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| Number | Title | Issue Date |
| 7432533 | Encapsulation of electronic devices with shaped spacers An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles comprise a base and an u... | 10/07/2008 |
| 7417309 | Circuit device and portable device with symmetrical arrangement To provide a circuit device freed from constrains of a mounting direction. The circuit device according to the present invention includes: a conductive pattern for forming a die pad, a first bonding pad, and a second bonding pad; and a semiconductor element (TR) att... | 08/26/2008 |
| 7390742 | Method for producing a rewiring printed circuit board The invention relates to a method for producing a rewiring printed circuit board with a substrate wafer having passage connections between a first and a second surface. One embodiment of the method comprises applying and patterning masking layers on the first and th... | 06/24/2008 |
| 7368803 | System and method for protecting microelectromechanical systems array using back-plate with non-flat portion Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate, an interferometric modulation display array formed on the substrate, and a back-plate. The back-plate is placed over the dis... | 05/06/2008 |
| 7352061 | Flexible core for enhancement of package interconnect reliability An IC package is disclosed that comprises a core region disposed between upper and lower build-up layer regions. In one embodiment, the core region comprises a low modulus material. In an alternative embodiment the core region comprises a medium modulus material. In... | 04/01/2008 |
| 7352039 | Methods and apparatuses for microelectronic assembly having a material with a variable viscosity around a MEMS device Various methods and apparatuses are described in which a micro-electro-mechanical systems (MEMS) device is encapsulated with a material having a variable viscosity with a viscosity value high enough to retard foreign material from contacting the MEMS device during a... | 04/01/2008 |
| 7321166 | Wiring board having connecting wiring between electrode plane and connecting pad It is to provide a wiring board for a semiconductor integrated circuit package, which exhibits an excellent signal property and a high effect for decreasing the switching noise at the time of mounting an LSI of an area-array structure. In a multilayer wiring board f... | 01/22/2008 |
| 7265436 | Non-repeated and non-uniform width seal ring structure A method of forming an improved seal ring structure is described. A continuous metal seal ring is formed along a perimeter of a die wherein the metal seal ring is parallel to the edges of the die and sloped at the corner of the die so as not to have a sharp corner a... | 09/04/2007 |
| 7262493 | System and method for mounting electrical devices In one embodiment an electronic device, such as an optical sensor, is attached to a substrate upon which wire logouts and, if desired, other components are constructed. A frame, or cover, is attached to the substrate surrounding the attached device. An aperture in t... | 08/28/2007 |
| 7259455 | Semiconductor device There is provided a semiconductor device including a semiconductor chip which includes a semiconductor substrate and a multilayer interconnection structure formed thereon, the multilayer interconnection structure including an interlayer insulating film smaller in re... | 08/21/2007 |
| 7250670 | Semiconductor structure and fabricating method thereof A semiconductor structure is provided. The semiconductor structure is disposed on the scribe line of a wafer and is around the chip area of the wafer. The semiconductor structure includes a plurality of dielectric layers sequentially disposed on the scribe line and ... | 07/31/2007 |
| 7224056 | Back-face and edge interconnects for lidded package A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facin... | 05/29/2007 |
| 7183140 | Injection molded metal bonding tray for integrated circuit device fabrication An injection molded metal bonding tray may be utilized in the fabrication of integrated circuit devices. In one embodiment, a substrate of an integrated circuit device is placed in a pocket of an injection molded metal bonding tray. A plurality of conductors is plac... | 02/27/2007 |
| 7151308 | Semiconductor chip package A semiconductor chip package includes an interconnection substrate, a central substrate, a peripheral substrate and a semiconductor chip sandwiched between the interconnection substrate and the central substrate. The interconnection substrate has a recessed cavity f... | 12/19/2006 |
| 6703704 | Stress reducing stiffener ring An electronic structure and associated method of formation. A laminate is solderably coupled to an electronic carrier. A stiffener is adhesively attached to a portion of a surface of the laminate by a stiffener adhesive that is in physically adhesive cont... | 03/09/2004 |
| 6700193 | Semiconductor package with elevated tub The semiconductor device includes tub 5 that is smaller than semiconductor chip 8, and which supports semiconductor chip 8; molded section 12 that is formed by resin-molding around semiconductor chip 8; suspension leads 4, including supporting port... | 03/02/2004 |
| 6696748 | Stress balanced semiconductor packages, method of fabrication and modified mold segment Stress balanced semiconductor device packages, a method of forming, and a method of modifying a mold segment for use in the method. A semiconductor die is attached to one side of a substrate having discrete conductive elements such as a ball grid array (B... | 02/24/2004 |
| 6690086 | Apparatus and method for reducing interposer compression during molding process A method for inhibiting damage caused to semiconductor die packages during a molding process, and the semiconductor die packages formed therefrom, is described. One or more openings are provided in a die carrier which are filled with a material which is m... | 02/10/2004 |
| 6680241 | Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices A plurality of chips divided from a semiconductor wafer having a plurality of semiconductor integrated circuits formed on a front surface of the wafer, are prepared, front surfaces of the chips being bonded to a first wafer sheet. The back and side surfac... | 01/20/2004 |
| 6664642 | Semiconductor integrated circuit device Interconnections are formed over an interlayer insulating film which covers MISFETQ1 formed on the principal surface of a semiconductor substrate, while dummy interconnections are disposed in a region spaced from such interconnections. Dummy interconnecti... | 12/16/2003 |
| 6656766 | Semiconductor device having chip scale package A first surface of a semiconductor chip and an upper surface of a circuit board are bonded with a pad of the semiconductor chip fitted to a first opening of the circuit board. The pad is electrically connected to a wire of the circuit board. The pad is se... | 12/02/2003 |
| 6657282 | Semiconductor device having a ball grid array and a fabrication process thereof A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the ... | 12/02/2003 |
| 6653916 | Microwave monolithic integrated circuit (MMIC) carrier interface A microwave monolithic integrated circuit (MMIC) assembly and related method are disclosed. A dielectric substrate has a surface on which radio frequency circuits and microstrip lines are formed. At least one MMIC chip opening is dimensioned for receiving... | 11/25/2003 |
| 6646350 | Semiconductor device In order to realize a semiconductor device and a manufacturing method thereof which can keep with a high reliability an electric connection between each of bump pads formed on LSI chips and each of electrode pads formed on an interconnection substrate, wi... | 11/11/2003 |
| 6633489 | Dynamic isolating mount for processor packages The present invention relates to a method and apparatus that prevents/minimizes cracking in the ceramic body of processors. The ability to prevent/minimize cracking can ensure successful operation and substantially increase processor lifetime. The present... | 10/14/2003 |
| 6617675 | Semiconductor device and semiconductor device assembly A semiconductor device assembly and a semiconductor device are provided which both can ensure reliability after a mounting process. The semiconductor device includes a semiconductor element equipped with bumps on an electrode patterned surface thereof for... | 09/09/2003 |
| 6614118 | Structures to mechanically stabilize isolated top-level metal lines The invention provides in one embodiment thereof an integrated circuit. The integrated circuit includes a first interconnection metallization layer formed upon a substrate. The integrated circuit further includes a second interconnection metallization lay... | 09/02/2003 |
| 6605868 | Insulating substrate including multilevel insulative ceramic layers joined with an intermediate layer An insulating substrate (1) has insulative ceramic layers (2, 3) laid one upon another, an intermediate layer (4) made of a material that is different from a material of the ceramic layers and arranged between adjacent ones of the ceramic layers to join t... | 08/12/2003 |
| 6600232 | Flip-chip semiconductor package structure and process for fabricating the same An advanced flip-chip packaging technology is proposed, which is characterized in the forming of a metal dam over the substrate to serve three different utilization purposes. First, the metal dam can help provide a specific fillet width to the underfilled... | 07/29/2003 |
| 6587353 | Semiconductor device In the semiconductor device, externally connecting electrodes are placed on a semiconductor substrate. A rewiring pattern for connecting each on-chip electrode to corresponding external connecting electrode is routed, in the vicinity of the externally con... | 07/01/2003 |
| 6534419 | Method and apparatus for reducing IC die mass and thickness while improving strength characteristics A method for decreasing the mass and increasing the strength of an IC wafer assembly involves adding a polymer coating to the frontside of the wafer assembly to protect and strengthen the assembly, and removing silicon material from the backside of the wa... | 03/18/2003 |
| 6521975 | Scribe street seals in semiconductor devices and method of fabrication An integrated circuit wafer, covered by a protective overcoat, comprising an array of integrated circuit chips bordered by seal regions and separated by dicing lines; at least two sets of substantially parallel structures within each of said seal regions,... | 02/18/2003 |
| 6518678 | Apparatus and method for reducing interposer compression during molding process A method for inhibiting damage caused to semiconductor die packages during a molding process, and the semiconductor die packages formed therefrom, is described. One or more openings are provided in a die carrier which are filled with a material which is m... | 02/11/2003 |
| 6514847 | Method for making a semiconductor device In a semiconductor device, a plurality of wiring films are formed on a front surface of a base comprising an insulating resin and having electrode-forming holes, the surfaces of the wiring films and the surface of the base being positioned on the same pla... | 02/04/2003 |
| 6504245 | Semiconductor device It is the object of the present invention to provide a semiconductor device capable of ensuring bonding strength without applying an excessive stress to solder balls and having a high degree of reliability. A substrate made of metal for the purposes of ma... | 01/07/2003 |
| 6498551 | Millimeter wave module (MMW) for microwave monolithic integrated circuit (MMIC) A low cost millimeter wave (MMW) module for a microwave monolithic integrated circuit (MMIC) includes a carrier board formed of a dielectric material and having at least one MMIC die mounted thereon and at least one interface line, such as a 50 Ohm micros... | 12/24/2002 |
| 6495918 | Chip crack stop design for semiconductor chips A semiconductor chip, in accordance with the present invention, includes a substrate and a crack stop structure. The crack structure includes a first conductive line disposed over the substrate and at least two first contacts connected to the substrate an... | 12/17/2002 |
| 6472759 | Ball grid array type semiconductor device A BGA type semiconductor device having a high reliability when mounted on a printed circuit board by preventing cracks and breakage of weld balls of the BGA type semiconductor device. The semiconductor device includes a conductive board having a pair of t... | 10/29/2002 |
| 6465872 | Semiconductor device A semiconductor device has a semiconductor substrate (1) having a plurality of individual semiconductor device areas (10-1, 10-2), and a scribe area (20) positioned between the individual semiconductor device areas (10-1, 10-2) adjacent to each other so a... | 10/15/2002 |
| 6462405 | Semiconductor package A semiconductor package is proposed, in which a lid is attached to a semiconductor chip and appropriately spaced apart from a heat sink having a top surface thereof exposed to the outside an encapsulant, so as to prevent external moisture from condensing ... | 10/08/2002 |
