Celebrity Inventors
Mark Twain (Samuel L. Clemens) received Patent No. 121,992 for "An Improvement in Adjustable and Detachable Straps for Garments." He later received two more patents: one for a self-pasting scrapbook and one for a game to help players remember important historical dates.
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| Number | Title | Issue Date |
| 7436056 | Electronic component package An electronic component package includes a dielectric substrate having a first surface where an electronic component is sealed. A first signal line connecting to the electronic component and a first ground conductor are formed on the first surface of the dielectric ... | 10/14/2008 |
| 7298046 | Semiconductor package having non-ceramic based window frame A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled ... | 11/20/2007 |
| 7256431 | Insulating substrate and semiconductor device having a thermally sprayed circuit pattern An insulating substrate includes a metal base as a base member, an insulating layer which is a room temperature, aerosol deposited shock solidification film formed on the metal base, and a circuit pattern which is a cold sprayed thermal spray coating formed on the i... | 08/14/2007 |
| 6702624 | Electronic component in which an insert member is tightly held by a resin portion and prevented from deformation thereof An electronic component has an insert member embedded in a resin portion by an insert molding method, with a part of the insert member exposed at an outer surface of the resin portion. At least a part of the exposed portion of the insert member is depress... | 03/09/2004 |
| 6703702 | IC chip mounting structure and display device IC CHIP MOUNTING STRUCTURE has IC chips having protruding electrodes, a flexible printed circuit board having conductors connected to the protruding electrodes of the IC chips, and a protective plate attached to the flexible printed circuit board. The pro... | 03/09/2004 |
| 6696752 | Encapsulated semiconductor device with flash-proof structure An encapsulated semiconductor device includes a lead frame formed with a flash-proof body. The flash-proof body includes a dam bar formed on atop surface of the lead frame and a tape adhered to a bottom surface of the lead frame, where the dam bar is atta... | 02/24/2004 |
| 6691398 | Electronic packaging device and method A device for electrically interconnecting and packaging electronic components and method for manufacturing the device. A non-conducting base member having a component recess and a plurality of specially shaped lead channels formed therein is provided. At ... | 02/17/2004 |
| 6661089 | Semiconductor package which has no resinous flash formed on lead frame and method for manufacturing the same Disclosed is a semiconductor package which has no resinous flash formed on a lead frame and its manufacturing method. The method includes the steps of preparing a lead frame having a first surface and a second surface, attaching an adhesive tape capable o... | 12/09/2003 |
| 6649834 | Injection molded image sensor and a method for manufacturing the same An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a... | 11/18/2003 |
| 6635953 | IC chip package An IC chip package is constructed to comprise a substrate, a chip, adhesive means, and a cover. The substrate comprises a top side and a receiving chamber, the receiving chamber having an opening disposed in the top side. The top side of the substrate is ... | 10/21/2003 |
| 6617677 | Electric or electronic component and method of manufacturing such a component To provide an electric or electronic component (100) comprising a carrier substrate (10) of a semiconducting or insulating material, at least a recess (12), particularly a cavity or indentation provided in the carrier substrate (10), at least a component ... | 09/09/2003 |
| 6617194 | Electronic component, communication device, and manufacturing method for electronic component An electronic component includes an electronic component element and a package to house the electronic component element. The package includes a concave area in which the electronic component element is housed, an area for a sealing frame which is located... | 09/09/2003 |
| 6613978 | Radiation shielding of three dimensional multi-chip modules A method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention de... | 09/02/2003 |
| 6583432 | Methods and compositions for ionizing radiation shielding The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied ... | 06/24/2003 |
| 6577000 | Premold type semiconductor package A premold type semiconductor package includes a plurality of leads arranged side by side and having upper and lower common surfaces, a mold resin integrally molded with the leads for securing them from the upper and lower surfaces thereof. The mold resin ... | 06/10/2003 |
| 6555756 | Printed wiring board having cavity for mounting electronic parts therein and method for manufacturing thereof A printed wiring board (1) having a cavity (20) for mounting electronic parts therein and a method for manufacturing thereof, comprising: an upper wiring substrate (1A) having flat surfaces on both sides; a lower plate body (1B) being fixed on a reverse s... | 04/29/2003 |
| 6555900 | Package, semiconductor device and method for fabricating the semiconductor device A package according to the present invention includes: a support for mounting a semiconductor component on the upper surface thereof; a positioning control plate, which is secured to the support and includes an opening or a notch; and a lead provided on t... | 04/29/2003 |
| 6538322 | Semiconductor device in a recess of a semiconductor plate A semiconductor device provided with one or more semiconductor pellets arranged on the bottom surface of a recess produced along a surface of a semiconductor plate having wirings arranged on the surface thereof, wirings extending toward the surface of the... | 03/25/2003 |
| 6534711 | Encapsulation package and method of packaging an electronic circuit module A package (104) for encapsulating electronic components (102, 122, 550, 660) has at least two chambers (112, 212). Electronic components and modules within the chambers are interconnected by a leadframe (130) extending between the two chambers. One chambe... | 03/18/2003 |
| 6525416 | Electronic devices and a sheet strip for packaging bonding wire connections of electronic devices and method for producing them An electronic device is described that has a sheet strip for packaging bonding wire connections of the electronic device and a method for producing it. To that end, the sheet strip, has at least two preformed, opposite edge regions which cover the edge re... | 02/25/2003 |
| 6524887 | Embedded recess in polymer memory package and method of making same The invention relates to packaging of a novel ferroelectric polymer memory device. Packaging is configured with a recess geometry into which the ferroelectric polymer memory device extends, that resists contact with the polymer portion of the ferroelectri... | 02/25/2003 |
| 6522544 | Power module A power module includes a box-shaped smoothing capacitor (20) for smoothing a DC supply voltage to be externally applied to a power semiconductor device (5). The smoothing capacitor (20) is in contact with a side surface of a case frame (6) including a si... | 02/18/2003 |
| 6518501 | Electronic part and method of assembling the same An electronic part in which a surface acoustic wave device or the like is packaged by using a resin. The electronic part has a resin base in which a lead frame and a resin are integrally molded, a surface acoustic wave device or the like mounted on the to... | 02/11/2003 |
| 6512175 | Electronic packaging device A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a plurality of specially shaped lead channels formed therein is provided. At least one electronic component is dispos... | 01/28/2003 |
| 6509633 | IC package capable of accommodating discrete devices An IC (Integrated Circuit) package includes a package body having a cavity formed for receiving an IC chip therein. A terrace protrudes from at least part of the edges defining the cavity into the cavity. Discrete devices can be mounted on the terrace, i.... | 01/21/2003 |
| 6493231 | Electrical apparatus A housing for a microwave circuit is formed from a base made of metal matrix composite material and walls made of sheet metal. The base and the walls are joined together by diffusion soldering. Some holes to receive feedthroughs are formed at the junction... | 12/10/2002 |
| 6475832 | Open-cavity semiconductor die package A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end ... | 11/05/2002 |
| 6459149 | Electronic component, communication device, and manufacturing method for electronic component An electronic component includes an electronic component element and a package to house the electronic component element. The package includes a concave area in which the electronic component element is housed, an area for a sealing frame which is located... | 10/01/2002 |
| 6455864 | Methods and compositions for ionizing radiation shielding The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied ... | 09/24/2002 |
| 6429047 | Semiconductor package which has no resinous flash formed on lead frame and method for manufacturing the same Disclosed is a semiconductor package which has no resinous flash formed on lead frame and its manufacturing method. The method includes the steps of preparing a lead frame having a first surface and a second surface, attaching an adhensive tape capable of... | 08/06/2002 |
| 6420782 | Vertical ball grid array integrated circuit package An integrated circuit package (30, 32) for vertical attachment as part of a high density module (200) comprising a carrier (70) having an opening (86), routing strips (82), conduits (84) and side surface terminals (100), the side surface terminals (100) d... | 07/16/2002 |
| 6400009 | Hermatic firewall for MEMS packaging in flip-chip bonded geometry A package for hermetically sealing a micro-electromechanical systems (MEMS) device in a hybrid circuit comprise a firewall formed on a substrate for the MEMS device and which has a height defining a cavity of the package in which the MEMS device will be s... | 06/04/2002 |
| 6395983 | Electronic packaging device and method A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a plurality of specially shaped lead channels formed therein is provided. At least one electronic component is dispos... | 05/28/2002 |
| 6392309 | Semiconductor device including solid state imaging device A semiconductor device such as a solid state imaging device has a semiconductor chip mounted on a bottom surface of a cavity of a hermetic sealed box-shaped resin-molded package. The device comprises a radiator plate provided in a bottom wall of the packa... | 05/21/2002 |
| 6362530 | Manufacturing methods and construction for integrated circuit packages A method of forming an integrated circuit package includes providing a flip chip integrating circuit die having a first plurality of contacts for electrically connecting the die to other elements. A second plurality of contacts for electrically connecting... | 03/26/2002 |
| 6353257 | Semiconductor package configuration based on lead frame having recessed and shouldered portions for flash prevention A semiconductor package configuration is proposed for use to pack an semiconductor chip of an optically-sensitive type, such as an image-sensor chip or an ultraviolet-sensitive EP-ROM chip. This type of semiconductor chips are encapsulated in an encapsula... | 03/05/2002 |
| 6340792 | Mold cap for semiconductor device mold package In a semiconductor device mold package composed of a mold cap and a mold case both of which are formed of a resin compound and which are joined to each other to form a hollow inner space defined and encapsulated by the mold cap and the mold case, the mold... | 01/22/2002 |
| 6340842 | Semiconductor device in a recess of a semiconductor plate A semiconductor device provided with one or more semiconductor pellets arranged on the bottom surface of a recess produced along a surface of a semiconductor plate having wirings arranged on the surface thereof, wirings extending toward the surface of the... | 01/22/2002 |
| 6333211 | Process for manufacturing a premold type semiconductor package using support pins in the mold and external connector bumps A premold type semiconductor package includes a plurality of leads arranged side by side and having upper and lower common surfaces, a mold resin integrally molded with the leads for securing them from the upper and lower surfaces thereof. The mold resin ... | 12/25/2001 |
| 6329594 | Integrated circuit package In an integrated circuit package, the density of the I/O leads is increased by implementing the I/O leads by means of flexible circuits. Flexible circuits comprise thin sheets of insulating material on which the I/O leads are formed by photoetching. A con... | 12/11/2001 |
