Did You Know...
...that the Slinky toy was the result of a failed attempt by engineer Richard James to produce an antivibration device for ship instruments? His goal was to develop a spring that would instantaneously counterbalance the wave motion that rocks a ship at sea. Instead, he developed the Slinky.
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| Number | Title | Issue Date |
| 7436056 | Electronic component package An electronic component package includes a dielectric substrate having a first surface where an electronic component is sealed. A first signal line connecting to the electronic component and a first ground conductor are formed on the first surface of the dielectric ... | 10/14/2008 |
| 7394147 | Semiconductor package A semiconductor package includes a substrate, a first chip, a nonconductive adhesive, a second chip and a plurality of supporting balls. The first chip has an upper surface and a lower surface opposite to the upper surface, and the lower surface is mounted on the su... | 07/01/2008 |
| 7348663 | Integrated circuit package and method for fabricating same A process for fabricating an integrated circuit package includes: selectively etching a first side of a substrate thereby providing etched regions of the substrate to partially define at least a plurality of contact pads; adding a dielectric material to the etched r... | 03/25/2008 |
| 7291901 | Packaging method, packaging structure and package substrate for electronic parts A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A... | 11/06/2007 |
| 7262491 | Die pad for semiconductor packages and methods of making and using same A semiconductor device package comprising a semiconductor device and an electrically conductive lead frame at least partially covered by a molding compound. The electrically conductive lead frame includes a plurality of leads disposed proximate a perimeter of the pa... | 08/28/2007 |
| 7256067 | LGA fixture for indium assembly process An integrated circuit lid fixture and methods of using the same are provided. In one aspect, an integrated circuit lid fixture is provided that includes a base that has a plurality of pillars. Each of the plurality of pillars has a surface for supporting a substrate... | 08/14/2007 |
| 7183140 | Injection molded metal bonding tray for integrated circuit device fabrication An injection molded metal bonding tray may be utilized in the fabrication of integrated circuit devices. In one embodiment, a substrate of an integrated circuit device is placed in a pocket of an injection molded metal bonding tray. A plurality of conductors is plac... | 02/27/2007 |
| 7183657 | Semiconductor device having resin anti-bleed feature A device and a method for controlling resin bleed, the device comprising a substrate having a surface, wherein an interior region, a peripheral region, and an exterior region of the surface are generally defined. An adhesive generally resides on the surface of the s... | 02/27/2007 |
| 7173324 | Wafer level package for micro device A wafer level package includes a device wafer having a micro device, and bonding pads which are connected to the micro device, and formed at one surface of the device wafer, via connectors extending from the bonding pads to the other surface of the device wafer, ext... | 02/06/2007 |
| 7173331 | Hermetic sealing cap and method of manufacturing the same A hermetic sealing cap member capable of suppressing deterioration of characteristics of an electronic component resulting from a sealant such as solder coming into contact with the electronic component in a package is obtained. This hermetic sealing cap, which is a... | 02/06/2007 |
| 6448637 | Hermetically sealed integrated circuit package incorporating pressure relief valve for equalizing interior and exterior pressures when placed in spaceborne environment A hermetically sealed protective package for a space-deployable electronic circuit includes a pressure relief valve. The pressure relief valve is closed during assembly and testing of the circuit in an earth borne environment, so as to prevent the entry o... | 09/10/2002 |
| 6390353 | Integral solder and plated sealing cover and method of making the same A method of making an integral plated and solder clad cover lid for electronic packages is disclosed. The cover lid is plated and or clad with a first corrosion resistant and solderable material and is clad with a solder material on one side. The cladded ... | 05/21/2002 |
| 4722441 | Package structure for semiconductors A semiconductor package having a special cap shell wherein a flat molding having a window space with at least one level difference around the window space at the inside thereof is fitted with an ultraviolet-light transmissible lid at the level difference ... | 02/02/1988 |
| 4580157 | Semiconductor device having a soft-error preventing structure In a semiconductor device, particularly a memory device, radioactive rays emitted from the ceramic material of the package enclosing the LSI chip of the device detrimentally influence the electrical properties of the device. In the memory device, the info... | 04/01/1986 |
