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An extension member is attachable to a trailer hitch and extends away from the vehicle and is connected to a seating frame supporting a toilet seat.
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| Number | Title | Issue Date |
| 7230338 | Semiconductor device that improves electrical connection reliability A semiconductor device including: a semiconductor section in which an element is formed; an insulating layer formed on the semiconductor section; an electrode pad formed on the insulating layer; a contact section formed of a conductive material provided in a contact... | 06/12/2007 |
| 6703707 | Semiconductor device having radiation structure A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of ... | 03/09/2004 |
| 6670687 | Semiconductor device having silicon carbide layer of predetermined conductivity type and module device having the same A semiconductor device having a silicon carbide layer of a singular conductivity type. The silicon carbide layer includes a surface having a first region, a second region, and a third region sandwiched between the first region and the second region. An an... | 12/30/2003 |
| 6657542 | Electronic device and method of manufacture the same An electronic device, in which a flat plate semiconductor and dumets connected to surface electrodes on the front and back surfaces of the semiconductor and to lead wires are encapsulated in a glass tube.... | 12/02/2003 |
| 6642078 | Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators A method of manufacturing a diode assembly used in rectifier assemblies of engine-driven generators is disclosed. The diode assemblies have diode cups, semiconductor diode dies and diode leads fitted therein. The diode subassemblies are reflow soldered, s... | 11/04/2003 |
| 6614105 | Chip-type semiconductor device A TRIAC which is one species of chip-type semiconductors includes an element body made of silicon, electrodes provided on one face of the element body, a molybdenum plate provided on one of the electrodes by an alloy plate made of aluminum and silicon, a ... | 09/02/2003 |
| 6605870 | Pressure-contact type semiconductor device A pressure-contact type semiconductor device comprises a plurality of semiconductor elements (IGBTs) which are in pressure contact with one another, and in which first main electrodes are electrically connected to a first common main power source plate (p... | 08/12/2003 |
| 6580403 | Housing for an electronic component A housing for an electronic component is described, in particular a Gunn element for generating radar waves, including a bottom part, a wall part made of a plastic that can be processed by injection molding in particular and a cover part enclosing the ele... | 06/17/2003 |
| 6565983 | Electrical contact element and use of the contact element An electrical contact element for electrically connecting an electric device and providing current transmission in an electric device wherein the electrical contact element comprises a metallic body, and wherein at least one contact surface, present on th... | 05/20/2003 |
| 6548890 | Press-contact type semiconductor device A press-contact type semiconductor device comprises: a plurality of semiconductor elements each of which has a first main electrode and a control electrode and a second main electrode; a second common main power source plate having the semiconductor eleme... | 04/15/2003 |
| 6476480 | Press-fit IC power package and method therefor An IC power package particularly suitable for use as a rectifier for an automotive ac generator, as well as an IC packaging method. The power package comprises an electrically-conductive base, a MOSFET die mounted to the base so that the drain region of t... | 11/05/2002 |
| 6465881 | Compression bonded type semiconductor device A compression bonded type semiconductor device including a semiconductor substrate having a gate electrode and a cathode electrode formed on a first surface and an anode electrode formed on a second surface opposite to the first surface, an external catho... | 10/15/2002 |
| 6465276 | Power semiconductor package and method for making the same A power semiconductor die has a drain contact, a source contact, and a gate contact. A lead frame has first, second, and third terminals. A metal sheet has first and second contacting portions and a bridging portion interconnecting the first and second co... | 10/15/2002 |
| 6445013 | Gate commutated turn-off semiconductor device A first cathode flange (14) provided with branch-like protrusions (14d) extending towards substantially its outer periphery and a gate flange (15) provided with branch-like protrusions (15c) extending towards substantially its outer periphery are connecte... | 09/03/2002 |
| 6426561 | Short-circuit-resistant IGBT module In an IGBT module which is made contact with by pressure and comprises a plurality of individual chips (4) connected in parallel, an additional layer (7) facilitates a stable short circuit. The layer (7), as a foil, as a paste or as a component of the sol... | 07/30/2002 |
| 6423988 | Pressure-contact semiconductor device This invention relates to a pressure-contact type semiconductor device (1) having a ring-shaped gate terminal, and aims at overcoming such a technical problem that a gate current is not uniformly supplied to a semiconductor substrate (4) due to a connecti... | 07/23/2002 |
| 6423573 | Integrated electronic circuit comprising at least an electronic power component A method of producing an integrated circuit having a plurality of electronic components by the steps of: a) forming plurality of components with connection points in a substrate plate; b) forming a connection support of conducting tracks; c) transferring the s... | 07/23/2002 |
| 6396091 | Chip scale package A process for forming a true chip scale package comprising the sandwiching of a silicon wafer with a large number of identical die therein between top and bottom metal contact plates of the same size as the wafer. The sandwich is secured together as by so... | 05/28/2002 |
| 6384474 | Housing for receiving a planar power transistor With a housing for accommodating a planar power transistor, a chip of the power transistor is arranged hermetically sealed inside the housing, and metallized areas on the chip lead out of the housing by way of electric terminals. At least in some areas, t... | 05/07/2002 |
| 6377461 | Power electronic module packaging A method of power electronic packaging includes a practicable and reliable method of fabricating power circuit modules and associated connections that are compatible with the standard top layer metalization of commercially available power devices. A plana... | 04/23/2002 |
| 6373129 | Semiconductor apparatus with pressure contact semiconductor chips A semiconductor apparatus includes a plurality of semiconductor units and a common gate liner having silicon chip resistors at portions corresponding to the semiconductor units. Each unit includes a semiconductor chip, a collector base plate fixed to the ... | 04/16/2002 |
| 6339231 | Gate commutated turn-off thyristor module A gate terminal plate (1) of a GCT thyristor (90), a connecting substrate (70) of a driving device and a cathode electrode plate (10) are interposed between a set of metal rings (7A) and (7C) fastened to each other with a screw (8). The cathode electrode ... | 01/15/2002 |
| 6333550 | Surface mount semiconductor diode device A surface mount semiconductor diode device (50) having first (51) and second (53) coplanar contacts comprises a semiconductor element (52) having a first surface electrically mounted on a first member (54) formed of conductive material, which first member... | 12/25/2001 |
| 6295205 | Explosion protection for semiconductor modules A high-power semiconductor module having a casing which encloses at least one semiconductor element has an explosion protection element. This explosion protection element is a protective sheath which surrounds at least a portion of the casing and traps fr... | 09/25/2001 |
| 6291878 | Package for multiple high power electrical components A semiconductor package includes a plurality of semiconductor devices disposed in an array surrounding a central electrode structure carried by a package support member. The package is capable of withstanding high voltages and currents and includes a heat... | 09/18/2001 |
| 6281096 | Chip scale packaging process A process for forming a true chip scale package comprising the sandwiching of a silicon wafer with a large number of identical die therein between top and bottom metal contact plates of the same size as the wafer. The sandwich is secured together as by so... | 08/28/2001 |
| 6232151 | Power electronic module packaging A method of power electronic packaging includes a practicable and reliable method of fabricating power circuit modules and associated connections that are compatible with the standard top layer metalization of commercially available power devices. A plana... | 05/15/2001 |
| 6181007 | Semiconductor device A semiconductor device is provided which includes a plurality of semiconductor units each including a semiconductor chip, a support plate, a contact terminal block and a positioning guide, a flat package including a pair of common electrode plates and an ... | 01/30/2001 |
| 6160309 | Press-fit semiconductor package A press-fit package, such as a press-fit rectifier, includes an improved cup design which incorporates a mold lock formed within the inner wall of the cavity. a well is provided between the inner cavity wall and the die bond area to assist in mechanical d... | 12/12/2000 |
| 6072200 | Gate unit for a hard-driven GTO In a gate unit (47) for a hard-driven GTO (10), at least some of the electronic components (37, . . , 42) needed for driving are arranged on a printed circuit board (34). The printed circuit board (34) encloses the GTO (10), in order to achieve low-induct... | 06/06/2000 |
| 6054727 | Power semiconductor component A power semiconductor component includes a semiconductor body having a beed peripheral surface, a cathode electrode and an anode electrode. A materially joined connection between at least the anode electrode and the semiconductor body is not produced by ... | 04/25/2000 |
| 5990501 | Multichip press-contact type semiconductor device A multichip press-contact type semiconductor device including a plurality of semiconductor chips, a plurality of heat buffer plates, a conductive metal sheet, and first and second press-contact electrode plates. The heat buffer plates are disposed to corr... | 11/23/1999 |
| 5946586 | Method of manufacturing a glass-covered semiconductor device A method of manufacturing a semiconductor device, in which a pn-junction (2) is provided in a semiconductor wafer (1) of a first conduction type by providing doping atoms of a second conduction type, which is opposed to the first conduction type, via a fi... | 08/31/1999 |
| 5923083 | Packaging technology for Schottky die A hermetic packaging technology for silicon Schottky die or any other two terminal solderable die. The technology uses a pressed ceramic frame, solid metal pads, a solid metal disc, metal seal rings, and a direct high temperature solder bond to the die. T... | 07/13/1999 |
| 5908316 | Method of passivating a semiconductor substrate A method of passivating a semiconductor substrate includes singulating (13) a semiconductor substrate (23) from a semiconductor wafer, coupling (14) a heatsink (21) to the semiconductor substrate (23), etching (15) the semiconductor substrate (23) in a ch... | 06/01/1999 |
| 5904555 | Method for packaging a semiconductor device A method for packaging a semiconductor device (22) formed on a die (12) having opposing major surfaces includes pre-soldering the die (12) at wafer level using an electroplating process, wherein the die (12) has solder bumps disposed on each opposing majo... | 05/18/1999 |
| 5886403 | Sealed rectifier A sealed rectifier used in a vehicle alternator is composed of a semiconductor diode chip, a base electrode having a disk plate which has a central mount for supporting the chip and an annular wall extending higher than the central mount, a pole electrode... | 03/23/1999 |
| 5874750 | Pressure-contact type semiconductor device A pressure-contact type semiconductor device such as an insulated gate bipolar transistor. The device includes semiconductor chip, a gate electrode on a first surface of the semiconductor chip, an emitter electrode insulated and separated from the gate el... | 02/23/1999 |
| 5874774 | Flat package semiconductor device A semiconductor device is provided which includes a plurality of semiconductor chips each of which has a first main electrode and a control electrode on a first main surface and a second main electrode on a second main surface, and a plurality of support ... | 02/23/1999 |
| 5866944 | Multichip press-contact type semiconductor device In the present invention, by virtue of heat buffer plates respectively located on the major surfaces of IGBT chips and FRD chips arranged in a single plane, the total thickness of each chip and a corresponding one of the heat can be set to a substantially... | 02/02/1999 |
