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| Number | Title | Issue Date |
| 7332798 | Non-contact ID card and manufacturing method thereof Provided is a non-contact ID card which is superior in the productivity and the electrical properties, and a method capable of manufacturing such non-contact ID card. The non-contact ID card of the present invention is characterized in that the non-contact ID card c... | 02/19/2008 |
| 7230332 | Chip package with embedded component A chip package is provided. The chip package includes at least one chip, an interconnection structure, a plurality of second pads and at least one panel-shaped component, wherein the chip includes a plurality of first pads on a surface thereof. The interconnection s... | 06/12/2007 |
| 7224052 | IC card with controller and memory chips An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural con... | 05/29/2007 |
| 7208823 | Semiconductor arrangement comprising transistors based on organic semiconductors and non-volatile read-write memory cells A semiconductor arrangement is disclosed, having transistors based on organic semiconductors and non-volatile read/write memory cells. The invention relates to a semiconductor arrangement, constructed from transistors, in the case of which the semiconductor path is ... | 04/24/2007 |
| 7199458 | Stacked offset semiconductor package and method for fabricating In the stacked semiconductor package, on a first semiconductor chip, a second semiconductor chip is stacked offset such that a portion of the first semiconductor chip is exposed. At least one first conductor electrically connects the exposed portion of the first sem... | 04/03/2007 |
| 7170162 | Chip embedded package structure A chip embedded package structure is provided. A stiffener is disposed on a tape. The tape has at least an alignment mark and the stiffener has at least a chip opening. A chip having a plurality of bonding pads thereon is disposed on the tape within the chip opening... | 01/30/2007 |
| 7095104 | Overlap stacking of center bus bonded memory chips for double density and method of manufacturing the same An approach to DRAM memory chip packaging leveraging the chip center position for wire bond pads to minimize time-of-flight and impedance effects resulting from stacking in a BGA application. A top layer of a dual device stack of center bus chips is stacked with an ... | 08/22/2006 |
| 6667192 | Device and method for making devices comprising at least a chip fixed on a support A method for mounting, on a support, at least a microcircuit in the form of a chip produced on a very thin semiconductor substrate. An interconnection point is provided at the chip in the form of a bump contact in weldable material. The bump contact has a... | 12/23/2003 |
| 6617673 | Memory card A memory card includes a substrate and a resin-molded layer. The substrate includes contact pads that are on a second face thereof for communication with a card reader. Semiconductor chips are on a first face of the substrate and electrically connected to... | 09/09/2003 |
| 6615390 | Method of manufacturing IC cards A IC card producing method includes testing steps which can enhance the reliability and generality of IC cards. The method of producing IC cards of the non-contact type or contact type implements a wafer processing step (step 100), wafer inspection step (... | 09/02/2003 |
| 6611050 | Chip edge interconnect apparatus and method The present invention provides a method of forming a low profile chip interconnection, and the interconnection so formed. A recessed contact area is formed at an edge of the wafer. A conductive material is deposited within the adjacent contact areas of ea... | 08/26/2003 |
| 6573567 | IC card An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connec... | 06/03/2003 |
| 6539623 | Multimediacard fabrication method A MultiMediaCard fabrication method includes the steps of (1) PCB layout, (2) mounting a conductor plate on the circuit board thus obtained by means of surface mounting technique, (3) die bond, (4) wire bond, (5) glob top, (6) injection shell, and (7) pri... | 04/01/2003 |
| 6483038 | Memory card The present invention provides a memory card having a reduced size as much as that of the package. The memory card includes electrical contact pads disposed in a single row on one end of the memory card. The memory card further comprises a card base and a... | 11/19/2002 |
| 6431456 | IC card An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connec... | 08/13/2002 |
| 6421248 | Chip card module A chip card module contains, in addition to conductor tracks and a chip carrier, one or more semiconductor chips and, if necessary, a stiffening frame. The semiconductor chip(s) and/or stiffening frame are attached with the aid of an adhesive, with which ... | 07/16/2002 |
| 6342434 | Methods of processing semiconductor wafer, and producing IC card, and carrier A semiconductor wafer is made thin without any cracks or warp under good workability. The semiconductor wafer thinning process includes the first step of preparing a carrier formed of a base and a suction pad provided on one surface of the base or formed ... | 01/29/2002 |
| 6259158 | Semiconductor device utilizing an external electrode with a small pitch connected to a substrate Concerning a plurality of second bonding pads that are electrically connected with a plurality of first bonding pads provided on an IC chip and having a predetermined narrow pitch, a technique is disclosed that allows the plurality of second pads to be pr... | 07/10/2001 |
| 6239483 | Semiconductor device Condenser (114), coil (115) and thin-thickness integrated circuit (312) are placed between the upper cover sheet (117) and the lower cover sheet (118), and adhesive (119) is filled into the space among them, whereby a card is fabricated. Because condenser... | 05/29/2001 |
| 6209790 | Data medium in card form and lead frame for use in such a data medium A data medium in card form has a least one semiconductor memory element with a storage capacity of at least one megabit and has electroplated contacts for transmission of data between a data processing system the semiconductor memory elements of the data ... | 04/03/2001 |
| 6031278 | IC card and manufacturing method thereof An IC card, and manufacturing method thereof, are provided in which a pair of upper and lower metal panels are fixed to the top and bottom surfaces of a resin frame. Projections projecting upward or downward and having a given height are formed at a given... | 02/29/2000 |
| 5986341 | Semiconductor device A condenser, a coil and a thin-thickness integrated circuit are placed between an upper cover sheet and a lower cover sheet, and adhesive is filled into the space between them, whereby a card is fabricated. Because the condenser, the coil and the thin-thi... | 11/16/1999 |
| 5889654 | Advanced chip packaging structure for memory card applications Integrated circuit chips (18, 42, or 56) are packaged within openings formed in a substrate such as PCMCIA Card (20, 40, or 54), thus allowing compliance with overall width dimension requirements for standardized electronic components. The arrangement has... | 03/30/1999 |
| 5786988 | Integrated circuit chips made bendable by forming indentations in their back surfaces flexible packages thereof and methods of manufacture The flexibility of normally brittle and breakable integrated circuit chips is increased by forming grooves, trenches, a series of holes, or the like, in a surface of the circuit chips that is opposite to the surface on which the integrated circuit is form... | 07/28/1998 |
| 5578868 | IC memory card An IC memory card has a connector that cannot warp during the manufacturing process even if the connector is long, such as a connector at one longer side of the IC memory card with an increased number of poles. The IC memory card has grooves in the surfac... | 11/26/1996 |
| 5574309 | Integrated circuit card comprising means for the protection of the integrated circuit A system for protecting integrated circuits on smart cards is described. The circuit (103) is placed in a cavity (102) in a ceramic package (101). Standard contacts (104) are deposited on the side of the package opposite to the cavity opening and connecte... | 11/12/1996 |
| 5565704 | Memory card having two types of memory integrated circuits connected to two different shaped connectors A memory card includes two types of memory integrated circuits (ICs) and two connectors located on opposite sides of the card. One connector is electrically connected to one type of memory ICs, and the other connector is electrically connected to the othe... | 10/15/1996 |
| 5521433 | IC card including a substrate having improved strength and heat radiation properties An IC card includes a substrate having a metal fiber resin material layer made of a mixture of a resin and metal fibers and a conductive pattern. The conductive pattern and the metal fiber resin material layer are electrically insulated from each other by... | 05/28/1996 |
| 5327010 | IC card having adhesion-preventing sheets An IC card includes a substrate, semiconductor devices mounted on at least one of the major surfaces of the substrate and a casing in which the substrate with the semiconductor devices mounted on it is housed. The casing includes a frame and panels bonded... | 07/05/1994 |
| 5299094 | IC card including multiple substrates bearing electronic components An IC card includes a main substrate and a plurality of sub-substrates. Each sub-substrate has two surfaces on which electronic components are installed. The sub-substrates are mounted on both surfaces of the main substrate within the IC card. Openings in... | 03/29/1994 |
| 5289349 | Integrated circuit card Disclosed is an IC card comprising a plurality of semiconductor IC chips and a plurality of lead wires acting as the terminals for connectin,o the electrodes of the semiconductor IC chips to the outside. The semiconductor IC chips and the lead wires are i... | 02/22/1994 |
| 5122860 | Integrated circuit device and manufacturing method thereof Provided is an integrated circuit device is used in an IC card or the like, and a manufacturing method of the integrated circuit device, having a thin thickness so as to be capable of being manufactured highly accurately in dimensions and highly efficient... | 06/16/1992 |
| 5097117 | Electronic microcircuit card and method for its manufacture An electronic microcircuit card and method for its manufacture are disclosed. Contacts 12 that are accessible through an opening 26 of the card 10 are raised by a boss 27 formed under the contacts in such a manner that they come approximately to the level... | 03/17/1992 |
| 5048179 | IC chip mounting method An IC mounting method and its resulting structure, such as an IC card is provided. An IC card includes a metal plate formed with at least one hole, and an IC chip is located fixed in position in the hole with a filler material filling the gap between the ... | 09/17/1991 |
| 5038251 | Electronic apparatus and a method for manufacturing the same A thin electronic calculator having a circuit board unit in which an IC pellet is directly mounted on a film board and allowing easy mass-production is provided. Metal foil leads each having one end and the other end radially extending from the one end an... | 08/06/1991 |
| 5018051 | IC card having circuit modules for mounting electronic components An IC card is disclosed which comprises a card-shaped main substrate having a surface on which recess portions are formed and an edge portion having a connector layer with an external connector terminal pattern formed thereon, circuit modules embedded in ... | 05/21/1991 |
| 4962415 | IC card An IC card is provided in which an IC chip is packaged in an opening formed in the IC card. One surface of the IC chip is laid on a film substrate on which external contact terminals are formed, and the other surface is covered with a reinforcing plate, t... | 10/09/1990 |
| 4961105 | Arrangement of a semiconductor device for use in a card A card like semiconductor device comprising a circuit board made of plastic resin and a semiconductor pellet mounted to the circuit board, wherein a metal layer is formed on one surface of the semiconductor pellet on which semiconductor circuit is not for... | 10/02/1990 |
| 4910582 | Semiconductor device and method of manufacturing thereof This invention concerns a semiconductor device of a tape carrier type and a method of manufacturing the same, wherein electroconductive layers made of the same material as that of lead terminals are disposed so as to substantially surround the circumferen... | 03/20/1990 |
| 4822989 | Semiconductor device and method of manufacturing thereof This invention concerns a semiconductor device of a tape carrier type and a method of manufacturing the same, wherein electroconductive layers made of the same material as that of lead terminals are disposed so as to substantially surround the circumferen... | 04/18/1989 |
