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| Number | Title | Issue Date |
| 7432590 | Ceramic package, assembled substrate, and manufacturing method therefor In a ceramic package including one or more ceramic layers and being capable of having an electronic component and a lid fixed to a surface thereof, a surface of a ceramic layer having a sealing electrode for joining the lid through a sealing member and a pad to be c... | 10/07/2008 |
| 7410886 | Method for fabricating protective caps for protecting elements on a wafer surface A method of fabricating protective caps for protecting devices on wafer surface includes: (a) providing a non-metal cap substrate and forming a metal layer on the non-metal cap substrate; (b) forming a plurality of cavities on a surface of the metal layer, wherein t... | 08/12/2008 |
| 7391103 | Electronic module having plug contacts and method for producing it The invention relates to an electronic module having plug contacts, which has a semiconductor chip embedded in a plastics composition with its rear side and its edge sides. An active top side of the semiconductor chip forms, together with the plastics composition, a... | 06/24/2008 |
| 7365421 | IC chip package with isolated vias An IC chip package includes a substrate (2), a chip (5), a plurality of bonding wires (52), and a cover (6). The substrate has a top surface, a receiving chamber (23) having an opening at the top surface, a plurality of solder pads... | 04/29/2008 |
| 7348663 | Integrated circuit package and method for fabricating same A process for fabricating an integrated circuit package includes: selectively etching a first side of a substrate thereby providing etched regions of the substrate to partially define at least a plurality of contact pads; adding a dielectric material to the etched r... | 03/25/2008 |
| 7343675 | Method of constructing a structural circuit A method relating to a multi-functional, structural circuit, referred to as a structural circuit, is disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a structural element (215). At least one circuit component can be ... | 03/18/2008 |
| 7342298 | Metal lid with improved adhesion to package substrate A metal lid for packaging semiconductor chips is stamped to form a sloped sidewall with a set-back from the edge of a package substrate. After the metal lid is placed over the semiconductor chip, molding compound is formed around portions of the exposed perimeter of... | 03/11/2008 |
| 7323775 | Memory module A memory module comprises a base plate and one or more IC embedding seats formed thereon to provide IC memory chip being installed in detachable manner taking the advantage of easy installation, convenient maintenance or replacement of IC memory chip, particularly n... | 01/29/2008 |
| 7285862 | Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film The present invention includes the steps of forming a first resin film uncured on a wiring substrate including a wiring pattern, burying an electronic parts having a connection terminal on an element formation surface in the first resin film uncured in a state where... | 10/23/2007 |
| 7274107 | Semiconductor device The present invention relates to semiconductor devices. According to the present invention a semiconductor device is described, comprising: a substrate for carrying a semiconductor chip on a first surface of said substrate; said semiconductor chip being punctually a... | 09/25/2007 |
| 7271479 | Flip chip package including a non-planar heat spreader and method of making the same A flip chip package generally includes a substrate, a flip chip die, and a heat spreader. The flip chip die is coupled to the substrate. The heat spreader is coupled to the flip chip die. The heat spreader can include one or more walls. Generally, the one or more wa... | 09/18/2007 |
| 7259456 | Heat dissipation apparatus for package device Heat dissipation apparatus applies to a package device on a substrate. The package device has an upper surface, a bottom surface, and a sidewall between the upper and bottom surfaces, in which the bottom surface thermally contacts the substrate through multitudes of... | 08/21/2007 |
| 7253514 | Self-supporting connecting element for a semiconductor chip A connecting element for electrically connecting a semiconductor chip and a superordinate circuit board includes an elastic metal strip that is bent forming two metal limbs with flattened limb ends, thus forming a base between the metal limbs which is suitable for c... | 08/07/2007 |
| 7166908 | Optical device An optical device according to the present invention includes a device substrate, a translucent member, an optical element chip and a conductive portion. On a surface of the device substrate, an opening is provided so as to extend substantially in the vertical direc... | 01/23/2007 |
| 7115988 | Bypass capacitor embedded flip chip package lid and stiffener The present invention provides a heat spreader with a bypass capacitor to provide substantially instant power and/or to control simultaneous switching noise (SSN). The present invention also provides a semiconductor device package incorporating this heat spreader. I... | 10/03/2006 |
| 7095098 | Electrically isolated and thermally conductive double-sided pre-packaged component An electrically isolated and thermally conductive double-sided pre-packaged IC component, stamped lead members, drain pads, source pads, gate runner, and a MOSFET, IGBT, etc. are positioned between a pair of ceramic substrate members. Layers of solderable copper mat... | 08/22/2006 |
| 6812553 | Electrically isolated and thermally conductive double-sided pre-packaged component An electrically isolated and thermally conductive double-sided pre-packaged IC component, stamped lead members, drain pads, source pads, gate runner, and a MOSFET, IGBT, etc. are positioned between a pair of ceramic substrate members. Layers of solderable cooper mat... | 11/02/2004 |
| 6703560 | Stress resistant land grid array (LGA) module and method of forming the same An integrated circuit module, a land grid array module, and a method for forming the module, include a substrate, which mounts one or more chips or discrete electronic components, and a cap for covering the substrate, and including at least one protrusion... | 03/09/2004 |
| 6670698 | Integrated circuit package mounting A packaged electronic device includes connection contacts that are formed on the contact pads on the second surface of the substrate. In contrast to the prior art, the connection contacts are not solder contacts but are formed of nickel/aluminum plated co... | 12/30/2003 |
| 6667549 | Micro circuits with a sculpted ground plane A sculpted groundplane is provided so that monolithic dielectric structures are effectively shielded from their immediate surroundings through the implementation of transversely elongated "vias" which form continuous walls that effectively enclose the cir... | 12/23/2003 |
| 6660562 | Method and apparatus for a lead-frame air-cavity package Embodiments provide a method, article of manufacture, and apparatus for providing a component package for components such as integrated circuits. In one embodiment, a carrier includes a plurality of sidewalls formed thereon to form a component package ass... | 12/09/2003 |
| 6649832 | Apparatus and method for coupling with components in a surface mount package An embodiment of the present invention provides a method and apparatus that effectuates a direct functional interface directly with individual constituent subcomponents of the internal die component, or with particular circuit nodes or conductive trace lo... | 11/18/2003 |
| 6644982 | Method and apparatus for the transport and tracking of an electronic component An apparatus for use in manipulating one or more IC die through testing after they have been cut from the original wafer. A carrier supports the die during the transport, testing, and/or final application. The die is placed into the carrier through an ope... | 11/11/2003 |
| 6642625 | Sockets for "springed" semiconductor devices Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an in... | 11/04/2003 |
| 6633079 | Wafer level interconnection RF MicroElectroMechanical Systems (MEMS) circuitry (15) on a first high resistivity substrate (17) is combined with circuitry (11) on a second low resistivity substrate (13) by overlapping the first high resistivity substrate (17) and MEMS circuitry (15) ... | 10/14/2003 |
| 6627483 | Method for mounting an electronic component A method for mounting an electronic component. In one example of this method, the electronic component is an integrated circuit which is placed against an element of a carrier, such as a frame of a carrier. The electronic component has a plurality of elon... | 09/30/2003 |
| 6624508 | High frequency, low cost package for semiconductor devices A direct attachment technique is described for silicon packages housing high frequency devices. A silicon package may be shaped as either a plug or a socket or the package may have both the plug and socket capability, thus enabling the package to be direc... | 09/23/2003 |
| 6603193 | Semiconductor package A semiconductor package having a molded body and a plurality of conductive pins that extend from the bottom of the molded body. The semiconductor package further includes a RF shield around a protected cavity that holds a first integrated circuit. The mol... | 08/05/2003 |
| 6566748 | Flip-chip semiconductor device having an improved reliability A BGA semiconductor device includes a package substrate carrying thereon a semiconductor chip in a face-down state and a cap member covering the semiconductor chip on the package substrate, wherein the cap member has a optimized Young modulus smaller than... | 05/20/2003 |
| 6566749 | Semiconductor die package with improved thermal and electrical performance A semiconductor die package is disclosed. In one embodiment, the package includes a semiconductor die comprising a vertical power transistor. A source electrode and a gate contact region are at the first surface of the semiconductor die. A drain electrode... | 05/20/2003 |
| 6559529 | Press-fit diode for universal mounting A force-fit diode for high circuit application has a cylindrical constant diameter conductive body which has a tapered top and bottom peripheral edge. An axial conductor extends from one end of the housing. The tapered top and bottom peripheral edges allo... | 05/06/2003 |
| 6534856 | Sockets for "springed" semiconductor devices Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an in... | 03/18/2003 |
| 6526653 | Method of assembling a snap lid image sensor package An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of... | 03/04/2003 |
| 6514789 | Component and method for manufacture A component (10) includes a substrate (15), a cap wafer (23), and a protection layer (28) formed over a surface of the cap wafer (23). Together, the protection layer (28) and the cap wafer (23) form a cap structure (39) that is bonded to the substrate (15... | 02/04/2003 |
| 6512300 | Water level interconnection RF MicroElectroMechanical Systems (MEMs) circuitry(15) on a first high resistivity substrate (17)is combined with circuitry (11) onsecond low-resisitivity substrate (13) by overlapping the first high resisitivity substrate (17)and MEMs circuitry (15) with... | 01/28/2003 |
| 6409859 | Method of making a laminated adhesive lid, as for an Electronic device An electronic package or module is protected by a lid sealed with a thermoplastic or thermosetting adhesive laminate that has been pre-applied onto the lid, including the bonding area of the lid. The adhesive is deposited as wet adhesive or is laminated i... | 06/25/2002 |
| 6410981 | Vented semiconductor device package having separate substrate, strengthening ring and cap structures A packaged semiconductor device having high reliability that allows for a large number of pins and that provides good heat removal properties, and that can discharge the high pressure moisture in a gas state from the inside thereof to the exterior. The de... | 06/25/2002 |
| 6400009 | Hermatic firewall for MEMS packaging in flip-chip bonded geometry A package for hermetically sealing a micro-electromechanical systems (MEMS) device in a hybrid circuit comprise a firewall formed on a substrate for the MEMS device and which has a height defining a cavity of the package in which the MEMS device will be s... | 06/04/2002 |
| 6392298 | Functional lid for RF power package A packaged integrated circuit device includes a substrate including a first circuit component mounted thereon, a first conductor extending from the first circuit component, and a dielectric lid. The dielectric lid includes a component mounting surface, a ... | 05/21/2002 |
| 6389687 | Method of fabricating image sensor packages in an array Image sensor packages are fabricated simultaneously to minimize the cost associated with each individual image sensor package. To fabricate the image sensor packages, windows are molded in molding compound to form a molded window array. A substrate includ... | 05/21/2002 |
