Class 257/E25.002 - All devices being of same type, e.g., assemblies of rectifier diodes (EPO)

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: This subclass is indented under subclass E25.001. This subclass
No. of patents: 4
Last issue date: 02/05/2008

Number	Title	Issue Date
7326965	Surface-emitting type device and its manufacturing method A surface-emitting type device includes a substrate including a first face, a second face that is tilted with respect to the first face and has a plane index different from a plane index of the first face, and a third face that is tilted with respect to the second f...	02/05/2008
7291926	Multi-chip package structure The present invention relates to a multi-chip package structure, comprising a first substrate, a first chip, a sub-package and a first molding compound. The first chip is attached to the first substrate. The first molding compound encapsulates the first chip, the su...	11/06/2007
7129583	Multi-chip package structure The present invention relates to a multi-chip package structure, comprising a first substrate, a first chip, a sub-package and a first molding compound. The first chip is attached to the first substrate. The first molding compound encapsulates the first chip, the su...	10/31/2006
5784264	MCM (Multi Chip Module) carrier with external connection teminals BGA (Ball Grid Array) type matrix array form The MCM carrier having wiring layers on front and back surfaces and internally thereof. The MCM carrier includes first and second IC chips, an MCM board, and a carrier board. The first IC chip is mounted on the front surface of the MCM board and connected...	07/21/1998

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