Bizarre Patents
User-operated amusement apparatus for kicking the user's buttocks
An apparatus including a user-operated and controlled apparatus for self-infliction of repetitive blows to the user's buttocks by a plurality of elongated arms bearing flexible extensions that rotate under the user's control.
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| Number | Title | Issue Date |
| 6577032 | Rectifier unit of vehicle AC generator A rectifier unit of a vehicle AC generator is comprised of a plurality of metal cases, a plurality of pairs of first and second semiconductor chips and a plurality of pairs of first and second lead wires. The first lead wires are respectively connected to... | 06/10/2003 |
| 6559529 | Press-fit diode for universal mounting A force-fit diode for high circuit application has a cylindrical constant diameter conductive body which has a tapered top and bottom peripheral edge. An axial conductor extends from one end of the housing. The tapered top and bottom peripheral edges allo... | 05/06/2003 |
| 6434008 | Semiconductor device A semiconductor device in which a plurality of semiconductor elements are bonded onto at least one electrode pattern on an insulator substrate formed a plurality of electrode patterns on the main surface, each of the electrodes of the semiconductor elemen... | 08/13/2002 |
| 6396125 | Semiconductor device A semiconductor device is formed of a casing, a semiconductor element disposed in the casing, and a control terminal assembly situated outside the casing. The control terminal assembly includes control terminals connected to the semiconductor element, and... | 05/28/2002 |
| 6331730 | Push-in type semiconductor device including heat spreader A push-in type semiconductor chip has a semiconductor device, a support electrode body bonded to one of the end portions of the semiconductor chip and supported by, and fixed to, a heat spreader at a support fixing portion thereof, a lead electrode body b... | 12/18/2001 |
| 6310791 | Power rectifier A power rectifier includes a heat dissipation base, a hollow hexagonal gasket soldered to the heat dissipation base around a flat, circular projection of the heat dissipation base, a conducting rod member, a chip unit soldered between the conducting rod m... | 10/30/2001 |
| 6084298 | Manufacturing of semiconductor device In a semiconductor device, a ceramic package having a first surface and a second surface and having a recession section provided on the first surface side is provided. The recession section has a first opening provided at a center portion of the recession... | 07/04/2000 |
| 6060776 | Rectifier diode A rectifier diode has a base which is press-fittable into an intended opening of a rectifier arrangement, a pedestal disposed on the base integrally with the base, a semiconductor chip secured to the pedestal, a head wire secured to the chip, the base bei... | 05/09/2000 |
| 5956231 | Semiconductor device having power semiconductor elements A semiconductor device in which a plurality of semiconductor elements are bonded onto at least one electrode pattern on an insulator substrate formed a plurality of electrode patterns on the main surface, each of the electrodes of the semiconductor elemen... | 09/21/1999 |
| 5847935 | Electronic circuit chip package A package for an electronic component includes a metal base plate and a body of an insulating material, such as glass or ceramic, on and bonded to a surface of the base plate. The body is formed of a plurality of layers of the insulating material stacked ... | 12/08/1998 |
| 5585310 | Methods of mass production of semiconductor devices A semiconductor device includes a semiconductor substrate forming the bottom portion of a package of the device and a ceramic plate forming the upper or lid portion of the device. The substrate includes a layer of metal on its upper surface along the subs... | 12/17/1996 |
| 5577656 | Method of packaging a semiconductor device A compact package and a method of hermetically packaging a high power semiconductor device includes a metal lid bonded to a ceramic base with the semiconductor device therebetween. The lid is bonded to one surface of the device, and electrical contacts on... | 11/26/1996 |
| 5521436 | Semiconductor device with a foil-sealed lid A semiconductor device includes a semiconductor substrate forming the bottom portion of a package of the device and a ceramic plate forming the upper or lid portion of the device. The substrate includes a layer of metal on its upper surface along the subs... | 05/28/1996 |
| 5473193 | Package for parallel subelement semiconductor devices A package for semiconductor devices with plural subelements and method of packaging. Semiconductor power devices may include plural subelements to increase device manufacturing yield. Each subelement is separately contacted through the lid of the package ... | 12/05/1995 |
| 5446316 | Hermetic package for a high power semiconductor device A compact package and a method of hermetically packaging a high power semiconductor device includes a metal lid bonded to a ceramic base with the semiconductor device therebetween. The lid is bonded to one surface of the device, and electrical contacts on... | 08/29/1995 |
| 5248901 | Semiconductor devices and methods of assembly thereof A semiconductor device package including a cup-like base having an encircling side wall having at its upper end, a laterally, outwardly extending metal flange. A lid for the package comprises a plate-like member having, at the lower, peripheral edge there... | 09/28/1993 |
| 5135890 | Method of forming a hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip A hermetically sealed package for a semiconductor device includes a lid through which the leads of the device extend vertically away from the chip through an aperture in the lid which is hermetically sealed by the external terminal or electrode. The packa... | 08/04/1992 |
| 5130784 | Semiconductor device including a metallic conductor for preventing arcing upon failure A semiconductor device includes a metallic electrode formed on a semiconductor substrate, and a metallic terminal formed on a metal base through an insulating material, in parallel to the metal electrode. A metallic wire electrically connects the metallic... | 07/14/1992 |
| 5103290 | Hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip A hermetically sealed package for a semiconductor device includes a lid through which the leads of the device extend vertically away from the chip through an aperture in the lid which is hermetically sealed by the external terminal or electrode. The packa... | 04/07/1992 |
| 5018002 | High current hermetic package including an internal foil and having a lead extending through the package lid and a packaged semiconductor chip A hermetic semiconductor chip package includes a conductive foil bonded to a contact pad of the chip and connected to an external lead of the package through an aperture in the insulating material of the package lid.... | 05/21/1991 |
| 5005069 | Rectifier and method A rectifier (60) is formedf by soldering a diode chip (66) in a cavity (64) in a metal base (62) having a metal sidewall (69), soldering the head (72) of an axial lead (70) to the chip (66), and filling the cavity (64) with an encapsulation (88). An outwa... | 04/02/1991 |
| 4893173 | Low-inductance semiconductor apparatus A low-inductance semiconductor apparatus has a flat-topped base which support a semiconductor element. A cathode whose height is roughly on the order of its diameter sits atop the semiconductor element. The cathode has a flat upper surface with a threaded... | 01/09/1990 |
| 4833522 | Semiconductor module Semiconductor module, including a metallic bottom plate, at least two semiconductor bodies disposed on the bottom plate, at least one of the semiconductor bodies being a thyristor tablet having at least one control electrode, a frame having an inner surfa... | 05/23/1989 |
| 4803180 | Method for manufacturing pressure contact semiconductor devices A semiconductor device includes a support member; a semiconductor element mounted on the support member; an elastic body which places the semiconductor element in pressure-contact with the support member; a cylindrical body for containing the semiconducto... | 02/07/1989 |
| 4792844 | Pressure contact semiconductor device A semiconductor device includes a support member; a semiconductor element mounted on the support member; an elastic body which places the semiconductor element in pressure-contact with the support member; a cylindrical body for containing the semiconducto... | 12/20/1988 |
| 4760037 | Pressure contact type semiconductor device A method of manufacturing the present invention relates to a semiconductor device by providing a projection formed by pressing the side wall portion of a metal cylindrical body from the outside toward the inside of the cylindrical body and engaging the ou... | 07/26/1988 |
| 4646129 | Hermetic power chip packages Hermetic power chip packages are constructed in building block form to reduce the cost of electrical testing of power chips. The power chip packages utilized dielectric plates with metallic sheets bonded to the dielectric plates. Electric access to at lea... | 02/24/1987 |
| 4646131 | Rectifier device A rectifier device which includes a first radiating fin, a flat type semiconductor element which is disposed in contact with one surface of said first radiating fin, a substantially cylindrical insulating envelope which envelopes the flat type semiconduct... | 02/24/1987 |
| 4624303 | Heat sink mounting and method of making A heat sink mounting for a semi-conductor device includes a base member having a base body defining a generally cylindrical recess and a downwardly extending stem portion. The base body further defines an annular groove extending around the side surface o... | 11/25/1986 |
| 4611389 | Low-cost power device package with quick-connect terminals and electrically isolated mounting means A semiconductor device package structure having a conventional base outline, a heat spreader, and top-mounted, quick-connect terminals for external connection is described. A pre-packaged semiconductor device is attached to a lead frame containing termina... | 09/16/1986 |
| 4586075 | Semiconductor rectifier A semiconductor rectifier which is embodied substantially in a rotationally symmetrical manner is proposed. The semiconductor rectifier includes a semiconductor chip (10) and two connector leads (11, 12), each of which is soldered to one of the two main s... | 04/29/1986 |
| 4532539 | Solid-state diode-rectifier and heat sink structure A rectifier for association with an automotive alternator is made by providing a support plate (1) of aluminum on which a post (2) of aluminum is secured, for example by welding (FIG. 1) or by gripping a conical or bulged surface within the thickness of t... | 07/30/1985 |
| 4530003 | Low-cost power device package with quick connect terminals and electrically isolated mounting means A semiconductor device package structure having a conventional base outline, a heat spreader, and top-mounted, quick-connect terminals for external connection is described. A pre-packaged semiconductor device is attached to a lead frame containing termina... | 07/16/1985 |
| 4514587 | High power semiconductor package A high power semiconductor package which includes a substantially continuous mounting surface for efficient thermal mounting to a heat sink and which can be electrically isolated or non-isolated. The package includes a metal header having a cylindrical se... | 04/30/1985 |
| 4477826 | Arrangement for aligning and attaching a shim to a semiconductor element A contact shim for insertion between an electrode internal contact member and a contact surface of a semiconductor element in a semiconductor device assembly. The shim has a generally continuous body (2) provided with a number of apertures (4, 5, 6, 7) ha... | 10/16/1984 |
| 4470063 | Copper matrix electrode having carbon fibers therein A semiconductor device includes a semiconductor substrate having electrodes brazed thereto. The electrode is made of a Cu-C composite material in which carbon fibers are embedded in copper matrix. The carbon fibers are so disposed as to be in a ring-like ... | 09/04/1984 |
| 4349831 | Semiconductor device having glass and metal package A semiconductor package of low cost is described having a flat base to which is attached a semiconductor subassembly which is enclosed by a glass housing adhesively bonded to the base without the necessity for a compression glass-to-metal seal. An electro... | 09/14/1982 |
| 4347543 | Rectifier circuit diode array and circuit protector In a rectifier circuit structure, particularly for automative use, a diode array is in the form of a column and includes a Zener diode in the column which serves to protect the rectifier diodes of the arrangement and to protect an electrical load system c... | 08/31/1982 |
| 4328512 | Two-element semiconductor diode rectifier assembly structure To improve the stability and robustness of a rectifier and to protect it against atmospheric influences, two plate-like, series-connected semiconductor diodes are soldered to a common tap electrode between them. An external lead wire is soldered to each o... | 05/04/1982 |
| 4314270 | Hybrid thick film integrated circuit heat dissipating and grounding assembly A common emitter NPN type power transistor is directly fixed to an internal surface of a metallic housing serving as both a heat sink and a grounding terminal and a ceramic substrate provided with a thick film integrated circuit for controlling the transi... | 02/02/1982 |
