Bizarre Patents
Decorative Jeweled Wheel Cover
An improved wheel is provided wherein decorative items such as gem stones are embedded in either the wheel surface, a special mounting section attached to the wheel surface, or to a spoke strap that wraps around each spoke and positions embedded gem stones on the outside surface of the spoke.
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| Number | Title | Issue Date |
| 7423333 | Cerdip type of solid-state image sensing device, structure and method for gripping cerdip type of solid-state image sensing device A cerdip type of solid-state image sensing device includes a base on which photoelectric transfer devices are arranged in line along a main scanning direction, a sealed glass disposed on the base for fixing a lead frame, a wind frame disposed on the sealed glass, a ... | 09/09/2008 |
| 7408250 | Micromirror array device with compliant adhesive A microstructure is packaged with a device substrate of the microstructure being attached to a package substrate. For dissipating possible deformation of the microstructure, which may result in device failure or quality degradation of the microstructure, an adhesive... | 08/05/2008 |
| 7342263 | Circuit device A circuit device is provided which can be manufactured at reduced costs and which is highly reliable. The circuit device includes a Sensor area formed on part of a semiconductor substrate, a circuit area formed around the sensor area on the semiconductor substrate t... | 03/11/2008 |
| 7301224 | Surface acoustic wave device and manufacturing method of the same A surface acoustic wave device has a SAW device element 10 and a package 20 housing the SAW device element. The package includes a resin substrate 20 having metal patterns 21 and 22 formed on both surfaces thereof, and a resin cap ... | 11/27/2007 |
| 7274095 | Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as ... | 09/25/2007 |
| 7166911 | Packaged microchip with premolded-type package A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. ... | 01/23/2007 |
| 6683370 | Semiconductor component and method of manufacturing same A semiconductor component includes a non-leaded leadframe (100, 200, 300) having at least one interior electrical contact (110) and a plurality of exterior electrical contacts (120), a semiconductor chip (410) mounted onto the leadframe, a mold compound (... | 01/27/2004 |
| 6674159 | Bi-level microelectronic device package with an integral window A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semicond... | 01/06/2004 |
| 6661084 | Single level microelectronic device package with an integral window A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semicond... | 12/09/2003 |
| 6635953 | IC chip package An IC chip package is constructed to comprise a substrate, a chip, adhesive means, and a cover. The substrate comprises a top side and a receiving chamber, the receiving chamber having an opening disposed in the top side. The top side of the substrate is ... | 10/21/2003 |
| 6614110 | Module with bumps for connection and support An electronic packaging module for inverted bonding of electronic devicss including semiconductor devices, integrated circuits, application specific integrated circuits, electomechanical devices and MEMS is produced with protuberances on the conductive pa... | 09/02/2003 |
| 6538312 | Multilayered microelectronic device package with an integral window An apparatus for packaging of microelectronic devices is disclosed, wherein the package includes an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS de... | 03/25/2003 |
| 6495895 | Bi-level multilayered microelectronic device package with an integral window A bi-level, multilayered package with an integral window for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be ... | 12/17/2002 |
| 6489670 | Sealed symmetric multilayered microelectronic device package with integral windows A sealed symmetric multilayered package with integral windows for housing one or more microelectronic devices. The devices can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayere... | 12/03/2002 |
| 6384473 | Microelectronic device package with an integral window An apparatus for packaging of microelectronic devices, including an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can include a ... | 05/07/2002 |
| 6369411 | Semiconductor device for controlling high-power electricity with improved heat dissipation A semiconductor device including (a) a base plate, (b) an insulation substrate including of an insulator plate with a front electrode and a back electrode bonded thereon and fixed onto the base plate by the back electrode, (c) a semiconductor element fast... | 04/09/2002 |
| 6350954 | Electronic device package, and method An electronic package (100) has a semiconductor device (130), a two-layer (110, 120) printed circuit substrate (101), and a lead (140) for providing external connections for the package assembly (100). The first layer (110) has an electrical conducting su... | 02/26/2002 |
| 6323547 | Pressure contact type semiconductor device with ringshaped gate terminal In a GCT device which controls large current at the operating frequency of 1 kHz or more, a ring-shaped gate terminal (10) is made of a magnetic material with the maximum permeability of 15,000 or less in the CGS Gaussian system of units. Further, in the ... | 11/27/2001 |
| 6297550 | Bondable anodized aluminum heatspreader for semiconductor packages A semiconductor package (100) includes a bondable aluminum heatspreader (130) made from anodized aluminum, thereby forming an anodization layer (132) on the surface of the heatspreader. Portions of the anodization layer are removed, e.g., by grinding, in ... | 10/02/2001 |
| 6165820 | Package for electronic devices An electronic packaging module for bonding of power semiconductor devices is produced. The semiconductor device is mounted on a base, and enclosed by a frame and lid. The lid is an insulating substrate having a conductive pattern with protuberances on the... | 12/26/2000 |
| 6078102 | Semiconductor die package for mounting in horizontal and upright configurations A semiconductor die package includes a housing and a plurality of leads extending through openings in the housing. The package is designed to be mounted to a printed circuit board in both a horizontal configuration and in an upright configuration. In the ... | 06/20/2000 |
| 5904499 | Package for power semiconductor chips An electronic packaging module for bonding of power semiconductor devices is produced. The semiconductor device is mounted on a base, and enclosed by a frame and lid. The lid is an insulating substrate having a conductive pattern with protuberances on the... | 05/18/1999 |
| 5866441 | Inverted chip bonded module with high packaging efficiency An electronic packaging module for inverted bonding of semiconductor devices, integrated circuits, and/or application specific integrated circuits is produced with protuberances on the conductive pattern of the substrate. The protuberances are of a soft, ... | 02/02/1999 |
| 5818106 | Semiconductor device having a capacitor formed on a surface of a closure A semiconductor device which includes a ceramic package main body, a semiconductor element and a closure for sealing the semiconductor element in the package. A capacitor is formed on an upper or lower surface of the closure. The capacitor has a dielectri... | 10/06/1998 |
| 5796165 | High-frequency integrated circuit device having a multilayer structure A multilayer structure composed of a plurality of substrates stacked in layers is provided with a cavity formed by partially removing some of the substrates. A semiconductor chip internally provided with an active component such as an FET is mounted on th... | 08/18/1998 |
| 5793105 | Inverted chip bonded with high packaging efficiency An electronic packaging module for inverted bonding of semiconductor devices, integrated circuits, and/or application specific integrated circuits is produced with protuberances on the conductive pattern of the substrate. The protuberances are of a soft, ... | 08/11/1998 |
| 5775403 | Incorporating partially sintered preforms in metal matrix composites A method of fabricating MMCs having high thermal conductivity coupled with coefficient of thermal expansion (CTE) values which approximates the CTE of ceramics and semi-conductor materials typically used in electronic packaging. The method comprises prepa... | 07/07/1998 |
| 5668033 | Method for manufacturing a semiconductor acceleration sensor device On a silicon wafer there is formed a movable gate MOS transistor (sensing element: functional element). A bonding frame consisting of a silicon thin film is patterned around an element formation region on the surface of the silicon wafer. On a cap forming... | 09/16/1997 |
| 5627406 | Inverted chip bonded module with high packaging efficiency An electronic packaging module for inverted bonding of semiconductor devices, integrated circuits, and/or application specific integrated circuits is produced with protuberances on the conductive pattern of the substrate. The protuberances are of a soft, ... | 05/06/1997 |
| 5570274 | High density multichip module packaging structure A multichip module packaging structure provided over a mother board. A multichip module substrate is mounted over the mother board through a frame member. The frame member is provided to extend successively on a peripheral region of a bottom surface of th... | 10/29/1996 |
| 5465481 | Method for fabricating a semiconductor package A semiconductor package (100) and module (300) includes a unitary base structure (101) and alignment mechanisms (104). The unitary base structure (101) includes a semiconductor mounting area (102) and encircling walls (103). The structure provides resista... | 11/14/1995 |
| 5463250 | Semiconductor component package A package for power semiconductor components permitting high thermal dissipation and current conductance and including a frame assembly bonded to a substrate on which a power semiconductor chip is mounted. The frame assembly has a wirebonding grid for con... | 10/31/1995 |
| 5362926 | Circuit substrate for mounting a semiconductor element A circuit substrate for mounting a semiconductor element comprises an aluminum-copper clad foil laminated on a metallic base plate by interposing an insulating layer, wherein the roughness in average of the surface in contact with the insulating layer of ... | 11/08/1994 |
| 5326932 | Semiconductor package A semiconductor package comprising a semiconductor chip received in and attached to a cavity of a base made of a ceramic or aluminum, by means of an adhesive, a lid fixedly attached to the upper surface of the semiconductor chip, the lid having a pluralit... | 07/05/1994 |
| 5313091 | Package for a high power electrical component A package for a high power electrical component includes a base and a plate disposed on a support surface of the base and having an electrically insulative layer and an outer layer having a conductive portion thereon. An electrically conductive pad is dis... | 05/17/1994 |
| 5306948 | Semiconductor device and semiconductor module having auxiliary high power supplying terminals Herein disclosed is a chip-carrier type semiconductor device adopting the MCC structure, in which a semiconductor pellet is mounted on the surface of the base substrate and in which mounting terminals to be connected with external terminals of the semicon... | 04/26/1994 |
| 5297001 | High power semiconductor assembly An insulated gate bipolar transistor assembly (10) in accordance with the invention includes an insulated gate bipolar transistor die (32) having gate, at least one emitter and collector electrodes and first and second opposed surfaces; a heat conductive ... | 03/22/1994 |
| 5264726 | Chip-carrier In a chip-carrier provided with a chip-carrier substrate, a chip-carrier cover and an IC chip, said IC chip being arranged at a distance from a circuit surface of the IC chip being directed toward the chip-carrier substrate, an -ray shielding film ... | 11/23/1993 |
| 5209390 | Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid A hermetic semiconductor package having a ceramic lid with the device leads extending vertically through the lid is disclosed. The leads are mechanically retained within the apertures in the lid and direct bonded to the lid to provide a hermetic seal and ... | 05/11/1993 |
| 5166773 | Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid A hermetic semiconductor package includes a ceramic lid with the device leads extending vertically through the lid. The leads are mechanically retained within the apertures in the lid and direct bonded to the lid to provide a hermetic seal and a substanti... | 11/24/1992 |
