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| Number | Title | Issue Date |
| 7432143 | Method for forming gate of semiconductor device There is provided a method for forming a gate using a gate layout of a semiconductor device. The layout includes an active region with a stepped side boundary, a plurality of gates crossing over the active region, and tabs attached to the gates on the side boundary ... | 10/07/2008 |
| 7400035 | Semiconductor device having multilayer printed wiring board A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support body, and a semiconductor chip provided on the first substrate exposed ... | 07/15/2008 |
| 7388295 | Multi-chip module A multi-chip module has at least two semiconductor chips. Each of the semiconductor chips has chip electrodes of the semiconductor chip, electrically conductive interconnections for electrically connection with the chip electrodes, electrically conductive lands for ... | 06/17/2008 |
| 7291926 | Multi-chip package structure The present invention relates to a multi-chip package structure, comprising a first substrate, a first chip, a sub-package and a first molding compound. The first chip is attached to the first substrate. The first molding compound encapsulates the first chip, the su... | 11/06/2007 |
| 7274100 | Battery protection circuit with integrated passive components An integrated circuit which includes a circuit board having passive elements embedded in its body. ... | 09/25/2007 |
| 7268426 | High-frequency chip packages A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit panel so as to provide enhanced thermal conductivity to the circuit panel and electromagnetic shielding and a conductive e... | 09/11/2007 |
| 7262510 | Chip package structure A process for fabricating a chip package structure with the following steps is provided. First, a chip having an active surface is provided. A plurality of solder bumps is disposed on the active surface. Then, a polymer material including flux is placed on the surfa... | 08/28/2007 |
| 7253513 | High-frequency switch device and electronic device using the same A switch device includes a semiconductor chip, and at least two switches formed on the semiconductor chip. Ground parts of the at least two switches are arranged between said at least two switches. ... | 08/07/2007 |
| 7230332 | Chip package with embedded component A chip package is provided. The chip package includes at least one chip, an interconnection structure, a plurality of second pads and at least one panel-shaped component, wherein the chip includes a plurality of first pads on a surface thereof. The interconnection s... | 06/12/2007 |
| 7224053 | Semiconductor device responsive to different levels of input and output signals and signal processing system using the same A semiconductor device which integrates a plurality of semiconductor chips into a single package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip includes a plurality of first bonding pads outputting first signals hav... | 05/29/2007 |
| 7202108 | Semiconductor wafer, semiconductor chip and method for manufacturing the same In a semiconductor device, in which an insulating layer is disposed on the main face of the silicon substrate, and the insulating layer includes the protruding portion that protrudes from the end face of the silicon substrate, the protruding portion has an interconn... | 04/10/2007 |
| 7176560 | Semiconductor device having a chip—chip structure A semiconductor device having a chip-on-chip structure wherein; a first semiconductor chip with a memory macro control circuit where a plurality of inter-chip connection terminals and a plurality of external connection terminals are formed on a surface of the chip; ... | 02/13/2007 |
| 7129583 | Multi-chip package structure The present invention relates to a multi-chip package structure, comprising a first substrate, a first chip, a sub-package and a first molding compound. The first chip is attached to the first substrate. The first molding compound encapsulates the first chip, the su... | 10/31/2006 |
| 7095104 | Overlap stacking of center bus bonded memory chips for double density and method of manufacturing the same An approach to DRAM memory chip packaging leveraging the chip center position for wire bond pads to minimize time-of-flight and impedance effects resulting from stacking in a BGA application. A top layer of a dual device stack of center bus chips is stacked with an ... | 08/22/2006 |
| 6703560 | Stress resistant land grid array (LGA) module and method of forming the same An integrated circuit module, a land grid array module, and a method for forming the module, include a substrate, which mounts one or more chips or discrete electronic components, and a cap for covering the substrate, and including at least one protrusion... | 03/09/2004 |
| 6700794 | Decoupling capacitor closely coupled with integrated circuit An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the subst... | 03/02/2004 |
| 6696765 | Multi-chip module A multi-chip module has at least two semiconductor chips. Each of the semiconductor chips has chip electrodes of the semiconductor chip, electrically conductive interconnections for electrically connection with the chip electrodes, electrically conductive... | 02/24/2004 |
| 6696714 | Multichip semiconductor device having a hip with redundancy restoration fuse that affects a redundant memory array A multichip semiconductor device with an improved yield and a reduced inspection cost is provided in which a fuse is provided on a first semiconductor chip while a fuse is not provided on a second semiconductor chip as a rewritable memory, and these chips... | 02/24/2004 |
| 6682981 | Stress controlled dielectric integrated circuit fabrication General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a sem... | 01/27/2004 |
| 6683663 | Web fabrication of devices Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to forming an assembly using different sized blocks in either a flexible or rigid substrate.... | 01/27/2004 |
| 6682954 | Method for employing piggyback multiple die #3 A method for upgrading or remediating semiconductor devices utilizing a remediation, adaptation, modification or upgrade chip in a piggyback configuration with a primary bare chip to achieve an upgrade, modification or adaptation of the primary chip or re... | 01/27/2004 |
| 6665190 | Modular PC card which receives add-in PC card modules A modular and user configurable PC Card which removably receives one or more add-in modules that provide selected functionality. The user inserts and removes selected modules in the PC Card to configure the PC Card to the desired functionality. The PC Car... | 12/16/2003 |
| 6665182 | Module unit for memory modules and method for its production The invention relates to a module unit for memory modules and to a method for producing the module unit. A module unit of this type has at least one main module and submodules. The modules are arranged in a star-shaped manner and are arranged radially wit... | 12/16/2003 |
| 6657289 | Apparatus relating to block configurations and fluidic self-assembly processes An apparatus and methods of making an electronic assembly. The electronic assembly comprises a functional block having at least one asymmetric feature. The functional block comprises an integrated circuitry to perform a function pertaining to the electron... | 12/02/2003 |
| 6650004 | Semiconductor device A semiconductor device (S1) includes a semiconductor chip (5), a chip-mounting internal lead (1) mounting the semiconductor chip (5), chip-connecting leads (2, 3) electrically connected to an upper surface of the semiconductor chip (5), and a rectangular ... | 11/18/2003 |
| 6642064 | Method of making a high density programmable logic device in a multichip module package A high performance single package multi-chip module multiplies the logic density of the highest density monolithic programmable logic device (PLD). A dual-sided substrate carries multiple prepackaged PLDs on a top side and a field programmable interconnec... | 11/04/2003 |
| 6643136 | Multi-chip package with embedded cooling element A multi-chip package having one or more embedded cooling elements. The package includes a substrate, a plurality of chips, at least one cooling element, a plurality of solder balls and packaging material. The substrate has a front surface and a correspond... | 11/04/2003 |
| 6642610 | Wire bonding method and semiconductor package manufactured using the same A semiconductor package including plural semiconductor chips, and a wire bonding step for electrically interconnecting the semiconductor chips, are disclosed. In an exemplary method, a substrate is provided. Conductive circuit patterns are provided outsid... | 11/04/2003 |
| 6632732 | Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods Stereolithographically fabricated conductive elements and semiconductor device components and assemblies including these conductive elements. The conductive elements may include multiple superimposed, contiguous, mutually adhered layers of a conductive ma... | 10/14/2003 |
| 6628538 | Memory module including module data wirings available as a memory access data bus A module substrate has a plurality of module data terminal pairs individually provided in association with respective chip data terminals in a plurality of memory chips, and a plurality of module data wirings which respectively connect between the plurali... | 09/30/2003 |
| 6628043 | Electronic component and method of production thereof An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electricall... | 09/30/2003 |
| 6617700 | Repairable multi-chip package and high-density memory card having the package Disclosed are a repairable multi-chip package and a high-density memory card having the multi-chip package. The package includes a circuit substrate having bonding tips on a first surface and external contact pads on a second surface opposite to the first... | 09/09/2003 |
| 6617196 | Semiconductor device A semiconductor device capable of improving the flexibility of designing electrical lead patterns for connection from chips via a substrate to external terminals by appropriately arranging the substrate structure and layout of more than one address signal... | 09/09/2003 |
| 6613978 | Radiation shielding of three dimensional multi-chip modules A method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention de... | 09/02/2003 |
| 6611050 | Chip edge interconnect apparatus and method The present invention provides a method of forming a low profile chip interconnection, and the interconnection so formed. A recessed contact area is formed at an edge of the wafer. A conductive material is deposited within the adjacent contact areas of ea... | 08/26/2003 |
| 6611055 | Leadless flip chip carrier design and structure One disclosed embodiment comprises a substrate having a top surface for receiving a semiconductor die with a number of solder bumps on its active surface. The disclosed embodiment further comprises a printed circuit board attached to a bottom surface of t... | 08/26/2003 |
| 6602735 | Method of fabricating a semiconductor chip package with a lead frame and multiple integrated circuit chips A lead frame for a semiconductor chip package includes a frame body and at least two chip-receiving windows formed in the frame body. Each chip-receiving window receives a respective integrated circuit chip therein. A plurality of internal connection lead... | 08/05/2003 |
| 6586845 | Semiconductor device module and a part thereof A semiconductor device module includes one or a plurality of semiconductor devices, each including a semiconductor element having first and second surfaces, pads formed on the first surface on which electrode terminals are also formed and curved, flexible... | 07/01/2003 |
| 6582979 | Structure and method for fabrication of a leadless chip carrier with embedded antenna A substrate has a top surface for receiving a semiconductor die. An antenna is patterned on the bottom surface of the substrate. The antenna is accessible by coupling it to a via and, through the via, to a substrate signal bond pad and a semiconductor die... | 06/24/2003 |
| 6583432 | Methods and compositions for ionizing radiation shielding The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied ... | 06/24/2003 |
