Did You Know...
...When G.G. Hubbard learned of his future son-in-law's invention, he called it "only a toy." His daughter was engaged to a young man named Alexander Graham Bell.
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| Number | Title | Issue Date |
| 7436056 | Electronic component package An electronic component package includes a dielectric substrate having a first surface where an electronic component is sealed. A first signal line connecting to the electronic component and a first ground conductor are formed on the first surface of the dielectric ... | 10/14/2008 |
| 7348663 | Integrated circuit package and method for fabricating same A process for fabricating an integrated circuit package includes: selectively etching a first side of a substrate thereby providing etched regions of the substrate to partially define at least a plurality of contact pads; adding a dielectric material to the etched r... | 03/25/2008 |
| 7262491 | Die pad for semiconductor packages and methods of making and using same A semiconductor device package comprising a semiconductor device and an electrically conductive lead frame at least partially covered by a molding compound. The electrically conductive lead frame includes a plurality of leads disposed proximate a perimeter of the pa... | 08/28/2007 |
| 7262498 | Assembly with a ring and bonding pads formed of a same material on a substrate An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material. ... | 08/28/2007 |
| 7239024 | Semiconductor package with recess for die A semiconductor package is disclosed with a recess (51) for an integrated circuit die (52). The recess is made by bending or deforming all layers of a package substrate, and therefore the recess contains circuitry to connect to the integrated circuit d... | 07/03/2007 |
| 7154173 | Semiconductor device and manufacturing method of the same This invention miniaturizes a package of a semiconductor device and simplifies a manufacturing procedure to reduce a manufacturing cost. A semiconductor wafer formed of a plurality of semiconductor chips formed with MEMS devices and wiring thereof on front surface t... | 12/26/2006 |
| 6933523 | Semiconductor alignment aid An alignment aid for semiconductor devices. The alignment aid includes an area having a high level of reflectivity and an adjacent area having a of low level of reflectivity. The area having a low level of reflectivity includes at least one layer of tiles located in... | 08/23/2005 |
| 6703561 | Header assembly having integrated cooling device A header assembly including a base and a platform extending through the base and substantially perpendicular thereto. The platform includes conductive pathways that connect electrical components on either side of the base, and the conductive pathways coop... | 03/09/2004 |
| 6680217 | Apparatus for providing mechanical support to a column grid array package An apparatus for providing mechanical support to a column grid array package is disclosed. The column grid array package uses solder columns to provide electrical connections between a ceramic substrate and a printed circuit board. The ceramic substrate h... | 01/20/2004 |
| 6649991 | Image sensor semiconductor package A non-ceramic image sensor semiconductor package with improved moisture resistance, lower cost, higher reliability, and lower profile is provided. A semiconductor chip with a vision chip active area is attached to a multi-layer resin mask organic substrat... | 11/18/2003 |
| 6646356 | Apparatus for providing mechanical support to a column grid array package An apparatus for providing mechanical support to a column grid array package is disclosed. The column grid array package uses solder columns to provide electrical connections between a ceramic substrate and a printed circuit board. The ceramic substrate h... | 11/11/2003 |
| 6613978 | Radiation shielding of three dimensional multi-chip modules A method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention de... | 09/02/2003 |
| 6603193 | Semiconductor package A semiconductor package having a molded body and a plurality of conductive pins that extend from the bottom of the molded body. The semiconductor package further includes a RF shield around a protected cavity that holds a first integrated circuit. The mol... | 08/05/2003 |
| 6583432 | Methods and compositions for ionizing radiation shielding The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied ... | 06/24/2003 |
| 6580031 | Method for making a flexible circuit interposer having high-aspect ratio conductors A low-modulus-of-elasticity flexible adhesive interposer substrate has high aspect ratio via conductors to which an electronic device, such as a semiconductor chip or die or other component, is attached, e.g., for a high density electronic package. A meth... | 06/17/2003 |
| 6577000 | Premold type semiconductor package A premold type semiconductor package includes a plurality of leads arranged side by side and having upper and lower common surfaces, a mold resin integrally molded with the leads for securing them from the upper and lower surfaces thereof. The mold resin ... | 06/10/2003 |
| 6569755 | Semiconductor device having an improved structure for preventing cracks, improved small sized semiconductor and method of manufacturing the same According to a typical invention of the inventions disclosed in the present application, a semiconductor chip with an electronic circuit formed therein is fixed to a die pad for a lead frame having projections formed on the back thereof, with an organic d... | 05/27/2003 |
| 6567270 | Semiconductor chip package with cooling arrangement A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof ... | 05/20/2003 |
| 6558966 | Apparatus and methods of packaging and testing die Apparatus and methods of packaging and testing die. In one embodiment, a stacked die package includes a packaging substrate having a first surface with a recess disposed therein and a plurality of conductive leads coupled thereto, a first die attached to ... | 05/06/2003 |
| 6552423 | Higher-density memory card A high-density memory card comprises a base card and two packages fixedly mounted within the base card. The two packages are attached to the base card and face each other. In one embodiment, a first package comprises a first substrate and at least one mem... | 04/22/2003 |
| 6521482 | Manufacturing method for a semiconductor device A method of manufacturing individual semiconductor devices by forming island sections 26 on the surface of a common substrate 21, forming electrodes 27 and 28 one on either side of each island section 26, die bonding a semiconductor chip 29 to each island... | 02/18/2003 |
| 6518501 | Electronic part and method of assembling the same An electronic part in which a surface acoustic wave device or the like is packaged by using a resin. The electronic part has a resin base in which a lead frame and a resin are integrally molded, a surface acoustic wave device or the like mounted on the to... | 02/11/2003 |
| 6512302 | Apparatus and methods of packaging and testing die Apparatus and methods of packaging and testing die. In one embodiment, a stacked die package includes a packaging substrate having a first surface with a recess disposed therein and a plurality of conductive leads coupled thereto, a first die attached to ... | 01/28/2003 |
| 6492715 | Integrated semiconductor package The present invention provides an integrated semiconductor module comprising a chip, interposer, and substrate. The module is adapted to be mounted on a traditional circuit card carrying multiple other components. The chip of the present invention can be ... | 12/10/2002 |
| 6492726 | Chip scale packaging with multi-layer flip chip arrangement and ball grid array interconnection In accordance with the objectives of the invention a new package is provided that is provided with a cavity that is shaped such that more than one semiconductor device can in a vertical direction be mounted in the cavity of the package. The devices that a... | 12/10/2002 |
| 6483128 | Connecting device for power semiconductor modules with compensation for mechanical stresses A connecting device for power semiconductor modules with compensation for mechanical stresses includes a sleeve connected to a substrate and having a region with a given very small diameter. A wire pin is provided for insertion into the region of the slee... | 11/19/2002 |
| 6459145 | Semiconductor device having an improved structure for preventing cracks, and improved small-sized semiconductor According to a typical invention of the inventions disclosed in the present application, a semiconductor chip with an electronic circuit formed therein is fixed to a die pad for a lead frame having projections formed on the back thereof, with an organic d... | 10/01/2002 |
| 6455864 | Methods and compositions for ionizing radiation shielding The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied ... | 09/24/2002 |
| 6452263 | Radiation shield and radiation shielded integrated circuit device A radiation shielded integrated circuit device comprises an integrated circuit die and a first layer of shielding material supporting the integrated circuit die. The first layer has a central portion having a first thickness having an area at least as lar... | 09/17/2002 |
| 6445062 | Semiconductor device having a flip chip cavity with lower stress and method for forming same There is provided a semiconductor device including (a) a substrate, (b) a semiconductor chip mounted on the substrate, (c) a wall having a closed cross-section and mounted on the substrate such that the semiconductor chip is surrounded by the wall, and (d... | 09/03/2002 |
| 6410981 | Vented semiconductor device package having separate substrate, strengthening ring and cap structures A packaged semiconductor device having high reliability that allows for a large number of pins and that provides good heat removal properties, and that can discharge the high pressure moisture in a gas state from the inside thereof to the exterior. The de... | 06/25/2002 |
| 6407448 | Stackable ball grid array semiconductor package and fabrication method thereof A stackable Ball Grid Array (BGA) semiconductor chip package and a fabrication method thereof increases reliability and mount density of a semiconductor package. The stackable BGA semiconductor chip package includes a supporting member that includes a sup... | 06/18/2002 |
| 6404643 | Article having an embedded electronic device, and method of making same A card has an electronic device, such as an integrated circuit, a conductive, resistive or capacitive network, or other electronic device, embedded therein. The card, sometimes referred to as a "smart card," has the electronic device mounted to a substrat... | 06/11/2002 |
| 6404611 | Single-chip integrated circuit module A single-chip IC module comprises a package including a header (11) made in the form of a flat plate with vias (20) along its periphery within a predetermined coordinate grid, in which vias are fastened pins of output terminal (2), on the header is fixed ... | 06/11/2002 |
| 6384472 | Leadless image sensor package structure and method for making the same A leadless image sensor package constructed on a lead frame includes a die pad and a plurality of leads disposed at the periphery of the die pad. A molding compound, disposed on the top surface of the lead frame and being surrounding the die pad on the pe... | 05/07/2002 |
| 6381838 | BGA package and method of manufacturing the same A BGA package includes a semiconductor chip, and a PCB having a board body, a plurality of circuit patterns, a plurality of signal via holes, a solder resist, and a plurality of thermal emissive vias. The thermal emissive vias are holes located beneath a ... | 05/07/2002 |
| 6380631 | Apparatus and methods of packaging and testing die Apparatus and methods of packaging and testing die. In one embodiment, a stacked die package includes a packaging substrate having a first surface with a recess disposed therein and a plurality of conductive leads coupled thereto, a first die attached to ... | 04/30/2002 |
| 6376769 | High-density electronic package, and method for making same A high density electronic package includes a low-modulus-of-elasticity flexible adhesive interposer substrate to which an electronic device, such as a semiconductor chip or die or other component, is attached. The flexible adhesive interposer substrate in... | 04/23/2002 |
| 6365433 | Semiconductor device and manufacturing method thereof A semiconductor device having an overcurrent protection element therein is provided. The device comprises: a substrate having first and second main surfaces; a semiconductor chip fixed to the first main surface of the substrate; a fuse element fixed to th... | 04/02/2002 |
| 6353420 | Wireless article including a plural-turn loop antenna A wireless article, such as an identification tag of badge, containing an electronic device includes on a substrate thereof a plural-turn loop antenna for receiving and/or transmitting radio frequency signals. Because the spacing of the loop antenna termi... | 03/05/2002 |
