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Class 257/E25.005 - Devices being arranged next to each other (EPO)


Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: This subclass is indented under subclass E25.004. This subclass
No. of patents: 46
Last issue date: 04/15/2008


1    
NumberTitleIssue Date
7358529Active matrix display devices, and their manufacture
Physical barriers (210) are present between neighboring pixels (200) on a circuit substrate (100) of an active-matrix display device, such as an electroluminescent display formed with LEDs (25) of organic semiconductor materials. The inve...
04/15/2008
7317241Semiconductor apparatus having a large-size bus connection
In a semiconductor apparatus of the present invention, a plurality of circuit components are provided. A first bus interconnects the circuit components. A second bus interconnects the circuit components. A switching unit outputs a select signal that causes each circ...
01/08/2008
7285803Light-emitting diode lamp having a terminal portion with a notch portion
A notch portion 7A is disposed on a formation surface of a wiring pattern 7 and is located in a contact point with a wiring pattern 9 of an outside substrate 8, so that a solder 9a melted by reflow soldering slowly flows up ...
10/23/2007
7122912Chip and multi-chip semiconductor device using thereof and method for manufacturing same
The chip for the multi-chip semiconductor device having the markings for alignment formed on the front surface and/or the back surface of the chip only by the processing from the front surface of the chip (photolithography, etch) and the method for manufacturing sam...
10/17/2006
7067927Die with integral pedestal having insulated walls
A variety of techniques and structures are described that integrate an insulated pedestal into the back surface of integrated circuit dice. The die has an insulated integral pedestal formed therein that acts as a spacer. The pedestal has a footprint that is smaller ...
06/27/2006
6515285Method and apparatus for compensating a radiation sensor for ambient temperature variations
Methods and apparatus for compensating a radiation sensor for ambient temperature variations. Ambient temperature variations may produce undesirable artifacts in electronic signals output by a radiation sensor. In some cases, such artifacts may detrimenta...
02/04/2003
6335528Method for producing a radiation detector by assembling elementary blocks and resulting detector
A process for producing a radiation detector. A plurality of unitary elementary slabs are assembled on a positioning support. The slabs are adhesively bonded onto the common support. The bonding is carried out in two successive steps: a first step for sea...
01/01/2002
6157404Imaging system including an array of dual-band microbridge detectors
A dual-band detector that absorbs incident radiation in a first range of wavelengths and that absorbs incident radiation in a second range of wavelengths. The dual-band detector includes a semiconductor substrate and a first microbridge detector level dis...
12/05/2000
5865904Flexible photoelectric conversion module and method for its manufacture
For reduced electrical resistance of series connections between columns of photoelectric conversion elements in a flexible photoelectric conversion module, the columns are connected by a flexible connecting member which connects terminal electrodes at the...
02/02/1999
5811815Dual-band multi-level microbridge detector
A dual-band detector that absorbs incident radiation in a first range of wavelengths and that absorbs incident radiation in a second range of wavelengths. The dual-band detector includes a semiconductor substrate and a first microbridge detector level dis...
09/22/1998
5545913Assembly for mounting semiconductor chips in a full-width-array image scanner
An assembly facilitates mounting a set of abutted semiconductor chips, such as chips aligned to form a single full-page-width linear array of photosensors in a digital scanner or copier. An elongated bead of electrically conductive adhesive extends along ...
08/13/1996
5510273Process of mounting semiconductor chips in a full-width-array image
A process for manufacturing semiconductor chips, such as photosensor arrays for a full-page-width scanner or printhead chips for a full-page-width ink-jet printer, mounted on a substrate to maintain reasonably consistent spacing among adjacent chips. Befo...
04/23/1996
5473513Photosensitive array wherein chips are not thermally matched to the substrate
Semiconductor chips, such as photosensor arrays in a full-width scanner, are mounted on a substrate to maintain reasonably consistent spacing among chips regardless of temperature conditions during use. After chips are tacked onto the substrate with uncur...
12/05/1995
5463229Circuit board for optical devices
A circuit board for mounting one or more optical devices such as light receiving LSI chips and light emitting LSI chips. The circuit board has a flexible transparent substrate, a window portion which is formed as a slit-like transparent region of the tran...
10/31/1995
5308980Thermal mismatch accommodated infrared detector hybrid array
A hybrid infrared focal plane array detector employs a detector layer and transparent substrate bonded to a thin semiconductor readout integrated circuit and thicker readout circuit substrate. The readout circuit is rigidly bonded to the readout substrate...
05/03/1994
5272113Method for minimizing stress between semiconductor chips having a coefficient of thermal expansion different from that of a mounting substrate
Semiconductor chips, such as photosensor arrays in a full-width scanner, are mounted on a substrate to maintain reasonably consistent spacing among chips regardless of temperature conditions during use. After chips are tacked onto the substrate with uncur...
12/21/1993
5264699Infrared detector hybrid array with improved thermal cycle reliability and method for making same
A hybrid infrared focal plane array detector employs a thinned detector layer and substrate directly bonded to a conventional semiconductor readout integrated circuit substrate. The infrared detector layer and transparent substrate is thinned to a thickne...
11/23/1993
5239179Infrared detector devices
In an infrared detector device for viewing an object or scene at more than one wavelength, the detector elements (10 and 20) are optimized to have appropriately different infrared responses by being formed in accordance with the invention in different lev...
08/24/1993
5228666Fixture for fabricating full width scanning or imaging arrays from subunits
A fixture for fabricating a full width scanning or imaging array from a plurality of relatively short subunits which provides immunity from vertical misalignment of the subunits caused by particle contamination. This is accomplished by providing a clearan...
07/20/1993
5191324Remote control system for locking/unlocking the doors of motor vehicles with aspherical toroidal lens containing multiple photodetectors
A remote control system, in particular for locking and unlocking the doors of a motor vehicle, the system being of the type comprising a portable transmitter including means constituting a light source suitable for generating an encoded light flux, and a ...
03/02/1993
5068713Solid state image sensing device
A solid state image sensing device including a transparent support, at least one transparent substrate chip fixed on the support by a fixing agent, at least one photoelectric converting element on the transparent substrate chip and mold material for cover...
11/26/1991
5063286Line image sensor with plural elements arranged at a predetermined pitch according to thermal expansion
A multi-chip type image sensor includes, a base, a plurality of sensor chips arranged on the base so as to be staggered so that adjacent sensor chips among the sensor chips partially overlap with each other in the direction perpendicular to a direction in...
11/05/1991
4999077Method of fabricating full width scanning or imaging arrays from subunits
A method for fabricating a coplanar full width scanning array from a plurality of relatively short scanning subunits for reading and writing images. The subunits are fixedly mounted in an end-to-end relationship on a flat structural member with the subuni...
03/12/1991
4999484Multi-chip type image sensor
A multi-chip type image sensor includes, a base, a plurality of sensor chips arranged on the base so as to be staggered so that adjacent sensor chips among the sensor chips partially overlap with each other in the direction perpendicular to a direction in...
03/12/1991
4976802Process for assembling smaller scanning or printing arrays together to form a longer array
A process for fabricating a full width scanning or printing array in which plural smaller scanning or printing chips are bonded end-to-end onto an glass substrate using a photocurable adhesive to form a subassembly, following which the subassembly is inve...
12/11/1990
4807000High density small element optical mosaic detector
A high density optical detector mosaic array assembly having a plurality of interconnect locations comprised of IC readout pads in a pattern suitable for interconnecting a plurality of integrated circuit devices. The assembly comprises a substrate, a plur...
02/21/1989
4792672Detector buffer board
An infrared detection system is disclosed comprising a planar array segment of infrared detector elements, a multi-layer module and a buffer board disposed intermediate the detector array segment and the multi-layer module. The buffer board is disposed pa...
12/20/1988
4743751Device for the optical abutment of photosensitive detectors
A device for the optical abutment of photosensitive detectors using an optical system comprising two prisms joined together by a semireflecting face. The detectors are disposed on two right angle faces each belonging to a prism. The arrangement of the str...
05/10/1988
4703170Infrared focal plane module
An infrared focal plane module as disclosed for interfacing a plurality of detector elements to external electronics. The module comprises a plurality of integrated circuits disposed in substantially overlapping registry to form a module body, each of the...
10/27/1987
4700076Solid-state X-ray receptor and method of making same
An X-ray receptor for producing electrical signals representative of an X-ray image. An array of semiconductor elements is mounted on at least one support, each element being formed of semiconductor material which is (1) an element of Group 4A of the Peri...
10/13/1987
4672737Detector array module fabrication process
A photo-detector array module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of photo-detectors on the focal plane end, and of thin film circuitry on the back plane end, each...
06/16/1987
4661814Device for reading out a two-dimensional charge pattern by means of an array
A device for reading out two-dimensional charge patterns contains a receiver matrix (consisting of elementary transducers arranged in rows and columns) and a switching matrix (consisting of a carrier plate and electronic components in chip form) which are...
04/28/1987
4646128High-density electronic processing package--structure and fabrication
A high-density electronic package module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of thin film circuitry on the access ends, each access plane is etched to cut back the...
02/24/1987
4618763Infrared focal plane module with stacked IC module body
An infrared detection module is disclosed for interfacing a plurality of detector elements to external electronics. The module is formed of a plurality of multi-channel integrated circuits stacked in substantially overlapping registry with adjacent integr...
10/21/1986
4575762Integrated processor board assembly
Disclosed is an integrated processor assembly and a method for making that assembly, including the steps of providing a semiconducting substrate, fabricating integrated processing circuitry in the substrate, depositing a plurality of input strip lines fro...
03/11/1986
4551629Detector array module-structure and fabrication
A photo detector array module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of photo-detectors on the focal plane end, and of thin film circuitry on the back plane end, each...
11/05/1985
4542295Spectrometer with selectable area detector
A Fourier transform infrared spectrometer utilizes a selectable area infrared detector to optimize performance of the instrument depending upon the nature of the sample being analyzed. The detector includes an inner detecting segment and one or more outer...
09/17/1985
4532699Process for manufacturing a matrix infrared detector with illumination by the front face
A parallelepipedic detection wafer of type p made of Hg Cd Te is taken, islets or raised zones are formed from the front face and their structure is rounded, zones of type n are diffused from the front face, in order to form junctions, metallic contact te...
08/06/1985
4418466Method of making a linear light-detecting diode integrated circuit
An array for light-detecting diodes is inserted into a cavity in an electally insulating substrate with trimmable resistances on the substrate. The substrate is cooled, the diodes are connected to the resistances and are energized via electrical conducto...
12/06/1983
4312115Process to obtain multielement linear bidimensional infrared detectors having improved exactness of geometry and high degree of integration
An improved method for use in fabricating individual semiconductor radiation detectors on a chip is characterized by forming generally V-shaped grooves converging toward one another from opposite sides of the chip into the thickness dimension thereof. The...
01/26/1982
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