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| Number | Title | Issue Date |
| 7423333 | Cerdip type of solid-state image sensing device, structure and method for gripping cerdip type of solid-state image sensing device A cerdip type of solid-state image sensing device includes a base on which photoelectric transfer devices are arranged in line along a main scanning direction, a sealed glass disposed on the base for fixing a lead frame, a wind frame disposed on the sealed glass, a ... | 09/09/2008 |
| 7372159 | Semiconductor device A glass-sealed type semiconductor device has Dumet electrodes, a glass sealing member, and a semiconductor element tightly sealed in a cavity constituted by the Dumet electrodes and the glass sealing member. The semiconductor element is constituted by a Schottky bar... | 05/13/2008 |
| 7301224 | Surface acoustic wave device and manufacturing method of the same A surface acoustic wave device has a SAW device element 10 and a package 20 housing the SAW device element. The package includes a resin substrate 20 having metal patterns 21 and 22 formed on both surfaces thereof, and a resin cap ... | 11/27/2007 |
| 7294909 | Electronic package repair process A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and th... | 11/13/2007 |
| 7190051 | Chip level hermetic and biocompatible electronics package using SOI wafers The invention is directed to a hermetically packaged and implantable integrated circuit for electronics that is made by producing streets in silicon-on-insulator chips that are subsequently coated with a selected electrically insulating thin film prior to completing... | 03/13/2007 |
| 6930398 | Package structure for optical image sensing integrated circuits A package structure for optical image sensing devices is disclosed. The package structure includes an image sensing integrated circuit chip having a light receiving side and a backside. The image sensing integrated circuit chip has a light sensing area on the light ... | 08/16/2005 |
| 6569532 | Epoxy resin compositions and premolded semiconductor packages In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2 /g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 μ... | 05/27/2003 |
| 6525416 | Electronic devices and a sheet strip for packaging bonding wire connections of electronic devices and method for producing them An electronic device is described that has a sheet strip for packaging bonding wire connections of the electronic device and a method for producing it. To that end, the sheet strip, has at least two preformed, opposite edge regions which cover the edge re... | 02/25/2003 |
| 6524887 | Embedded recess in polymer memory package and method of making same The invention relates to packaging of a novel ferroelectric polymer memory device. Packaging is configured with a recess geometry into which the ferroelectric polymer memory device extends, that resists contact with the polymer portion of the ferroelectri... | 02/25/2003 |
| 6511866 | Use of diverse materials in air-cavity packaging of electronic devices Semiconductor circuit devices (dies) are incorporated into moisture-impenetrable electronic packages by forming enclosures around the die in three separate parts--base, sidewalls, and lid. The die is first soldered or otherwise bonded to the base, followe... | 01/28/2003 |
| 6399677 | Epoxy resin compositions and premolded semiconductor packages In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2 /g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 μ... | 06/04/2002 |
| 6207595 | Laminate and method of manufacture thereof A fabric material and method of its manufacture suitable for use in electronic packages including chip carriers. High insulation resistance is exhibited when subjected to high temperatures and humidity stress conditions.... | 03/27/2001 |
| 6127629 | Hermetically sealed microelectronic device and method of forming same A microelectronic device is hermetically sealed at the wafer level. A substrate is provided having associated electronics and at least one metal bonding pad. A dielectric layer, such as pyrex glass film, is sputter deposited atop the substrate to form a g... | 10/03/2000 |
| 6111199 | Integrated circuit package using a gas to insulate electrical conductors An integrated circuit package includes a number of electrical conductors that are completely or at least partially surrounded by a gas instead of a solid material (having no cavities) used in the prior art. Such use of a gas reduces the dielectric constan... | 08/29/2000 |
| 6111316 | Electronic component encapsulated in a glass tube An electronic component (10) is formed by encasing individual components within a glass tube (20). The individual components can include a semiconductor die (11), leads (12,13), and dumets (16,17). The glass tube (20) is transparent and melts at a tempera... | 08/29/2000 |
| 5827999 | Homogeneous chip carrier package A thermoplastic chip carrier cavity package for one or more semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP. A casing is further formed atop the substrate with the casing being made of ... | 10/27/1998 |
| 5801068 | Hermetically sealed microelectronic device and method of forming same A microelectronic device is hermetically sealed at the wafer level. A substrate is provided having associated electronics and at least one metal bonding pad. A dielectric layer, such as pyrex glass film, is sputter deposited atop the substrate to form a g... | 09/01/1998 |
| 5650593 | Thermally enhanced chip carrier package A thermally enhanced chip carrier package with a built-in heat sink for semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP with a center opening and a metal attachment ring for attaching a... | 07/22/1997 |
| 5623167 | Semiconductor device This invention aims at providing a glass package type capacitive element having a high reliability and a high resistance to heat and mechanical impact. In the glass package, a semiconductor device (2) is connected with a lead (5) through a conductor (8) h... | 04/22/1997 |
| 5561265 | Integrated circuit packaging A package is provided for an integrated circuit comprising a dielectric body enclosing the integrated circuit chip having a plurality of conductive terminal members extend through the dielectric body. The dielectric body includes a magnetic shielding laye... | 10/01/1996 |
| 5550403 | Improved laminate package for an integrated circuit and integrated circuit having such a package An integrated circuit package, and integrated circuit assembly having such a package, includes a base portion and a cover portion which cooperatively enclose an integrated circuit chip. The base and cover portions are formed of composite material and have... | 08/27/1996 |
| 5532513 | Metal-ceramic composite lid A lightweight composite lid for a package containing a semiconductor device formed of a porous ceramic body filled with a material having a thermal conductivity greater than air.... | 07/02/1996 |
| 5483740 | Method of making homogeneous thermoplastic semi-conductor chip carrier package A homogeneous thermoplastic semi-conductor chip carrier cavity package (HC package) which utilizes the same thermoplastic for various integral attachments to the HC package, such as, a molded lid and a circuit substrate. A chemical bonding or fusing of th... | 01/16/1996 |
| 5471011 | Homogeneous thermoplastic semi-conductor chip carrier package A homogeneous thermoplastic semi-conductor chip carrier cavity package (HC package) which utilizes the same thermoplastic for various integral attachments to the HC package, such as, a molded lid and a circuit substrate. A chemical bonding or fusing of th... | 11/28/1995 |
| 5412247 | Protection and packaging system for semiconductor devices A protection and packaging system for a semiconductor circuit having a first planar surface and an active region on at least a portion of the planar surface. An adhesive securely bonds a protective member directly to the first planar surface for generally... | 05/02/1995 |
| 5326932 | Semiconductor package A semiconductor package comprising a semiconductor chip received in and attached to a cavity of a base made of a ceramic or aluminum, by means of an adhesive, a lid fixedly attached to the upper surface of the semiconductor chip, the lid having a pluralit... | 07/05/1994 |
| 5285012 | Low noise integrated circuit package The present invention discloses a package for electronic components which reduces the unwanted electronic noise generated by the package and which can be fabricated by conventional manufacturing techniques. Accordingly, a lid for a package housing is fabr... | 02/08/1994 |
| 5213878 | Ceramic composite for electronic applications Machinable ceramic composites having a low dielectric constant. The composite comprises ceramic bubbles uniformly distributed throughout a ceramic matrix. These composites can be used as ceramic substrates and housings in electronic packaging, and as wind... | 05/25/1993 |
| 5140109 | Container package for semiconductor element Disclosed is a container package for a semiconductor element, which comprises a vessel having in the interior thereof a space for containing a semiconductor element, which comprises an insulating substrate and a lid member, an external lead terminal for c... | 08/18/1992 |
| 5108958 | Ceramic composite for electronic applications Machinable ceramic composites having a low dielectric constant. The composite comprises ceramic bubbles uniformly distributed throughout a ceramic matrix. These composites can be used as ceramic substrates and housings in electronic packaging, and as wind... | 04/28/1992 |
| 5107328 | Packaging means for a semiconductor die having particular shelf structure A ceramic or plastic body has a shelf comprising conductive traces. A semiconductor die is attached to the underside of the shelf, or to a base of the body. A void or voids in said shelf allows the passage of bond wires to couple the bond pads of the infe... | 04/21/1992 |
| 5061987 | Silicon substrate multichip assembly A multichip electronic package uses a silicon substrate for chip mounting and interconnects, micro-machined inverted and non-inverted truncated vias for intrinsically hermetically sealed I/O connections, and an anodically bonded silicon cover, with suppor... | 10/29/1991 |
| 5043535 | Hermetic cerglass and cermet electronic packages The invention relates to a process for coating sintered cermet or cerglass articles with a metal or metal alloy. The process is particularly useful to eliminate pores and cavities from the surface of the article. During hermeticity testing, these pores an... | 08/27/1991 |
| 4958216 | Package for housing semiconductor elements Disclosed is a package for housing semiconductor elements, which comprises an insulating substrate having in the interior thereof a cavity for attaching and housing semiconductor elements and a lid member covering said cavity, wherein the insulating subst... | 09/18/1990 |
| 4926238 | Semiconductor device and method for producing the same A semiconductor device wherein a coating film which is made of a polyimide resin or a polyimide isoindoloquinazolinedione resin and which is at least 10 μm thick is disposed on at least an active region of a semiconductor substrate, and the resultant sem... | 05/15/1990 |
| 4907065 | Integrated circuit chip sealing assembly An integrated circuit (IC) chip package is formed by extending the overall dimensions of a standard IC on a semiconductor substrate, typically a first silicon wafer, to provide an integral band of semiconductor material therearound on which are formed a s... | 03/06/1990 |
| 4905075 | Hermetic semiconductor enclosure A semiconductor hermetic package for semiconductor device comprises base, sidewall and cover members. Signals can be coupled between the enclosed devices and external devices by coupling means including conductive regions disposed in and through the packa... | 02/27/1990 |
| 4855808 | Hermetic glass chip carrier A hermetically sealed glass chip carrier includes an outer glass ring and an inner glass base in which leads to the inner glass base pass between the ring and the base, with the ring, base and leads being sealed together by melting the glass in the vicini... | 08/08/1989 |
| 4831495 | Unitized packaging arrangement for an energy dissipating device A unitized packaging arrangement for an energy dissipating device comprises a thermoplastic housing, base, and cap which are joined together to form the package for the device. The thermoplastic housing is formed to mountably receive the energy dissipatin... | 05/16/1989 |
| 4780572 | Device for mounting semiconductors A device containing a semiconductor element having a substrate a cap over the substrate with a glass layer formed between the cap and the substrate providing a seal therebetween. Electrically conducting terminal members extend through the glass layer and ... | 10/25/1988 |
