second semiconductor chips and a plurality of pairs of first and second lead wires. The first lead wires are respectively connected to... | 06/10/2003 |
| 6570250 | Power conditioning substrate stiffener Utilization of the "dead space" previously occupied by a metal stiffener in an integrated circuit package as a location for power conditioning and converting mechanisms such as de-coupling capacitors and planar transformers.... | 05/27/2003 |
| 6566750 | Semiconductor module A plurality of semiconductor chips are provided on a base substrate. A drain region of the respective semiconductor chip is directly connected to the base substrate. A source electrode is formed in parallel with the arranging direction of the plurality of... | 05/20/2003 |
| 6559534 | Thermal capacity for electronic component operating in long pulses A thermal capacitor component which includes, on a substrate, a stack of different layers defined in the form of a mesa terminating at its upper part in an electrical contact layer, which layer is coated with an electrically and thermally conducting layer... | 05/06/2003 |
| 6552429 | Power switching semiconductor device with suppressed oscillation A wiring pattern (26) or (27) and conductor wires (W1, W2) or (W3, W4) not relaying a wiring pattern (22) or (23) fed with an emitter current connect emitter electrodes of a plurality of IGBTs (3) connected in parallel with each other. Thus, oscillation a... | 04/22/2003 |
| 6548882 | Power transistor cell A power transistor cell includes an air bridge and a plurality of individual transistors. Each of the plurality of individual transistors has at least one separate connection contact. Each of the at least one separate connection contact of the plurality o... | 04/15/2003 |
| 6541851 | Lead frame for a semiconductor device In a semiconductor device, a lead frame is adhered to a base substrate for heat dissipation via an insulating layer, and an outward guided terminal portion is formed by perpendicularly upwardly bending an end of the lead frame after the mounting of one or... | 04/01/2003 |
| 6521992 | Semiconductor apparatus An electrode wiring structure is disclosed which realizes a semiconductor apparatus as a power semiconductor module with the current path set as shortest as possible and uniformly. The semiconductor apparatus includes: a plurality of semiconductor devices... | 02/18/2003 |
| 6521983 | Semiconductor device for electric power A semiconductor device for electric power comprising: a resin case; and a main circuit terminally inserted in the resin case, which main circuit terminal has an end on an outwardly connecting side, wherein the end is bent so as to be in parallel with a re... | 02/18/2003 |
| 6522544 | Power module A power module includes a box-shaped smoothing capacitor (20) for smoothing a DC supply voltage to be externally applied to a power semiconductor device (5). The smoothing capacitor (20) is in contact with a side surface of a case frame (6) including a si... | 02/18/2003 |
| 6507108 | Power semiconductor module The invention relates to a power semiconductor module (10) having a baseplate (1) on which at least one substrate (13) is arranged which is fitted with power semiconductor chips (11, 12) and can be pressed via pressure elements and contact cords (17) agai... | 01/14/2003 |
| 6501172 | Power module In a powder module (111), a free-wheeling diode (1A), an IGBH (1B), and a capacitor (20) for smoothing direct current are disposed directly on a surface (2BS) of a conductive heat sink (2B) with through holes (2BH). The rear electrodes of the free-wheelin... | 12/31/2002 |
| 6501167 | Low inductance power wiring structure and semiconductor device A power wiring structure realizes low inductance and is applicable to a semiconductor device. The power wiring structure employs two switching elements that are connected in series and are complementarily turned on and off. Ends of the switching elements ... | 12/31/2002 |
| 6486548 | Semiconductor module and power converting apparatus using the module A semiconductor module in which a lead electrode is integrally formed with or pressed into resin separated from a resin case, and a connector securing a pad for bonding a metal wire to the lead electrode is bonded to a substrate with a power semiconductor... | 11/26/2002 |
| 6465728 | Spring clip for electronic device and heat sink assembly An electronic device/heat sink assembly having at least first and second heat generating electronic devices, a heat sink member, a resilient integral spring clip, the clip including a base member and first and second oppositely facing resilient leg member... | 10/15/2002 |
| 6459146 | Semiconductor apparatus An electrode wiring structure is disclosed which realizes a smaller semiconductor apparatus as a power semiconductor module with the current path set as shortest as possible. The semiconductor apparatus includes: a plurality of semiconductor devices mount... | 10/01/2002 |
| 6452261 | Flat semiconductor device and power converter employing the same Control electrode wirings which are led out from control electrodes over a number of chips built in a flat package and insulating members which are provided in order to insulate the control electrode wirings from main electrode wirings are also given func... | 09/17/2002 |
| 6448645 | Semiconductor device A semiconductor device which improves heat radiation performance and realizes size reduction and enables heat to be radiated swiftly from both of the principal surfaces of a semiconductor chip even when the semiconductor chip has a construction vulnerable... | 09/10/2002 |
| 6445068 | Semiconductor module A plurality of MOS transistors are arranged on the top surface of a conductor substrate which is a drain electrode. The drain contact of each MOS transistor is connected to the conductor substrate. The source contact of each MOS transistor is connected to... | 09/03/2002 |
