Class 257/E23.193 - Characterized by material or arrangement of seals between parts, e.g., between cap and base of container or between leads and walls of container (EPO)

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: This subclass is indented under subclass E23.18. This subclass
No. of patents: 507
Last issue date: 10/28/2008

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Number	Title	Issue Date
7443024	Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the same A micro-electro-mechanical system (MEMS) package having a side double-sealing member and method of manufacturing the MEMS package is disclosed. The MEMS package is formed by forming a metal layer on a base substrate by patterning so that the metal layer surrounds an...	10/28/2008
7436056	Electronic component package An electronic component package includes a dielectric substrate having a first surface where an electronic component is sealed. A first signal line connecting to the electronic component and a first ground conductor are formed on the first surface of the dielectric ...	10/14/2008
7432533	Encapsulation of electronic devices with shaped spacers An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles comprise a base and an u...	10/07/2008
7408250	Micromirror array device with compliant adhesive A microstructure is packaged with a device substrate of the microstructure being attached to a package substrate. For dissipating possible deformation of the microstructure, which may result in device failure or quality degradation of the microstructure, an adhesive...	08/05/2008
7394153	Encapsulation of electronic devices An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles are fixed to one side of...	07/01/2008
7382046	Semiconductor device protection cover, and semiconductor device unit including the cover A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the...	06/03/2008
7378748	Solid-state imaging device and method for manufacturing the same A solid-state imaging device comprises a housing in which a base and ribs forming a rectangular frame are formed in one piece by a resin; a plurality of metal lead pieces embedded in the housing, each of which has an internal terminal portion facing an internal spac...	05/27/2008
7354799	Methods for anchoring a seal ring to a substrate using vias and assemblies including an anchored seal ring Disclosed are embodiments of a method for forming a seal ring on a substrate that is anchored to the substrate by a number of vias. Also disclosed are embodiments of an assembly including such an anchored seal ring. In some embodiments, a seal ring may extend around...	04/08/2008
7342263	Circuit device A circuit device is provided which can be manufactured at reduced costs and which is highly reliable. The circuit device includes a Sensor area formed on part of a semiconductor substrate, a circuit area formed around the sensor area on the semiconductor substrate t...	03/11/2008
7294925	Optical scanner package having heating dam An optical scanner package having a heating dam is provided. The optical scanner package having a heating dam includes: an optical scanner on which a mirror surface is formed; a ceramic package in which the optical scanner is installed at the bottom of a cavity ther...	11/13/2007
7291914	Power semiconductor module A power semiconductor module has a substrate (1) on which several pressure elements (16, 17, 18, 19) perform a mechanical pressure (F) at different areas (10, 11, 12, 13) thereof in a direction of a cooling element in order to press the undersid...	11/06/2007
7291904	Downsized package for electric wave device A package substrate includes signal pads provided on a main surface of the package substrate, footpads provided on a backside of the package substrate, and a sealing electrode provided on the main surface to surround the signal pads, the signal pads being electrical...	11/06/2007
7235867	Semiconductor device with electrically biased die edge seal A die seal arrangement and method for making the same negatively biases the die edge seal of a die by connecting the die edge seal to a source of negative electrical potential, with respect to electrical ground. The die edge seal, made of copper, for example, has it...	06/26/2007
7202552	MEMS package using flexible substrates, and method thereof A MEMS package and a method for its forming are described. The MEMS package has at least one MEMS device located on a flexible substrate. A metal structure surrounds the at least one MEMS device wherein a bottom surface of the metal structure is attached to the flex...	04/10/2007
7173331	Hermetic sealing cap and method of manufacturing the same A hermetic sealing cap member capable of suppressing deterioration of characteristics of an electronic component resulting from a sealant such as solder coming into contact with the electronic component in a package is obtained. This hermetic sealing cap, which is a...	02/06/2007
7154173	Semiconductor device and manufacturing method of the same This invention miniaturizes a package of a semiconductor device and simplifies a manufacturing procedure to reduce a manufacturing cost. A semiconductor wafer formed of a plurality of semiconductor chips formed with MEMS devices and wiring thereof on front surface t...	12/26/2006
7132745	Method for attaching shields on substrates A method (100) of attaching a shield (52 or 82) to a substrate (40) can include the steps of circumscribing a predetermined area on the substrate with a metallized trace pattern (26), applying (101) solder to the metallized ...	11/07/2006
7102224	Encapsulated component and method for the production thereof A component includes a chip having a first chip face and a second chip face, where the first chip face includes component structures and connector metallizations associated with the component structures. The component also includes a frame structure on the first chi...	09/05/2006
6703561	Header assembly having integrated cooling device A header assembly including a base and a platform extending through the base and substantially perpendicular thereto. The platform includes conductive pathways that connect electrical components on either side of the base, and the conductive pathways coop...	03/09/2004
6703704	Stress reducing stiffener ring An electronic structure and associated method of formation. A laminate is solderably coupled to an electronic carrier. A stiffener is adhesively attached to a portion of a surface of the laminate by a stiffener adhesive that is in physically adhesive cont...	03/09/2004
6696669	Circuit and method for heating an adhesive to package or rework a semiconductor die System for attaching a die to the die pad of a lead frame incorporating a resistive heating circuit into the die pad which heats up to cure an epoxy adhesive between the die and the pad and thereby attach the die to the pad. The heating circuit also heats...	02/24/2004
6693362	Multichip module having chips mounted on upper and under surfaces of a thin film closing an opening formed in a rigid substrate A multichip module is provided. The multichip module comprises a rigid substrate including a core material and having an opening, a thin film fixed on an upper surface of the rigid substrate so as to be electrically connected to the rigid substrate and to...	02/17/2004
6691911	Method for hermetic sealing of electronic parts There is provided a method of hermetically sealing electronic parts, comprising the step of bonding a base having semiconductor devices mounted thereon and a cap together via a solder. The solder is composed, by weight, of 78% or more but less than 79.5% ...	02/17/2004
6686653	Miniature microdevice package and process for making thereof The present invention is concerned with a miniature microdevice package and a process of making thereof. The package has a miniature frame substrate made of a material selected from the group including: ceramic, metal and a combination of ceramic and meta...	02/03/2004
6677185	Method of affixing a heat sink to a substrate and package thereof A method of affixing a heat sink to a substrate and package thereof having a substrate with a position for receiving a semiconductor chip, at least a semiconductor chip for affixing on the position and electrically connecting the substrate, an appropriate...	01/13/2004
6677187	Process for encapsulating an electrical or electronic component in a sealed manner An electrical or electronic component with sealed encapsulation includes a support for housing one or more electrical or electronic components from which electrically conducting tracks radiate towards a periphery of the support. Also included is a protect...	01/13/2004
6674159	Bi-level microelectronic device package with an integral window A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semicond...	01/06/2004
6665187	Thermally enhanced lid for multichip modules An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the ...	12/16/2003
6661090	Metal adhesion layer in an integrated circuit package In one embodiment, an integrated circuit packaging structure includes a first metal adhesion layer formed under a lid and a second metal adhesion layer formed over a substrate. The lid includes a free surface that may move a small amount without cracking....	12/09/2003
6661084	Single level microelectronic device package with an integral window A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semicond...	12/09/2003
6655020	Method of packaging a high performance chip A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included....	12/02/2003
6649443	System for facilitating alignment of silicon die In accordance with the present invention, a method is described which facilitates heat transfer from a silicon die after the silicon die is bonded to a substrate. An alignment tool is used to align the spacer with the silicon die. A thermal conductor can ...	11/18/2003
6639311	Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component A multilayer ceramic electronic component includes an electronic component body a notch formed in a side surface of the electronic component body, and a joining electrode formed by dividing a joining via hole conductor is formed at a portion of an inside ...	10/28/2003
6635953	IC chip package An IC chip package is constructed to comprise a substrate, a chip, adhesive means, and a cover. The substrate comprises a top side and a receiving chamber, the receiving chamber having an opening disposed in the top side. The top side of the substrate is ...	10/21/2003
6630725	Electronic component and method of manufacture An electronic component includes a substrate (210, 1510), a device (221, 222) supported by the substrate and including a first bond pad (223, 224, 225, 226), and a cap (231, 232, 631, 731, 732, 1531, 1532) overlying the substrate. The cap includes a secon...	10/07/2003
6627966	Method and device for sealing ceramic package of saw filter In a method and a device for sealing a ceramic package of a SAW (Surface Acoustic Wave) filter, when making a ceramic package of an environmentally sensitive SAW filter such as a SAW duplexer filter or a SAW filter, a first sealing is carried out between ...	09/30/2003
6617194	Electronic component, communication device, and manufacturing method for electronic component An electronic component includes an electronic component element and a package to house the electronic component element. The package includes a concave area in which the electronic component element is housed, an area for a sealing frame which is located...	09/09/2003
6614108	Electronic package and method therefor An electronic package and a method for packaging an electronic component, particularly a shock-sensitive component such as a yaw rate sensor or an accelerometer mounted to a circuit board. The package includes a case having an opening through which the ci...	09/02/2003
6611054	IC package lid for dose enhancement protection An integrated circuit package for use in radiation environments includes a base for receiving an integrated circuit die and has a peripheral surface for receiving a lid. The lid has an inner surface facing the die that has a cladding of a low atomic numbe...	08/26/2003
6608380	Semiconductor chip package having one or more sealing screws A semiconductor chip package comprising a chip with a lid having venting holes hermetically sealed with screws and a manufacturing method thereof are provided. The semiconductor chip package of the present invention comprises a chip such as a central proc...	08/19/2003

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Class 257/E23.193 - Characterized by material or arrangement of seals between parts, e.g., between cap and base of container or between leads and walls of container (EPO)