Bizarre Patents
Neuroimaging as a Marketing Tool
Neuroimaging as a means for validating whether a stimulus such as advertisement, communication, or product evokes a certain mental response such as emotion, preference, or memory, or to predict the consequences of the stimulus on later behavior such as consumption or purchasing.
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| Number | Title | Issue Date |
| 7300823 | Apparatus for housing a micromechanical structure and method for producing the same Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure ... | 11/27/2007 |
| 7112877 | High density package with wrap around interconnect A high density electrical interconnecting system of the present invention has at least one substrate piece and a flexible wrap-around interconnect assembly extending from a first surface of the substrate piece to a second surface of the substrate piece wherein the f... | 09/26/2006 |
| 6611054 | IC package lid for dose enhancement protection An integrated circuit package for use in radiation environments includes a base for receiving an integrated circuit die and has a peripheral surface for receiving a lid. The lid has an inner surface facing the die that has a cladding of a low atomic numbe... | 08/26/2003 |
| 6596139 | Discontinuous high-modulus fiber metal matrix composite for physical vapor deposition target backing plates and other thermal management applications The invention includes the use of a high-modulus fiber metal matrix composite material as a backing plate for physical vapor deposition targets, as a lid for microelectronics packages, as a heat spreader, and as a heat sink. In one implementation, copper-... | 07/22/2003 |
| 6566748 | Flip-chip semiconductor device having an improved reliability A BGA semiconductor device includes a package substrate carrying thereon a semiconductor chip in a face-down state and a cap member covering the semiconductor chip on the package substrate, wherein the cap member has a optimized Young modulus smaller than... | 05/20/2003 |
| 6493231 | Electrical apparatus A housing for a microwave circuit is formed from a base made of metal matrix composite material and walls made of sheet metal. The base and the walls are joined together by diffusion soldering. Some holes to receive feedthroughs are formed at the junction... | 12/10/2002 |
| 6489558 | Conductive cap, electronic component, and method of forming insulating film of conductive cap A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an el... | 12/03/2002 |
| 6452263 | Radiation shield and radiation shielded integrated circuit device A radiation shielded integrated circuit device comprises an integrated circuit die and a first layer of shielding material supporting the integrated circuit die. The first layer has a central portion having a first thickness having an area at least as lar... | 09/17/2002 |
| 6312535 | Silicon alloys for electronic packaging A method of producing a silicon based alloy is described which comprises melting a silicon alloy containing greater than 50 wt. % silicon and preferably including aluminium. The melted alloy is then inert gas atomized to produce powder or a spray formed d... | 11/06/2001 |
| 6295205 | Explosion protection for semiconductor modules A high-power semiconductor module having a casing which encloses at least one semiconductor element has an explosion protection element. This explosion protection element is a protective sheath which surrounds at least a portion of the casing and traps fr... | 09/25/2001 |
| 6194789 | Flexible hermetic sealing A flexible hermetic sealing and method for making the same. Electronic components are coated with an adhesive such as an epoxy, and then a metallic layer consisting of gold, silver, nickel, or another metal is deposited thereon. The metal may be deposited... | 02/27/2001 |
| 6159772 | Packaging electrical circuits A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to est... | 12/12/2000 |
| 6119923 | Packaging electrical circuits A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to est... | 09/19/2000 |
| 6111316 | Electronic component encapsulated in a glass tube An electronic component (10) is formed by encasing individual components within a glass tube (20). The individual components can include a semiconductor die (11), leads (12,13), and dumets (16,17). The glass tube (20) is transparent and melts at a tempera... | 08/29/2000 |
| 6096981 | Packaging electrical circuits A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator is set forth. The structure also includes an integrated power device having a power-dissipating elect... | 08/01/2000 |
| 6054766 | Package for enclosing microoptical and/or microelectronic devices so as to minimize the leakage of microwave electromagnetic radiation The invention relates to a package for microoptical and/or microelectronic devices. The package is to be designed in such a way that package resonances initiated by standing waves produced in the package are completely avoided or very highly attenuated. T... | 04/25/2000 |
| 5998733 | Graphite aluminum metal matrix composite microelectronic package An electronic package includes a graphite-aluminum metal matrix composite (MMC) housing or support member that dissipates heat from an electronic component or circuit and a hermetic glass feedthrough seal between the graphite-aluminum MMC material and one... | 12/07/1999 |
| 5906310 | Packaging electrical circuits A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to est... | 05/25/1999 |
| 5889220 | Copper-tungsten alloys and their manufacturing methods Copper-tungsten alloys used for materials of electrode, electric contacts, package materials for semiconductors, heat sink and their manufacturing methods. The copper-tungsten alloy contains preferably 5 to 30 wt. % of copper, 0.002 to 0.04 wt. % of phosp... | 03/30/1999 |
| 5825085 | Power semiconductor device, armoring case thereof and method for manufacturing the same The present invention implements an armoring case of a power semiconductor device which can prevent cracks from occurring by inserting the terminal portion of an electrode plate in the inserting hole of the armoring case and then bending the same, misregi... | 10/20/1998 |
| 5808358 | Packaging electrical circuits A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to est... | 09/15/1998 |
| 5789810 | Semiconductor cap A method for manufacturing a cap for use in a semiconductor package is disclosed. The semiconductor package includes a semiconductor chip and a substrate. The chip is mounted with the substrate at a chip locus. The method preferably comprises the steps of... | 08/04/1998 |
| 5775403 | Incorporating partially sintered preforms in metal matrix composites A method of fabricating MMCs having high thermal conductivity coupled with coefficient of thermal expansion (CTE) values which approximates the CTE of ceramics and semi-conductor materials typically used in electronic packaging. The method comprises prepa... | 07/07/1998 |
| 5773879 | Cu/Mo/Cu clad mounting for high frequency devices The semiconductor package and manufacturing method thereof whereby the inexpensive package of high thermal conductivity is obtained by applying a Cu/Mo/Cu clad material for a base plate which matches the thermal expansion of a semiconductor chip, and the ... | 06/30/1998 |
| 5700724 | Hermetically sealed package for a high power hybrid circuit A metal ring frame, having co-fired ceramic inserts, is hermetically sealed to a copper/molybdenum base using a brazing alloy having a melting temperature which is approximately the cross-over temperature for the TCE curves of the base and ring frame. Pre... | 12/23/1997 |
| 5650592 | Graphite composites for electronic packaging There is provided a component for use in electronic packaging. The component is a composite having a graphite matrix which is infiltrated with a metal or a metal alloy and the external surfaces of the composite then coated with a metallic layer to provide... | 07/22/1997 |
| 5574959 | Metal casing for semiconductor device having high thermal conductivity and thermal expansion coefficient A metal casing for a semiconductor device is manufactured by a powder metallurgy injection molding process which uses infiltration. The metal casing includes a base member and an enclosure member arranged on the base member. The base member and the enclos... | 11/12/1996 |
| 5480727 | Electronic device assembly and method for making A single, integral Metal Matrix Composite structure (47) includes a base plate (11), circuit layer (25), and lead supports (30,32), forming the single integral structure (47). Such a structure is particularly suited for power module applications. The vari... | 01/02/1996 |
| 5465481 | Method for fabricating a semiconductor package A semiconductor package (100) and module (300) includes a unitary base structure (101) and alignment mechanisms (104). The unitary base structure (101) includes a semiconductor mounting area (102) and encircling walls (103). The structure provides resista... | 11/14/1995 |
| 5275782 | Housing for semiconductor device A housing for a semiconductor device is improved to avoid thermal distortions. The housing is formed of an Al-Si compound material and includes a housing member having a space for holding the semiconductor device. Occlusion gas contained in the Al-Si comp... | 01/04/1994 |
| 5155299 | Aluminum alloy semiconductor packages The present invention relates to a packagae adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum based alloy. At least a portion of the surfaces of the package components are a... | 10/13/1992 |
| 5132779 | Housing for semiconductor device with occlusion gas removed A housing for a semiconductor device is improved to avoid thermal distortion. The housing is formed of an Al-Si compound material and includes a housing member having a space for holding the semiconductor device. Occlusion gas contained in the Al-Si compo... | 07/21/1992 |
| 5023398 | Aluminum alloy semiconductor packages The present invention relates to a package adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum based alloy. At least a portion of the surfaces of the package components are an... | 06/11/1991 |
| 4967260 | Hermetic microminiature packages A hermetic tape package and a process for forming the hermetic tape package are disclosed. The package is capable of high lead densities and occupies a minimum of space. A test frame is incorporated into the package to permit testing of an electronic devi... | 10/30/1990 |
| 4939316 | Aluminum alloy semiconductor packages The present invention relates to a package adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum or an aluminum based alloy. At least a portion of the surfaces of the package co... | 07/03/1990 |
| 4888449 | Semiconductor package A semiconductor package for an electrical component which has a metal or metal alloy leadframe with first and second surface, which leadframe is adapted to have an electrical component connected thereto. The leadframe is bonded by means of a polymer to a ... | 12/19/1989 |
| 4806704 | Metal matrix composite and structure using metal matrix composites for electronic applications The invention relates to a metal matrix composite used to support and/or enclose discrete electronic semiconductor devices, monolithic integrated circuits, hybrid circuits, and multi-layer printed wiring boards. The matrices herein disclosed employ alumin... | 02/21/1989 |
| 4805009 | Hermetically sealed semiconductor package The present invention is directed to several embodiments of a hermetically sealed semiconductor package. One embodiment is constructed from a substrate of a first copper alloy, a cover member of a second copper alloy and a lead frame of a third copper all... | 02/14/1989 |
| 4760440 | Package for solid state image sensors A package for solid state image sensor devices, such as CCD image sensors, includes a base plate on which a plurality of the image sensor devices are mounted in end-to-end abutting relation with the detector arrays of the image sensors being over an openi... | 07/26/1988 |
| 4666796 | Plated parts and their production Plated metal parts, such as sealing lids for semiconductor packages, in which an iron-based alloy layer is electroplated with a first layer of nickel, a first layer of gold is electroplated on the first nickel layer, a second layer of nickel is electropla... | 05/19/1987 |
