Class 257/E25.015 - Devices being arranged next and on each other, i.e., mixed assemblies (EPO)

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: This subclass is indented under subclass E25.014. This subclass
No. of patents: 29
Last issue date: 09/23/2008

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Number	Title	Issue Date
7427810	Semiconductor device including semiconductor element mounted on another semiconductor element A semiconductor device including a first semiconductor element mounted on a first surface of second semiconductor element, wherein solder balls are formed on the first surface of the second semiconductor element such that the first surface includes an area without s...	09/23/2008
7332808	Semiconductor module and method of manufacturing the same A semiconductor module according to the invention includes: an island formed of a conductive material; a plurality of leads disposed in vicinity of the island; a resin sealing body which is mounted on the island and disposed such that a back surface of a circuit boa...	02/19/2008
7227246	Matching circuits on optoelectronic devices An apparatus comprises a first substrate and a second substrate. The first substrate includes an optoelectronic device and a matching circuit. The second substrate includes a driver circuit. A frequency response of the optoelectronic device is changed by the matchin...	06/05/2007
7227260	Method and system for a pad structure for use with a semiconductor package Systems and methods for substrate layers used in attaching devices to a semiconductor package are disclosed. A novel pad structure may be employed on a substrate layer which has pads, each pad having a common electrical potential. Multiple pad openings may be employ...	06/05/2007
7215000	Selectively encased surface metal structures in a semiconductor device The present invention provides, in one embodiment, An integrated circuit device (100). The integrated circuit device (100) comprises a circuit feature (105) located over a semiconductor substrate (110) and an insulating layer (115)...	05/08/2007
6697257	Power semiconductor module Disclosed in a power semiconductor module which includes a stack of carrier substrates, disposed one above the other in multiple layers and provided with at least one conductor track on at least one main surface, in which at least one electronic semicondu...	02/24/2004
6642576	Power semiconductor device having layered structure of power semiconductor elements and terminal members An IGBT (121) and a diode (131) are joined onto an element arrangement portion (111a) of a first terminal member (111) and an element arrangement portion (112a) of a second terminal member (112) is joined onto the IGBT (121) and the diode (131). Further, ...	11/04/2003
6621703	Automotive bridge rectifier assembly with thermal protection A rectifier assembly employs a set of diodes to rectify alternating current from an alternator to direct current for use by the electrical system of an automobile. The rectifier includes a plurality of thermal safety disconnects coupled along circuit path...	09/16/2003
6528911	Rectifier assembly for automotive alternators A rectifier bridge assembly is located in the housing of a multi-phase alternating current generator to rectify AC current produced by the alternator into DC current. The rectifier assembly includes at least six semiconductor diodes. The rectifier assembl...	03/04/2003
6462382	MOS type semiconductor apparatus A MOS type semiconductor apparatus is provided which includes a main MOS type semiconductor device, an internal control circuit connected between a control input terminal (G) and a control input port (g) of the main MOS type semiconductor device, and a pr...	10/08/2002
6388316	Semiconductor module Providing a semiconductor module comprising a plurality of semiconductor elements, in which wiring lengths of the semiconductor elements juxtaposed to each other are approximately the same. A semiconductor module comprising a lower layer substrate and an ...	05/14/2002
6327128	Automotive bridge rectifier assembly with thermal protection A rectifier assembly employs a set of diodes to rectify alternating current from an alternator to direct current for use by the electrical system of an automobile. The rectifier includes a plurality of thermal safety disconnects coupled along circuit path...	12/04/2001
6285076	Press-connection semiconductor device and press-connection semiconductor assembly The semiconductor device has two sets of semiconductor units 13, having a plurality of semiconductor pellets 11 arranged and connected in parallel on the same plane, which are connected in series with a common electrode plate 14 intervened between the sem...	09/04/2001
6278179	Power electronic device The device comprises a conductive substrate on which rests a first plane arrangement of semiconductor circuits formed by diodes and IGBT having connecting terminals. The device comprises at least one second plane arrangement of semiconductor circuits, two...	08/21/2001
6229180	MOS type semiconductor apparatus A MOS type semiconductor apparatus is provided which includes a main MOS type semiconductor device, an internal control circuit connected between a control input terminal (G) and a control input port (g) of the main MOS type semiconductor device, and a pr...	05/08/2001
6198615	Voltage unit bus clip A telecommunications protection unit includes a voltage unit having an electrically insulating base configured to house a diode module assembly and a voltage limiting cell therein. The voltage limiting cell and diode module assembly are retained within th...	03/06/2001
6034862	Diode module assembly with bifurcated terminals A telecommunications protection unit includes a voltage unit having an electrically insulating base configured to house a diode module assembly and a voltage limiting cell therein. The voltage limiting cell and diode module assembly are retained within th...	03/07/2000
5892676	Rectifier bridges assembly having improved heat dispersing characteristics and an arcing-free design A rectifier bridges assembly for use with an automotive alternator includes a base plate conductively mounted to a ground and providing a negative heat sink, and an overlying finned positive heat sink structure having a surface area at least twice that of...	04/06/1999
5859468	Micro semiconductor bridge rectifier and method of manufacturing the same A micro semiconductor bridge rectifier comprises a first and a second diode chips. The first diode chip comprises an N-type substrate on which two P-type regions are formed. The second diode chip comprises a P-type substrate on which two N-type regions ar...	01/12/1999
5631806	Lead with slits for reducing solder overflow and eliminating air gaps in the execution of solder joints The portion of the lead which is soldered between electrical components in a circuit module includes one or more radially extending slits. Once heated, the fluid solder is drawn into the slits by capillary action. Trapped air escapes, eliminating air pock...	05/20/1997
5574312	Low-inductance power semiconductor module In the case of a power semiconductor module (1) according to the invention, substrates (8) having a power semiconductor assembly (2) are fitted on both sides of a heat sink (3). The power semiconductor assemblies (2) are made contact with by a stack of co...	11/12/1996
5532512	Direct stacked and flip chip power semiconductor device structures Power semiconductor device structures and assemblies with improved heat dissipation characteristics and low impedance interconnections include a thermally-conductive dielectric layer, such as diamondlike carbon (DLC) overlying at least portions of the act...	07/02/1996
5446314	Low profile metal-ceramic-metal packaging A heat-conductive honeycomb ceramic spacer having an array of apertures for facilitating assembly of a semiconductor device including a plurality of semiconductor stacks using a low-profile contact comprising a foil with raised portions corresponding to t...	08/29/1995
5218231	Mold-type semiconductor device A semiconductor device comprises a semiconductor element having a PN junction, a first connector having a first connection surface rising in an embossing manner, connected to a first surface of the semiconductor element via a solder layer at the first con...	06/08/1993
4613892	Laminated semiconductor assembly The problem of compensating for dimensional differences occuring in the length of adjacent stacks of semiconductors or other electronic components in an electrical assembly of such components is avoided through the use of a plurality of housing sections o...	09/23/1986
4599636	Two terminal axial lead suppressor and diode bridge device An axial lead bridge rectifier includes four rectifying diode chips and a large pulse suppressor chip all disposed between the paddle sections of two coaxial leads. Two of the diodes are solder-connected in series between the two paddle sections, with the...	07/08/1986
4583005	Solid state switch assembly A solid state switch assembly including a circular array of three electrode semiconductors (26) with a control semiconductor (46) disposed centrally of the array. First and second buses (12 and 30) are in electrical contact with the semiconductors (26). A...	04/15/1986
4511914	Power bus routing for providing noise isolation in gate arrays A gate array which has power bus routing for increasing current availability to a plurality of transistor cells is provided. The gate array also has separate power busses for input/internal logic and output circuits. The gate array comprises n columns of ...	04/16/1985
4303935	Semiconductor apparatus with electrically insulated heat sink A semiconductor element, either a diode or a controlled rectifier, is electrically insulated relative to the heat sink on which it is mounted by either an insulating layer or an insulating diode of high thermal conductivity. A single unit including the he...	12/01/1981

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Class 257/E25.015 - Devices being arranged next and on each other, i.e., mixed assemblies (EPO)