Bizarre Patents
Safety System For Remove a Rider From a Vehicle by Deploying a Parachute
Methods and apparatus for reducing the velocity of a rider in or on an open cockpit vehicle when the rider is thrown from the vehicle.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7385281 | Semiconductor integrated circuit device A COC DRAM including a plurality of stacked DRAM chips is mounted on a motherboard by using an interposer. The interposer includes a Si unit and a PCB. The Si unit includes a Si substrate and an insulating-layer unit in which wiring is installed. The PCB includes a ... | 06/10/2008 |
| 7372139 | Semiconductor chip package A semiconductor chip package may include a substrate, which may have bonding pads formed thereon. A semiconductor chip mounted on the substrate may have chip pads, and electrical connections for connecting the chip pads of the semiconductor chip to the substrate bon... | 05/13/2008 |
| 7340829 | Method for fabricating electrical connection structure of circuit board A method for fabricating an electrical connection structure of a circuit board is proposed. The circuit board is provided with a plurality of pads on a surface thereof and with a plurality of conductive structures therein for electrically connecting the pad. A plura... | 03/11/2008 |
| 7335972 | Heterogeneously integrated microsystem-on-a-chip A microsystem-on-a-chip comprises a bottom wafer of normal thickness and a series of thinned wafers can be stacked on the bottom wafer, glued and electrically interconnected. The interconnection layer comprises a compliant dielectric material, an interconnect struct... | 02/26/2008 |
| 7332736 | Article comprising gated field emission structures with centralized nanowires and method for making the same This invention provides novel methods of fabricating novel gated field emission structures that include aligned nanowire electron emitters (individually or in small groups) localized in central regions within gate apertures. It also provides novel devices using nano... | 02/19/2008 |
| 7307293 | Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages susp... | 12/11/2007 |
| 7276787 | Silicon chip carrier with conductive through-vias and method for fabricating same A carrier structure and method for fabricating a carrier structure with through-vias each having a conductive structure with an effective coefficient of thermal expansion which is less than or closely matched to that of the substrate, and having an effective elastic... | 10/02/2007 |
| 7239024 | Semiconductor package with recess for die A semiconductor package is disclosed with a recess (51) for an integrated circuit die (52). The recess is made by bending or deforming all layers of a package substrate, and therefore the recess contains circuitry to connect to the integrated circuit d... | 07/03/2007 |
| 7224062 | Chip package with embedded panel-shaped component A bump-less chip package is provided. The bump-less chip package includes a chip, an interconnection structure and a panel-shaped component. The panel-shaped component has a plurality of electrical terminals on a first surface thereof. The back surface of the chip i... | 05/29/2007 |
| 7199458 | Stacked offset semiconductor package and method for fabricating In the stacked semiconductor package, on a first semiconductor chip, a second semiconductor chip is stacked offset such that a portion of the first semiconductor chip is exposed. At least one first conductor electrically connects the exposed portion of the first sem... | 04/03/2007 |
| 7138708 | Electronic system for fixing power and signal semiconductor chips An electronic system having a sandwich design and including two carriers, each carrier having a printed circuit layer, the upper printed circuit layer being positioned on different planes. ... | 11/21/2006 |
| 7084513 | Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same A semiconductor device includes a first semiconductor chip (5) having a first terminal (7) on one surface, a second semiconductor chip (1a) which is larger than the first semiconductor chip (5) and on which the first semiconductor ... | 08/01/2006 |
| 6703697 | Electronic package design with improved power delivery performance An electronic package with improved power delivery performance, lowering the impedance associated with the power delivery. The electronic package includes an integrated circuit die mounted on the substrate of the electronic package and decoupling capacito... | 03/09/2004 |
| 6700072 | Electrical connection with inwardly deformable contacts An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact extends from a central conductor, and has a peripheral portion adapted to contract radially inwardly toward the central conductor response ... | 03/02/2004 |
| 6697257 | Power semiconductor module Disclosed in a power semiconductor module which includes a stack of carrier substrates, disposed one above the other in multiple layers and provided with at least one conductor track on at least one main surface, in which at least one electronic semicondu... | 02/24/2004 |
| 6693362 | Multichip module having chips mounted on upper and under surfaces of a thin film closing an opening formed in a rigid substrate A multichip module is provided. The multichip module comprises a rigid substrate including a core material and having an opening, a thin film fixed on an upper surface of the rigid substrate so as to be electrically connected to the rigid substrate and to... | 02/17/2004 |
| 6687985 | Method of Manufacturing a multi-layer circuit board A multilayer wiring board comprising a mother wiring board and a carrier wiring board, in which all of the composing layers have IVH structure. The mother wiring board (11) is formed in the manner that a plurality of resin-impregnated-fiber-sheets having ... | 02/10/2004 |
| 6686223 | Method for fabricating multi-chip package semiconductor device A semiconductor device includes a substrate (101); a first semiconductor chip (102) mounted on the substrate; and a first insulating layer (105) which is provided on the first semiconductor chip. The device further includes a metal layer (102) which is pr... | 02/03/2004 |
| 6683384 | Air isolated crossovers The specification describes integrated circuit air isolated crossover interconnections designed for flip chip multi-chip module interconnection technology. The crossovers are made using a crossover interconnection substrate separate from the interconnecti... | 01/27/2004 |
| 6665190 | Modular PC card which receives add-in PC card modules A modular and user configurable PC Card which removably receives one or more add-in modules that provide selected functionality. The user inserts and removes selected modules in the PC Card to configure the PC Card to the desired functionality. The PC Car... | 12/16/2003 |
| 6644982 | Method and apparatus for the transport and tracking of an electronic component An apparatus for use in manipulating one or more IC die through testing after they have been cut from the original wafer. A carrier supports the die during the transport, testing, and/or final application. The die is placed into the carrier through an ope... | 11/11/2003 |
| 6642615 | Semiconductor device and method of manufacturing the same, circuit board and electronic instrument A method of manufacturing a semiconductor device comprising the steps of: forming a bump projecting from a first surface of a semiconductor chip; and forming a conductive layer so that part of the conductive layer is exposed at a position depressed from a... | 11/04/2003 |
| 6642625 | Sockets for "springed" semiconductor devices Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an in... | 11/04/2003 |
| 6627992 | Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set A millimeter wave (MMW) transceiver module includes a microwave monolithic integrated circuit (MMIC) transceiver chip set that is surface mounted on a circuit board. The MMIC transceiver chip set includes a receiver MMIC chip package, a transmitter MMIC c... | 09/30/2003 |
| 6627483 | Method for mounting an electronic component A method for mounting an electronic component. In one example of this method, the electronic component is an integrated circuit which is placed against an element of a carrier, such as a frame of a carrier. The electronic component has a plurality of elon... | 09/30/2003 |
| 6621155 | Integrated circuit device having stacked dies and impedance balanced transmission lines A multi-chip device which includes a plurality of integrated circuit die disposed one over another. Each integrated circuit die includes one or a plurality of bond pads. One or a plurality of conductors are disposed to electrically couple the bond pads of... | 09/16/2003 |
| 6618267 | Multi-level electronic package and method for making same A multi-level package, and method for making same, that offers a small size with compartmentalized areas that allow for radiation shielding is disclosed. In its simplest embodiment, the invention comprises two cards and an interposer interposed between th... | 09/09/2003 |
| 6607939 | Method of making a multi-layer interconnect Methods and apparatus for increasing the yield achieved during high density interconnect (HDI) production. In particular, processes in which panels are tested to identify good cells/parts, good cells are removed from the panels, and new panels created ent... | 08/19/2003 |
| 6600214 | Electronic component device and method of manufacturing the same An electronic component device includes a printed wiring board having a side surface terminal portion formed of a recessed groove, filler, and plating conductor. The recessed groove is formed in a side surface, or a corner adjacent to the side surface, of... | 07/29/2003 |
| 6597582 | Semiconductor device incorporating module structure A semiconductor device comprises a plurality of semiconductor block modules mounted on a system board. The semiconductor block module comprises a block socket and a module board fitted thereto. The block socket assumes an annular shape and has connection ... | 07/22/2003 |
| 6594891 | Process for forming multi-layer electronic structures A process of forming a multi-layer electronic composite structure. The process includes providing at least one core including at least one plane of at least one electrically conducting material with a plane of at least one electrically insulating material... | 07/22/2003 |
| 6576997 | Semiconductor device and method for fabricating the same A semiconductor device includes a substrate (101); a first semiconductor chip (102) mounted on the substrate; and a first insulating layer (105) which is provided on the first semiconductor chip. The device further includes a metal layer (102) which is pr... | 06/10/2003 |
| 6570469 | Multilayer ceramic device including two ceramic layers with multilayer circuit patterns that can support semiconductor and saw chips A multilayer ceramic device improves device functionality, reduces overall device size and profile, makes manufacturing easier, and improves reliability. A first ceramic layer has a first multilayer circuit pattern electrically connected through via holes... | 05/27/2003 |
| 6569710 | Panel structure with plurality of chip compartments for providing high volume of chip modules A method of forming a plurality of individual semiconductor chip modules wherein a plurality of chips are placed in a plurality of chip compartments formed by adhering a support panel to the first surface and a cover panel to the second surface of a stiff... | 05/27/2003 |
| 6534856 | Sockets for "springed" semiconductor devices Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an in... | 03/18/2003 |
| 6535398 | Multichip module substrates with buried discrete capacitors and components and methods for making Modularly constructed multichip modules with are disclosed. A plurality of miniature capacitor substrates and/or miniature resistor substrates are assembled and attached to a base substrate, preferably in a regular pattern. Power supply substrates are pre... | 03/18/2003 |
| 6525415 | Three-dimensional semiconductor integrated circuit apparatus and manufacturing method therefor A three-dimensional semiconductor integrated circuit apparatus which permits ready electrical connection and is resistant to deformation and easy to fabricate and a manufacturing method therefor are provided. A second semiconductor substrate is stacked ov... | 02/25/2003 |
| 6525414 | Semiconductor device including a wiring board and semiconductor elements mounted thereon A semiconductor device is made by mounting semiconductor elements on both sides of a wiring board having three-dimensional wiring including inner-via holes. A high operating speed and smaller size are made possible by employing a laminated structure of se... | 02/25/2003 |
| 6521530 | Composite interposer and method for producing a composite interposer A composite interposer for providing power and signal connections between an integrated circuit chip or chips and a substrate. The interposer includes a signal core formed from a conductive power/ground plane positioned between two dielectric layers. A me... | 02/18/2003 |
| 6518516 | Multilayered laminate A multilayered laminate, substructures and associated methods of fabrication are presented. The multilayered laminate includes in sequential order: (a) a first intermediate layer having microvias and conductive lands; (b) a plurality of signal/power plane... | 02/11/2003 |
