Did You Know...
...that it was melting ice cream that inspired the invention of the outboard motor? It was a lovely August day and Ole Evinrude was rowing his boat to his favorite island picnic spot. As he rowed, he watched his ice cream melt and wished he had a faster way to get to the island. At that moment the idea for the outboard motor was born!
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| Number | Title | Issue Date |
| 7423333 | Cerdip type of solid-state image sensing device, structure and method for gripping cerdip type of solid-state image sensing device A cerdip type of solid-state image sensing device includes a base on which photoelectric transfer devices are arranged in line along a main scanning direction, a sealed glass disposed on the base for fixing a lead frame, a wind frame disposed on the sealed glass, a ... | 09/09/2008 |
| 7385298 | Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component mounted... | 06/10/2008 |
| 7368325 | Semiconductor package A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can. ... | 05/06/2008 |
| 7230333 | Semiconductor package A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can. ... | 06/12/2007 |
| 7132745 | Method for attaching shields on substrates A method (100) of attaching a shield (52 or 82) to a substrate (40) can include the steps of circumscribing a predetermined area on the substrate with a metallized trace pattern (26), applying (101) solder to the metallized ... | 11/07/2006 |
| 6518659 | Stackable package having a cavity and a lid for an electronic device Package embodiments for housing an electronic device are disclosed, along with methods of making and interconnecting the packages. The package body may be formed of an injection molded plastic encapsulant. The package body includes a cavity in which the e... | 02/11/2003 |
| 5831827 | Token shaped module for housing an electronic circuit A module houses electronic circuitry that comprises a first electrically conductive surface area and a second electrically conductive surface. The first and second electrically conductive surfaces combine to form a substantially token-shaped body. The bod... | 11/03/1998 |
| 5760425 | Internal compression bonded semiconductor device with a chip frame enabling a longer creepage distance The top-side (n-type) electrode and bottom-side (p-type) electrode of a Si chip with a p-n junction are pressed against a Cu cathode electrode and a Cu anode electrode via Mo plates respectively, thereby establishing electrical connection. The inner wall ... | 06/02/1998 |
| 5639990 | Solid printed substrate and electronic circuit package using the same The present invention relates to a solid printed substrate to be used for mounting electronic parts and a method of manufacturing the same. A metal base substrate having a plurality of copper foil layers stacked thereon is employed placing a thermoplastic... | 06/17/1997 |
| 5188985 | Surface mount device with high thermal conductivity A surface mount package for encapsulating an electronic device is provided. The package has a ceramic frame containing a plurality of apertures. Copper-tungsten composite metallic components are bonded to the ceramic frame and individually extend across e... | 02/23/1993 |
| 5111277 | Surface mount device with high thermal conductivity A surface mount package for encapsulating an electronic device is provided. The package has a ceramic frame containing a plurality of apertures. Copper-tungsten composite metallic components are bonded to the ceramic frame and individually extend across e... | 05/05/1992 |
| 4864384 | Pre-matched module for an ultra-high frequency diode and a process for forming the biasing connection for the diode The invention provides a process for mounting an ultra-high frequency diode so as to form a pre-matched module. The module of the invention comprises a copper base, a quartz ring and a copper cover: these three parts, coated with gold at least on their facing ... | 09/05/1989 |
| 4566027 | Pre-matched module for an ultra-high frequency diode with high heat dissipation A pre-matched module is provided for an ultra-high frequency diode with high heat dissipation, comprising a diode chip biassed by a connection and mounted inside a case formed by a metal base, a quartz ring and a metal cap. The base of the case comprises ... | 01/21/1986 |
| 4499659 | Semiconductor structures and manufacturing methods A plurality of microwave semiconductor devices is provided by plating a thin conductive layer on a surface of a wafer of semiconductor material, masking selected portions of the thin conductive layer, and plating unmasked portions of the thin conductive l... | 02/19/1985 |
| 4472760 | Capacitor A capacitor comprises a capacitor element which is accommodated in a cylindrical casing with electrodes attached to the two end faces thereof. The capacitor element includes a high as possible doped monocrystalline silicon disk, a layer of insulating mate... | 09/18/1984 |
