Did You Know...
...that in 1800 ether was first used by partyers as a fun diversion? Sniffing the gas led to hilarious and raucous laughter as people watched each other become more and more intoxicated and silly. Several doctors independently realized the value ether would have to anesthetize surgery patients. Of those who claimed rights to the "discovery," none had a happy ending. One had a seizure and died defending his rights. Another spent his life in an asylum because he had been denied acclaim. A third became addicted to chloroform and, in a New York City jail, he soaked a cloth in the drug, severed an artery and bled to death.
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| Number | Title | Issue Date |
| 7294529 | Method for embedding a component in a base This publication discloses a method, in which the semiconductor components forming part of an electronic circuit, or at least some of them, are embedded in a base, such as a circuit board, during the manufacture of the base, when part of the base structure is, as it... | 11/13/2007 |
| 6661082 | Flip chip substrate design A chip device that includes a leadframe that has a die attach cavity. The memory device further includes a die that is placed within the die attach cavity. The die attach cavity is substantially the same thickness as the die. The die is positioned within ... | 12/09/2003 |
| 6225686 | Semiconductor device A semiconductor device including a semiconductor chip having plural electrode pads at the peripheral edge portion thereof, a frame-shaped package substrate in which the semiconductor chip is mounted and which has plural electrode portions corresponding to... | 05/01/2001 |
| 6157076 | Hermetic thin pack semiconductor device A hermetic thin pack semiconductor device. The semiconductor device has a semiconductor substrate and at least one electrode on the upper surface of the semiconductor substrate. A lid of a ceramic material for the semiconductor device has at least one ope... | 12/05/2000 |
| 5668702 | Combination axial and surface mount cylindrical package containing one or more electronic components A combination axial and surface mounted cylindrically-shaped package containing at least one electronic component and being surface mountable to a printed circuit board with electrical lands by the use of conventional axial component through hole mounting... | 09/16/1997 |
| 5564182 | Method for installing axial multiple A method for installing an axial multiple connection component, for connecting to a circuit board, comprising a shell, the shell substantially cylindrical, having two opposite ends. Conducting leads extend from the opposite ends along the axis, for provid... | 10/15/1996 |
| 5389739 | Electronic device packaging assembly An electronic device package assembly including a base member; a cover member; a lead frame having a plurality of leads disposed between the base member and the cover member; an electronic device disposed between the base member and the cover member and e... | 02/14/1995 |
| 5232463 | Apparatus for manufacturing a semiconductor device An apparatus for manufacturing a semiconductor device having two leads (3) lying in the same axis, a prefabricated plastic can (1) which is filled with a plastic compound and having one of the leads passed through its bottom (1a), and a prefabricated die ... | 08/03/1993 |
| 5166098 | Method of manufacturing an encapsulated semiconductor device with a can type housing This semiconductor device has two leads (3) lying in the same axis, a prefabricated plastic can (1) which is filled with a plastic compound and has one of the leads passed through its bottom (1a), and a prefabricated die (4) attached between those sides o... | 11/24/1992 |
| 5106784 | Method of making a post molded cavity package with internal dam bar for integrated circuit A method of producing a cavity package around an assembled semiconductor device is disclosed. The method includes providing a chip attach pad having a plurality of chip attach pad straps, each strap extending outwardly from the outer edge of the chip atta... | 04/21/1992 |
| 5023702 | Semiconductor device, method of manufacturing the same, and apparatus for carrying out the method This semiconductor device has two leads (3) lying in the same axis, a prefabricated plastic can (1) which is filled with a plastic compound and has one of the leads passed through its bottom (1a), and a prefabricated die (4) attached between those sides o... | 06/11/1991 |
| 4523371 | Method of fabricating a resin mold type semiconductor device A resin mold type semiconductor device comprising molded articles for sealing, each consisting of a resin material and having a gap portion thereinside; a semiconductor element positioned in said gap portion inside said molded article for sealing, said se... | 06/18/1985 |
| 4420652 | Hermetically sealed package A shell of a hermetically sealed package has a through hole and a circuit board is inserted and fixed hermetically into the through hole, and a can is fixed hermetically to the shell. The circuit board consists of a sealed part which is sealed hermeticall... | 12/13/1983 |
| 4369330 | Housing for electrical components, component groups or integrated circuit Housing for electrical components, component groups or integrated circuits, including a rectangular dish part with oppositely disposed side walls having recesses and a set-back portion formed therein, a cover part being inserted in the dish part and havin... | 01/18/1983 |
| 4338486 | Housing for electrical and electronic components A housing package for the encapsulation of electrical components. The package comprises a base plate and a cap which encapsulate the electrical components. Electrical leads are lead through the base plate. The package is provided with a coating which incr... | 07/06/1982 |
| 4233619 | Light detector housing for fiber optic applications A light pipe is inserted through the cap of a light detector housing and bonded to this cap. Light from a light transmitting fiber which impinges on the external end of the light pipe is transmitted with reduced loss of light to the light detector inside ... | 11/11/1980 |
| 4230901 | Housing for semiconductor device Housing for a semiconductor device includes a housing cup in which the semiconductor device is disposed, the housing cup has a bottom, at least one wall and a metal plate disposed opposite the bottom. The metal plate is thermally connected to the semicond... | 10/28/1980 |
| 4187599 | Semiconductor device having a tin metallization system and package containing same An improved metallization system for semiconductor substrates comprising successive layers of at least one barrier metal and tin is disclosed. A semiconductor package comprising a housing of impervious material, a semiconductor device having the metalliza... | 02/12/1980 |
| 4129243 | Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof Disclosed is a double side cooled, pressure mounted semiconductor package and a method for the manufacture thereof. The package is formed by directly bonding upper and lower metal contact assemblies to an annular ceramic housing. Assembly is simplified if... | 12/12/1978 |
| 4079511 | Method for packaging hermetically sealed integrated circuit chips on lead frames An assembly line method for fabricating hermetically sealed integrated circuit chips with externally extending terminal leads comprising the steps of securing at least one integrated circuit chip upon a spider assembly; stamping a strip of iterative lead ... | 03/21/1978 |
| 3950142 | Lead assembly for semiconductive device An improved lead assembly adapted for utilization in a semiconductor device having a glass envelope, an electrical device positioned within said envelope having at least one end surface, said lead assembly comprising a metallic seal member adapted for ext... | 04/13/1976 |
