Class 257/E23.184 - Other leads having insulating passage through base (EPO)

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: This subclass is indented under subclass E23.183. This subclass
No. of patents: 31
Last issue date: 08/12/2008

Number	Title	Issue Date
7411288	Semiconductor device A frame-shaped sidewall is provided on a metallic base plate surrounding a semiconductor element arranged on the metallic base plate, a first dielectric plate is arranged on one side of the semiconductor element and a first circuit pattern is formed on its surface, ...	08/12/2008
6433276	Surface mount feedthrough A microcircuit package feedthrough that relates to glass-to-metal seals, and more particularly, to feedthroughs for use in surfacemount microcircuit packages. The present invention can be used with surface mount technology such that it is a microcircuit p...	08/13/2002
6380613	Semiconductor device A semiconductor device of the present invention comprises a mounting substrate, a supporting substrate, a die and a plurality of electrical conductors. The mounting substrate including a first surface and a second surface opposite to the first surface on ...	04/30/2002
6317333	Package construction of semiconductor device A semiconductor device includes a ball grid array substrate including an upper insulating layer of laminated insulating layers, an intermediate insulating layer, and a lower insulating layer of laminated insulating layers; lines on each top surface of the...	11/13/2001
6207892	System and method for sealing high density electronic circuits A method and system for extending the life cycle of an circuit including the positioning of a circuit on an an elevated pedestal in a container, filling the container with a hydrophobic fluid sufficiently to form a bubble at the top of the package, and se...	03/27/2001
5998733	Graphite aluminum metal matrix composite microelectronic package An electronic package includes a graphite-aluminum metal matrix composite (MMC) housing or support member that dissipates heat from an electronic component or circuit and a hermetic glass feedthrough seal between the graphite-aluminum MMC material and one...	12/07/1999
5940279	Metal support element for electronic components or circuit supports A metal support element having electronic components or circuit supports, in particular hybrid circuits, the connections of which are guided through from the component side, via a plurality of connector pins melted into glass passthroughs, to the opposite...	08/17/1999
5847453	Microwave circuit package A microwave circuit package includes a metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits (MMICs) and a spacer, made of a dielectric material, separating the MMICs from each other, and the MMICs and spacer are...	12/08/1998
5574959	Metal casing for semiconductor device having high thermal conductivity and thermal expansion coefficient A metal casing for a semiconductor device is manufactured by a powder metallurgy injection molding process which uses infiltration. The metal casing includes a base member and an enclosure member arranged on the base member. The base member and the enclos...	11/12/1996
5188985	Surface mount device with high thermal conductivity A surface mount package for encapsulating an electronic device is provided. The package has a ceramic frame containing a plurality of apertures. Copper-tungsten composite metallic components are bonded to the ceramic frame and individually extend across e...	02/23/1993
5111277	Surface mount device with high thermal conductivity A surface mount package for encapsulating an electronic device is provided. The package has a ceramic frame containing a plurality of apertures. Copper-tungsten composite metallic components are bonded to the ceramic frame and individually extend across e...	05/05/1992
5025347	Semiconductor device A semiconductor device of a type having a pin grid array, comprises a printed circuit board and a planar metal stem with a plurality of through holes. The stem is made of metal having a coefficient of thermal expansion ଱s. The printed circuit board ...	06/18/1991
4885662	Circuit module connection system Circuit module connection system for connection of a modular package (18) to a printed wiring board (12) has a contact (24) on the package and an aligned pad (16) on the board. A resilient contact (44) is positioned therebetween and is held in place and s...	12/05/1989
4684763	Hermetically sealable package for electronic component A hermetically sealable package for electronic component comprising a metallic base member and a metallic lid member, in which the metallic base member has lead wires penetrating therethrough under insulation. The base member or lid member is provided on ...	08/04/1987
4631805	Semiconductor device including plateless package fabrication method A semiconductor device including a metallurgically compatible unplated package is provided. The package includes a plateless copper alloy die mount area to which a semiconductor die is attached. The semiconductor die is metallized on its mounting surface ...	12/30/1986
4622434	Semiconductor device package and method thereof Packaging of discrete semiconductor devices is improved by dimpling metal caps prior to assembly onto headers and welding. The dimpled caps provide a friction fit to the headers, whereby fewer assembled, but unwelded packages separate during handling. The dimp...	11/11/1986
4571612	Corrosion-protected electrical circuit component To protect a weld connection between an external conductor (11, 12) and a projecting pin (5, 6) of an electronic component, the base plate (2) of the electronic component has a tubular element (8) attached thereto, for example formed with an insertion sli...	02/18/1986
4546374	Semiconductor device including plateless package A semiconductor device including a metallurgically compatible unplated package is provided. The package includes a plateless copper alloy die mount area to which a semiconductor die is attached. The semiconductor die is metallized on its mounting surface ...	10/08/1985
4493143	Method for making a semiconductor device by using capillary action to transport solder between different layers to be soldered A semiconductor member is attached to a base by placing a wafer of solder material on the base, placing a carrier member having a through capillary hole on the solder wafer, placing the semiconductor member on the carrier member and heating the arrangemen...	01/15/1985
4382327	Method for particle entrapment within an electrical device package An electrical device consisting of a package 10 comprising a base 11 and a lid 15 and an operation element 17 contained within the package. A particle getter 19 is disposed on the lid 15 for entrapping and retaining foreign particles contained within the ...	05/10/1983
4352119	Electrical device and method for particle entrapment device for an electrical component An electrical device consisting of a package 10 comprising a base 11 and a lid 15 and an operation element 17 contained within the package. A particle getter 19 is disposed on the lid 15 for entrapping and retaining foreign particles contained within the ...	09/28/1982
4338486	Housing for electrical and electronic components A housing package for the encapsulation of electrical components. The package comprises a base plate and a cap which encapsulate the electrical components. Electrical leads are lead through the base plate. The package is provided with a coating which incr...	07/06/1982
4319265	Monolithically interconnected series-parallel avalanche diodes Disclosed is an array of avalanche diodes and its method of manufacture wh results in plural pairs of series connected mesa-etched avalanche (TRAPATT) diodes being selectively connected in parallel by metallized air bridges for increasing the impedance l...	03/09/1982
4285003	Lower cost semiconductor package with good thermal properties An improved mounting base is disclosed in which a semiconductor die is mounted on a thin pedestal within a large counter bore in the mounting base or header of the transistor package....	08/18/1981
4151479	Low frequency power amplifier using MOS FET's A low frequency power amplifier uses MOS FET's each having a semiconductor device unit including a source electrode, a drain electrode and an insulated gate electrode filled in a can type casing with the source electrode being electrically connected to th...	04/24/1979
4141135	Semiconductor process using lapped substrate and lapped low resistivity semiconductor carrier A process intended for avoiding the "flip chip bonding" technique, well known for planar diodes, is provided. It is further applicable to mesa diodes and planar transistors. It comprises an essential step: the lapping of the substrate up to reduce its thi...	02/27/1979
4128697	Hermetic glass-metal compression seal Hermetically sealed lead-in structures of the compression seal type, useful for electronic devices and particularly for transistor and integrated circuit headers, are described. The seal structures comprise a glass-metal compression seal between steel cas...	12/05/1978
4037749	Hermetically sealed envelope and method of making the same An hermetically sealed envelope comprises a base having a groove therein, a tubelike cover inserted within the groove, and a sealing member surrounding the cover within the groove. A cold weld between the member and the cover is achieved by permanently de...	07/26/1977
4015071	Microelectronic circuit case A microelectronic circuit case for continuous seam welding to a lid and having a chamfer on the inner corner of the case upper edge for improving welding and sealing reliability, and a method of making the case....	03/29/1977
3988825	Method of hermetically sealing an electrical component in a metallic housing A hermetically sealed electrical component. A conductor passes through a metal body member in which it is sealed by a glass-to-metal seal, extending to the electrical component. The metal body member is soldered or brazed to a support plate. A cap enclosi...	11/02/1976
3978579	Automatic assembly of semiconductor devices The leads of a stem are first formed or bent to accurately position them relative to a pedestal of the stem, the pedestal being that portion of the stem on which a semiconductor pellet is to be mounted. The formed leads are thereafter used as a means for ...	09/07/1976

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Class 257/E23.184 - Other leads having insulating passage through base (EPO)