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| Number | Title | Issue Date |
| 7411295 | Circuit board, device mounting structure, device mounting method, and electronic apparatus A circuit board has a metal pattern that is formed on a surface of the circuit board to be connected with bumps in two-dimensional arrangement for mounting an electronic device that has the bumps. A plurality of the bumps which has even electrical potentials is elec... | 08/12/2008 |
| 7408253 | Chip-embedded support-frame board wrapped by folded flexible circuit for multiplying packing density The present invention includes a chip-embedded support-frame wrapped-by-flex-circuit package assembly. The package assembly includes a flex circuit having a plurality of patterned connecting-traces. The package assembly further includes a plurality of semiconductor ... | 08/05/2008 |
| 7368805 | Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device In the semiconductor device of the present invention, there are provided output terminals on two sides perpendicular to one of four sides which is nearest output outer leads of a liquid crystal driver chip mounted to a flexible substrate. The wires extending from th... | 05/06/2008 |
| 7345365 | Electronic component with die and passive device An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate. Wherein the thin-film circuit layer has an external circuitry, w... | 03/18/2008 |
| 7340829 | Method for fabricating electrical connection structure of circuit board A method for fabricating an electrical connection structure of a circuit board is proposed. The circuit board is provided with a plurality of pads on a surface thereof and with a plurality of conductive structures therein for electrically connecting the pad. A plura... | 03/11/2008 |
| 7342311 | Electronic unit integrated into a flexible polymer body A peel and stick electronic system comprises a silicone body, and at least one electronic unit operatively connected to the silicone body. The electronic system is produce by providing a silicone layer on a substrate, providing a metal layer on the silicone layer, a... | 03/11/2008 |
| 7342308 | Component stacking for integrated circuit electronic package Component stacking for increasing packing density in integrated circuit packages. In one aspect of the invention, an integrated circuit package includes a substrate, and a plurality of discrete components connected to the substrate and approximately forming a compon... | 03/11/2008 |
| 7335973 | Adhesive of folder package A package includes a flexible substrate with a first region and a second region, an encapsulated die supported by the first region, and a conformable fold adhesive introduced between the encapsulated die and the flexible substrate. The second region of the flexible ... | 02/26/2008 |
| 7335975 | Integrated circuit stacking system and method The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The invention provides techniques and structures for aggregating chip scale-packaged integrated circuits (CSPs) or leaded packages with other CSPs o... | 02/26/2008 |
| 7321167 | Flex tape architecture for integrated circuit signal ingress/egress In an integrated circuit design, flex tape is used to provide signal ingress/egress to/from the integrated circuit design. Various architectures for the signal ingress/egress via flex tape is provided. In one embodiment, coaxial design is provided. In another embodi... | 01/22/2008 |
| 7309914 | Inverted CSP stacking system and method Two or more integrated circuits are stacked into a high density circuit module. The lower IC is inverted. Electrical connection to the integrated circuits is made by module contacts on a flexible circuit extending along the lower portion of the module. In one embodi... | 12/18/2007 |
| 7304373 | Power distribution within a folded flex package method and apparatus A device includes a folded flex substrate. A memory die is connected to a first side of the folded flex substrate. A logic die is connected to a second side of the folded flex substrate. A trace routing pattern of source voltage signals is identical to a trace routi... | 12/04/2007 |
| 7294928 | Components, methods and assemblies for stacked packages A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly e... | 11/13/2007 |
| 7291926 | Multi-chip package structure The present invention relates to a multi-chip package structure, comprising a first substrate, a first chip, a sub-package and a first molding compound. The first chip is attached to the first substrate. The first molding compound encapsulates the first chip, the su... | 11/06/2007 |
| 7288433 | Method of making assemblies having stacked semiconductor chips A stacked microelectronic assembly comprises a flexible sheet having an obverse surface and a reverse surface and including at least a first panel and a second panel. The second panel and the first panel are adjacent to each other, the second panel including termina... | 10/30/2007 |
| 7268423 | Flexible rewiring plate for semiconductor components, and process for producing it The present invention describes a rewiring plate for components with connection grids of between approx. 100 nm and 10 μm, which rewiring plate includes a base body and passages with carbon nanotubes, the lower end of the passages opening out into contact connectio... | 09/11/2007 |
| 7239024 | Semiconductor package with recess for die A semiconductor package is disclosed with a recess (51) for an integrated circuit die (52). The recess is made by bending or deforming all layers of a package substrate, and therefore the recess contains circuitry to connect to the integrated circuit d... | 07/03/2007 |
| 7141875 | Flexible multi-chip module and method of making the same A semiconductor package including a flexible multichip module having multiple chips on flexible appendages with the flexible appendages folded so that the semiconductor chips are arranged in aligned and stacked positions. ... | 11/28/2006 |
| 7129583 | Multi-chip package structure The present invention relates to a multi-chip package structure, comprising a first substrate, a first chip, a sub-package and a first molding compound. The first chip is attached to the first substrate. The first molding compound encapsulates the first chip, the su... | 10/31/2006 |
| 7115980 | Mounting structure, electro-optical device, and electronic apparatus An electro-optical device includes: a first substrate having an end edge; a second substrate that has an edge crossing the end edge and a plurality of first wiring lines crossing the end edge, the second substrate having flexibility and being connected to the first ... | 10/03/2006 |
| 7109575 | Low-cost flexible film package module and method of manufacturing the same Provided are a flexible film package module and a method of manufacturing the same that can be adapted for manufacture at lower cost and/or to adapt the characteristics of the flexible film package module for specific applications. The lower-cost flexible film packa... | 09/19/2006 |
| 6703702 | IC chip mounting structure and display device IC CHIP MOUNTING STRUCTURE has IC chips having protruding electrodes, a flexible printed circuit board having conductors connected to the protruding electrodes of the IC chips, and a protective plate attached to the flexible printed circuit board. The pro... | 03/09/2004 |
| 6700195 | Electronic assembly for removing heat from a flip chip An electronic assembly for conducting heat from a semiconductor device, such as a power flip chip, attached to a substrate. The substrate has a first region with conductors thereon, a second region surrounding and supporting the first region, and a third ... | 03/02/2004 |
| 6699730 | Stacked microelectronic assembly and method therefor A method of making a stacked microelectronic assembly includes providing a flexible substrate having a plurality of attachment sites, test contacts and conductive terminals, and including a wiring layer with leads extending to the attachment sites. The me... | 03/02/2004 |
| 6696318 | Methods for forming a die package Methods are provided for forming a die package. The method comprises stiffening a flexible substrate to provide a first flexibility of the flexible substrate, forming a mounting element on a first side of the flexible substrate, and mounting a first die o... | 02/24/2004 |
| 6682981 | Stress controlled dielectric integrated circuit fabrication General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a sem... | 01/27/2004 |
| 6683377 | Multi-stacked memory package A multiple chip package and method of making the package allow multiple same size or different size chips to be stacked over each other, thereby creating a thin profile multi-chip package. Chips are attached to one surface of a continuous flexible substra... | 01/27/2004 |
| 6677670 | Semiconductor device A flexible circuit substrate 11 has mounting regions 111, 112 and 113 on which electronic components 121, 122 and 123 are mounted, respectively. The flexible circuit substrate 11 is structured in such a manner that the mounting regions 111-113 are folded ... | 01/13/2004 |
| 6670217 | Methods for forming a die package Methods are provided for forming a die package. The method comprises stiffening a flexible substrate to provide a first flexibility of the flexible substrate, forming a mounting element on a first side of the flexible substrate, and mounting a first side ... | 12/30/2003 |
| 6670700 | Interconnect substrate and semiconductor device electronic instrument An interconnect substrate includes an upper substrate (30) on which an upper interconnect pattern (32) is formed, and a lower substrate (40) on which a lower interconnect pattern (42) is formed and to which the upper substrate (30) is adhered. The lower i... | 12/30/2003 |
| 6664644 | Semiconductor device and method for manufacturing the same The invention provide highly reliable semiconductor devices that realize further miniaturization and higher density. The invention also provides methods for manufacturing such semiconductor devices. A semiconductor device in accordance with the present in... | 12/16/2003 |
| 6660561 | Method of assembling a stackable integrated circuit chip A stackable integrated circuit chip package comprising a carrier and a flex circuit. The flex circuit itself comprises a flexible substrate having opposed top and bottom surfaces, and a conductive pattern which is disposed on the substrate. The chip packa... | 12/09/2003 |
| 6657696 | Flexible substrate, electro-optical device and electronic equipment The shape of the picture frame area of the electro-optical device is to be made symmetrical. The IC chip on panel is mounted in the edge area, along one side of the panel substrate of the electro-optical panel. Additionally, the IC chip on base material i... | 12/02/2003 |
| 6646335 | Flexible tape carrier with external terminals formed on interposers In order to provide a semiconductor apparatus in which both semiconductor chips and interposers are provided on a carrier tape, electrical properties can be improved using short wiring in a wiring pattern substantially symmetric with respect to the semico... | 11/11/2003 |
| 6627480 | Stacked semiconductor package and fabricating method thereof A stacked semiconductor package is formed by forming a semiconductor wafer having a plurality of semiconductor chips with chip pads on their upper sides, where the chips are arranged in pairs; sawing the wafer along edges of the semiconductor chips; adher... | 09/30/2003 |
| 6627984 | Chip stack with differing chip package types A chip stack comprising a flex circuit which itself comprises a flexible substrate having opposed, generally planar top and bottom surfaces. Disposed on the top surface of the substrate in spaced relation to each other are at least first and second top co... | 09/30/2003 |
| 6617671 | High density stackable and flexible substrate-based semiconductor device modules A flexible carrier substrate assembly or module that facilitates stacking of multiple carrier substrates bearing semiconductor dice for high density electronic systems. After the dice are placed on the flexible substrate, a flexible support frame may be a... | 09/09/2003 |
| 6617673 | Memory card A memory card includes a substrate and a resin-molded layer. The substrate includes contact pads that are on a second face thereof for communication with a card reader. Semiconductor chips are on a first face of the substrate and electrically connected to... | 09/09/2003 |
| 6600222 | Stacked microelectronic packages A microelectronic assembly including a flexible substrate with a first and a second surface, and with a microelectronic die portion and an external interconnect portion. The substrate has conductive traces integrated therewith. A first microelectronic die... | 07/29/2003 |
| 6580031 | Method for making a flexible circuit interposer having high-aspect ratio conductors A low-modulus-of-elasticity flexible adhesive interposer substrate has high aspect ratio via conductors to which an electronic device, such as a semiconductor chip or die or other component, is attached, e.g., for a high density electronic package. A meth... | 06/17/2003 |
