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| Number | Title | Issue Date |
| 7436055 | Packaging method of a plurality of chips stacked on each other and package structure thereof A package structure with a plurality of chips stacked on each other includes a substrate, a first chip and second chip. The substrate has a dielectric layer, a metal layer having a conducting trace area and a shielding area formed on the dielectric layer, and a sold... | 10/14/2008 |
| 7432585 | Semiconductor device electronic component, circuit board, and electronic device A semiconductor device includes: a semiconductor substrate having an active face; a first electrode provided on or above the active face; an external connection terminal provided on or above the active face and electrically connected to the first electrode; and a co... | 10/07/2008 |
| 7375421 | High density multilayer circuit module Thinning and stacking are essential for circuit modules used for mobile devices of various kinds, smart cards, memory cards and the like. These demands make the manufacture of the circuit modules more complicated or less reliable due to delamination. A circuit modul... | 05/20/2008 |
| 7355272 | Semiconductor device with stacked semiconductor chips of the same type A semiconductor device includes a wiring board, a first semiconductor chip (e.g. DRAM) that is flip-chip connected on the wiring board, a second semiconductor chip (e.g. DRAM) that is of the same type as the first semiconductor chip and is mounted face up on the fir... | 04/08/2008 |
| 7341890 | Circuit board with built-in electronic component and method for manufacturing the same A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating layer, a second wiring pattern provided on a second main surface differen... | 03/11/2008 |
| 7332808 | Semiconductor module and method of manufacturing the same A semiconductor module according to the invention includes: an island formed of a conductive material; a plurality of leads disposed in vicinity of the island; a resin sealing body which is mounted on the island and disposed such that a back surface of a circuit boa... | 02/19/2008 |
| 7317241 | Semiconductor apparatus having a large-size bus connection In a semiconductor apparatus of the present invention, a plurality of circuit components are provided. A first bus interconnects the circuit components. A second bus interconnects the circuit components. A switching unit outputs a select signal that causes each circ... | 01/08/2008 |
| 7307293 | Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages susp... | 12/11/2007 |
| 7282793 | Multiple die stack apparatus employing T-shaped interposer elements Multiple integrated circuit devices in a stacked configuration that use a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof are disclosed. ... | 10/16/2007 |
| 7247932 | Chip package with capacitor A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor chip connections of one or more primary chips which overlie the window ... | 07/24/2007 |
| 7227252 | Semiconductor component having stacked, encapsulated dice and method of fabrication A semiconductor component includes a substrate and multiple stacked, encapsulated semiconductor dice on the substrate. A first die is back bonded to the substrate and encapsulated in a first encapsulant, and a second die is back bonded to the first encapsulant. The ... | 06/05/2007 |
| 7205646 | Electronic device and chip package The package includes a substrate, a first chip, a second chip, multiple first bumps and multiple second bumps. The substrate has a first region and a second region. The first region is substantially coplanar with the second region. The first bumps connect the first ... | 04/17/2007 |
| 7205673 | Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing A bond pad structure which includes an aluminum bond pad which include one or more dopants that effectively control the growth of IMC to a nominal level in spite of high tensile stresses in the wafer. For example, aluminum can be doped with 1–2 atomic % of Mg. Alt... | 04/17/2007 |
| 7199458 | Stacked offset semiconductor package and method for fabricating In the stacked semiconductor package, on a first semiconductor chip, a second semiconductor chip is stacked offset such that a portion of the first semiconductor chip is exposed. At least one first conductor electrically connects the exposed portion of the first sem... | 04/03/2007 |
| 7176560 | Semiconductor device having a chip—chip structure A semiconductor device having a chip-on-chip structure wherein; a first semiconductor chip with a memory macro control circuit where a plurality of inter-chip connection terminals and a plurality of external connection terminals are formed on a surface of the chip; ... | 02/13/2007 |
| 7151013 | Semiconductor package having exposed heat dissipating surface and method of fabrication A high density semiconductor package with thermally enhanced properties is described. The semiconductor package includes a pair of lead frames, each being attached to a respective semiconductor die. The dies are attached to respective lead frames via an adhering mat... | 12/19/2006 |
| 7138723 | Deformable semiconductor device A semiconductor chip is secured in a state deformed into a substantially cylinder shape by a coating material formed on its surface. The deformed semiconductor chip is flip-chip connected to an interposer and sealed with sealing resin onto the interposer. Solder bal... | 11/21/2006 |
| 7105921 | Semiconductor assemblies having electrophoretically insulated vias Methods are provided for creating lined vias in semiconductor substrates. Using electrophoretic deposition techniques, micelles of a lining material are deposited on the wall of the via, reacting with the surface of the wall until the entire wall is covered by the l... | 09/12/2006 |
| 7098477 | Structure and method of manufacturing a finFET device having stacked fins The present invention provides a device structure and method of forming a finFet device having stacked fins. The method of the present invention comprises: providing a substrate with a first semiconductor layer on a first insulator layer, a second insulator layer on... | 08/29/2006 |
| 7091606 | Circuit device and manufacturing method of circuit device and semiconductor module After a trench 54 is formed in a conductive foil 60, the circuit elements are mounted, and the insulating resin is applied on the conductive foil 60 as the support substrate. After being inverted, the conductive foil 60 is polished on the... | 08/15/2006 |
| 6911723 | Multiple die stack apparatus employing T-shaped interposer elements Multiple integrated circuit devices in a stacked configuration that use a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof are disclosed. ... | 06/28/2005 |
| 6693362 | Multichip module having chips mounted on upper and under surfaces of a thin film closing an opening formed in a rigid substrate A multichip module is provided. The multichip module comprises a rigid substrate including a core material and having an opening, a thin film fixed on an upper surface of the rigid substrate so as to be electrically connected to the rigid substrate and to... | 02/17/2004 |
| 6689637 | Method of manufacturing a multi-chip semiconductor package A method of fabricating a semiconductor package capable of realizing a smaller and more compact size and improving reliability of package product and a fabrication method thereof. A main semiconductor chip operates as a lead frame or a substrate and havin... | 02/10/2004 |
| 6686654 | Multiple chip stack structure and cooling system An electronic package comprised of multiple chip stacks attached together to form a single, compact electronic module. The module is hermetically sealed in an enclosure. The enclosure comprises a pressurized, thermally conductive fluid, which is utilized ... | 02/03/2004 |
| 6685817 | Method and apparatus for controlling plating over a face of a substrate According to aspect of the invention, a plating system is provided which includes a tank for containing a plating solution, a shaft extending into the tank, and a substrate holder mounted to the shaft. The shaft and the tank are rotatable relative to one ... | 02/03/2004 |
| 6686663 | Semiconductor device and a method of manufacturing the same Two memory chips mounted over a base substrate have the same external size and a flash memory of the same memory capacity formed thereon. These memory chips are mounted over the base substrate with one of them being overlapped with the upper portion of th... | 02/03/2004 |
| 6682981 | Stress controlled dielectric integrated circuit fabrication General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a sem... | 01/27/2004 |
| 6680219 | Method and apparatus for die stacking An integrated circuit package is constructed by attaching lower dies to a substrate that has bond fingers deposited on its surface. One lower die and its associated bond fingers are located offset from the center of the substrate. The lower dies are elect... | 01/20/2004 |
| 6678167 | High performance multi-chip IC package The specification describes a multi-chip IC package in which IC chips are flip-chip bonded to both sides of a flexible substrate. The upper (or lower) surface of the flexible substrate is bonded to a rigid support substrate with openings in the support su... | 01/13/2004 |
| 6669489 | Interposer, socket and assembly for socketing an electronic component and method of making and using same Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board or other electronic component. In an embodiment, resilient contact structures extend through a support substrate, an... | 12/30/2003 |
| 6665190 | Modular PC card which receives add-in PC card modules A modular and user configurable PC Card which removably receives one or more add-in modules that provide selected functionality. The user inserts and removes selected modules in the PC Card to configure the PC Card to the desired functionality. The PC Car... | 12/16/2003 |
| 6664628 | Electronic component overlapping dice of unsingulated semiconductor wafer The present invention provides an ancillary electrical component in very close proximity to a semiconductor device, preferably mounted directly to the semiconductor device. In one preferred embodiment, the ancillary electrical component is a capacitor. In... | 12/16/2003 |
| 6664617 | Semiconductor package A semiconductor package includes a metallic foil (10) having a front surface and a rear surface, which foil (10) is formed to have a recess portion (12) including a bottom and an extended border region (14) around the recess portion (12). A substrate (30)... | 12/16/2003 |
| 6655023 | Method and apparatus for burning-in semiconductor devices in wafer form Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connect... | 12/02/2003 |
| 6650008 | Stacked semiconductor packaging device A stacked semiconductor packaging device consists of at least a stacked multi-chip device comprising a substrate. A first chip has a back surface faced towards the substrate and an active surface comprising a plurality of bonding pads which have a first s... | 11/18/2003 |
| 6650009 | Structure of a multi chip module having stacked chips A structure of a multi chip module package having stacked chips, having at least a substrate, a main chip, a plurality of chip sets, a plurality of spacers, a plurality of glue layers, a plurality of wires, and a mold compound. The substrate has a front s... | 11/18/2003 |
| 6646333 | Semiconductor module having interconnected semiconductor chips disposed one above the other A semiconductor module has a plurality of semiconductor chips which are provide on chip carriers in a housing. At least some of the semiconductor chips are disposed one above the other and there are conductive connections between the chip carriers of the ... | 11/11/2003 |
| 6635960 | Angled edge connections for multichip structures A multichip module that utilizes an angled interconnect to electrically interconnect chips in the module that are positioned at an angle relative to each other. The multichip module may comprise a first and second chips that are positioned in an orthogona... | 10/21/2003 |
| 6635962 | Chip on chip semiconductor device In the case where a plurality of second semiconductor chips (2a and 2b) are bonded to the surface side of a first semiconductor chip (1) via bump electrodes (11 and 21), an interconnection (9) for directly connecting electrode terminals (22a and 22b) of t... | 10/21/2003 |
| 6627479 | Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer A plurality of semiconductor chips are incorporated in a one-piece package so as to substantially increase a mounting area of a semiconductor device so that the semiconductor device can be provided with the projection electrodes having a structure which e... | 09/30/2003 |
