Class 257/E25.01 - Device consisting of plurality of semiconductor or other solid state devices or components formed in or on common substrate, e.g., integrated circuit device (EPO)

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: This subclass is indented under subclass E25.003. This subclass
No. of patents: 42
Last issue date: 05/13/2008

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Number	Title	Issue Date
7370530	Package for MEMS devices A package for packaging one or more MEMS devices is disclosed. A package in accordance with an illustrative embodiment of the present invention can include a packaging structure having a base section, a top section, and an interior cavity adapted to contain a number...	05/13/2008
7368813	Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof A first semiconductor element is mounted on a base plate, and is in a sealed state by the periphery thereof being covered by an insulation member, and the upper surface thereof being covered by an upper insulation film. An upper wiring layer formed on the upper insu...	05/06/2008
7358600	Interposer for interconnecting components in a memory card A circuit module for use in a memory card. The circuit module comprises a base substrate including a plurality of contacts. Attached to the base substrate is a memory die, while attached to the memory die is an interposer having a plurality of terminals electrically...	04/15/2008
7332808	Semiconductor module and method of manufacturing the same A semiconductor module according to the invention includes: an island formed of a conductive material; a plurality of leads disposed in vicinity of the island; a resin sealing body which is mounted on the island and disposed such that a back surface of a circuit boa...	02/19/2008
7317241	Semiconductor apparatus having a large-size bus connection In a semiconductor apparatus of the present invention, a plurality of circuit components are provided. A first bus interconnects the circuit components. A second bus interconnects the circuit components. A switching unit outputs a select signal that causes each circ...	01/08/2008
6635960	Angled edge connections for multichip structures A multichip module that utilizes an angled interconnect to electrically interconnect chips in the module that are positioned at an angle relative to each other. The multichip module may comprise a first and second chips that are positioned in an orthogona...	10/21/2003
6628538	Memory module including module data wirings available as a memory access data bus A module substrate has a plurality of module data terminal pairs individually provided in association with respective chip data terminals in a plurality of memory chips, and a plurality of module data wirings which respectively connect between the plurali...	09/30/2003
6605869	Semiconductor device with improved cooling efficiency and reduced electric resistance The present invention provides a semiconductor device comprising: a tape wiring substrate; a semiconductor element mounted one main surface of the tape wiring substrate; a solder ball or pump electrode provided on the other surface of the tape wiring subs...	08/12/2003
6591492	Angled edge connections for multichip structures A multichip module that utilizes an angled interconnect to electrically interconnect chips in the module that are positioned at an angle relative to each other. The multichip module may comprise a first and second chips that are positioned in an orthogona...	07/15/2003
6552424	Angled edge connections for multichip structures A multichip module that utilizes an angled interconnect to electrically interconnect chips in the module that are positioned at an angle relative to each other. The multichip module may comprise a first and second chips that are positioned in an orthogona...	04/22/2003
6531861	Movement actuator/sensor systems A sensor system for sensing movement comprises a rod anchored at one end to a base and plurality of strain gauges circumferentially disposed about the rod. The free end of the rod may be subject to forces in various directions. The strain gauges produce s...	03/11/2003
6509645	Spherical semiconductor device and method for fabricating the same A spherical semiconductor device includes a spherical semiconductor element having one or more electrodes on its surface. Spherical conductive bumps are formed at the positions of the electrodes. The electrodes are so arranged as to contact a common plane...	01/21/2003
6479890	Semiconductor microsystem embedded in flexible foil A microsystem comprises a flexible foil, a plurality of semiconductor elements embedded in said flexible foil, and a connection line arranged substantially on said flexible foil and used for electrically connecting at least two semiconductor elements. For...	11/12/2002
6476461	Arrangement of stacked, spherically-shaped semiconductors To provide a semiconductor device in which a plurality of spherical members are easily stacked at predetermined positions, with at least one of the spherical members being formed of a semiconductor material and having a semiconductor element or wiring for...	11/05/2002
6462398	Semiconductor device and semiconductor assembly apparatus for semiconductor device In a semiconductor device, a plurality of linear semiconductors of a predetermined length, on which electronic element are formed, are aligned laterally and in parallel. A semiconductor assembly apparatus for assembling the semiconductor device, aligns th...	10/08/2002
6438014	High speed access compatible memory module A module substrate has a plurality of module data terminal pairs individually provided in association with respective chip data terminals in a plurality of memory chips, and a plurality of module data wirings which respectively connect between the plurali...	08/20/2002
6404060	Semiconductor device having a chip-on-chip structure A semiconductor device has a first semiconductor chip having a device formed thereon and a second semiconductor chip having a protection circuit for protecting the device formed thereon. The second semiconductor chip is superposed on and bonded to the sur...	06/11/2002
6321443	Connection substrate The method for the manufacture of multilayer connecting substrates with multiple functions comprises the design of the connecting substrate taking place in functionally separated manner, in that signal conducting substrate parts (19), power supplying subs...	11/27/2001
6256203	Free standing, three dimensional, multi-chip, carrier package with air flow baffle An efficient cooling mechanism for a multi-chip carrier can be provided while conserving board surface area. Flexible circuitized material is used to form multi-chip carriers with air baffle capability. The flex is folded or curved into the desired shape ...	07/03/2001
6127726	Cavity down plastic ball grid array multi-chip module A circuit assembly comprising a substrate, a first set of contacts, a second set of contacts, and a third set of contacts. Also, a plurality of electrically conductive lines located on the substrate providing electrical connection between the first set of...	10/03/2000
6061245	Free standing, three dimensional, multi-chip, carrier package with air flow baffle An efficient cooling mechanism for a multi-chip carrier can be provided while conserving board surface area. Flexible circuitized material is used to form multi-chip carriers with air baffle capability. The flex is folded or curved into the desired shape ...	05/09/2000
5990472	Microelectronic radiation detectors for detecting and emitting radiation signals A radiation detector includes a microelectronic frustum structure that defines an inner cavity and is mounted to a base structure such as a microelectronic substrate. In particular, at least two microelectronic sections or substrates are attached to one a...	11/23/1999
5963427	Multi-chip module with flexible circuit board An improved memory module for mounting chips. The memory module has a circuit board which is at least partially flexible between a first part and a second part. The first part is mounted horizontally over a second circuit board, such as a mother board. Th...	10/05/1999
5963793	Microelectronic packaging using arched solder columns Microelectronic packages are formed wherein solder bumps on one or more substrates are expanded, to thereby extend and contact the second substrate and form a solder connection. The solder bumps are preferably expanded by reflowing additional solder into ...	10/05/1999
5926369	Vertically integrated multi-chip circuit package with heat-sink support A multi-chip carrier which uses less lateral mounting space on the surface of a circuit board or card can be formed using flexible circuitized material. Lateral space is compressed by utilizing more vertical space to package chips and components. The prob...	07/20/1999
5907178	Multi-view imaging apparatus An electronic module includes multiple stacked bare IC chips ("a stack") and a sensor assembly that is mechanically coupled to an end surface of the stack. Electrical connection between the sensor assembly and the stack is provided by a metallization laye...	05/25/1999
5869896	Packaged electronic module and integral sensor array An electronic module includes multiple stacked bare IC chips ("a stack") and a sensor assembly that is mechanically coupled to an end surface of the stack. Electrical connection between the sensor assembly and the stack is provided by a metallization laye...	02/09/1999
5794607	Process for producing heat sink having good heat dissipating characteristics A heat sink comprising a bottom plate and a plurality of fin groups on the bottom plate is disclosed, the plurality of the groups being spaced from one another, and aligned in a matrix form or arranged in a staggered pattern, and each of the group compris...	08/18/1998
5793116	Microelectronic packaging using arched solder columns Microelectronic packages are formed wherein solder bumps on one or more substrates are expanded, to thereby extend and contact the second substrate and form a solder connection. The solder bumps are preferably expanded by reflowing additional solder into ...	08/11/1998
5767824	High-density, three-dimensional, intercoupled circuit structure A three-dimensional circuit structure includes a plurality of elongate cylindrical substrates positioned in parallel and in contact with one another. Electrical components are formed on the surfaces of the substrates, along with electrical conductors coup...	06/16/1998
5744947	Movement actuator/sensor systems A movement actuator includes an elongate filament made of a flexible material, and a strip of shape memory alloy disposed on the surface of one side of the filament. The shape memory alloy is responsive to actuation signals, heat or electrical signals, fo...	04/28/1998
5726495	Heat sink having good heat dissipating characteristics A heat sink comprising a bottom plate and a plurality of fin groups on the bottom plate is disclosed, the plurality of the groups being spaced from one another, and aligned in a matrix form or arranged in a staggered pattern, and each of the group compris...	03/10/1998
5673131	High density, three-dimensional, intercoupled circuit structure A three-dimensional circuit structure includes a plurality of elongate cylindrical substrates positioned in parallel and in contact with one another. Electrical components are formed on the surfaces of the substrates, along with electrical conductors coup...	09/30/1997
5634194	High density, three-dimensional, intercoupled circuit structure A three-dimensional circuit structure includes a plurality of elongate cylindrical substrates positioned in parallel and in contact with one another. Electrical components are formed on the surfaces of the substrates, along with electrical conductors coup...	05/27/1997
5610747	High density, three-dimensional, intercoupled circuit structure A three-dimensional circuit structure includes a plurality of elongate cylindrical substrates positioned in parallel and in contact with one another. Electrical components are formed on the surfaces of the substrates, along with electrical conductors coup...	03/11/1997
5594330	Movement actuator/sensor systems A movement actuator includes an elongate filament made of a flexible material, and a strip of shape memory alloy disposed on the surface of one side of the filament. The shape memory alloy is responsive to actuation signals, heat or electrical signals, fo...	01/14/1997
5530658	System and method for packing heat producing devices in an array to prevent local overheating A configuration management subsystem of a subsystem array system assigns heat producing devices to clusters such that the number of devices activated will not create overheating, regardless of which limited set of clusters is activated. The subsystem rece...	06/25/1996
5481184	Movement actuator/sensor systems A movement actuator includes an elongate filament made of a flexible material, and a strip of shape memory alloy disposed on the surface of one side of the filament. The shape memory alloy is responsive to actuation signals, heat or electrical signals, fo...	01/02/1996
5451774	High density, three-dimensional, intercoupled optical sensor circuit A three-dimensional circuit structure includes a plurality of elongate cylindrical substrates positioned in parallel and in contact with one another. Electrical components are formed on the surfaces of the substrates, along with electrical conductors coup...	09/19/1995
5273622	System for continuous fabrication of micro-structures and thin film semiconductor devices on elongate substrates A method of fabricating semiconductor devices on a moveable fiber includes the steps of moving the fiber longitudinally along a predetermined pathway, applying a semiconductor material to at least a portion of the surface of the fiber at a first station a...	12/28/1993

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Class 257/E25.01 - Device consisting of plurality of semiconductor or other solid state devices or components formed in or on common substrate, e.g., integrated circuit device (EPO)