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...During the Civil War, the Confederacy established its own Patent Office which issued 266 patents, a third of which concerned implements of war.
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| Number | Title | Issue Date |
| 7444253 | Air bridge structures and methods of making and using air bridge structures A probe card assembly, according to some embodiments of the invention, can comprise a tester interface configured to make electrical connections with a test controller, a plurality of electrically conductive probes disposed to contact terminals of an electronic devi... | 10/28/2008 |
| 7411304 | Semiconductor interconnect having conductive spring contacts An interconnect for testing a semiconductor component includes a substrate, and interconnect contacts on the substrate configured to electrically engage component contacts on a semiconductor component. Each interconnect contact includes a compliant conductive layer ... | 08/12/2008 |
| 7394155 | Top and sidewall bridged interconnect structure and method An interconnect structure and its method for fabrication each employ an interconnect formed over and adjacent an active region of a semiconductor substrate. A gate electrode is also formed over the active region. Spacer layers are formed adjoining the interconnect a... | 07/01/2008 |
| 7391117 | Method for fabricating semiconductor components with conductive spring contacts An interconnect for testing a semiconductor component includes a substrate, and interconnect contacts on the substrate configured to electrically engage component contacts on a semiconductor component. Each interconnect contact includes a compliant conductive layer ... | 06/24/2008 |
| 7375421 | High density multilayer circuit module Thinning and stacking are essential for circuit modules used for mobile devices of various kinds, smart cards, memory cards and the like. These demands make the manufacture of the circuit modules more complicated or less reliable due to delamination. A circuit modul... | 05/20/2008 |
| 7112866 | Method to form a cross network of air gaps within IMD layer The invention provides a new multilevel interconnect structure of air gaps in a layer of IMD. A first layer of dielectric is provided over a surface; the surface contains metal points of contact. Trenches are provided in this first layer of dielectric. The trenches ... | 09/26/2006 |
| 7102243 | Mask-making member and its production method, mask and its making method, exposure process, and fabrication method of semiconductor device A mask blank has a plurality of pattern formation regions in which mask circuit patterns are to be formed, and a supporting region in which any mask circuit pattern is not to be formed. The supporting region is provided for holding the plurality of pattern formation... | 09/05/2006 |
| 6682981 | Stress controlled dielectric integrated circuit fabrication General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a sem... | 01/27/2004 |
| 6294909 | Electro-magnetic lithographic alignment method A method of aligning a lithographic fabrication tool to a substrate to be exposed or patterned by the tool includes the steps of providing a first conductive coil pattern on a surface of the substrate, applying electrical current to the coil pattern, prov... | 09/25/2001 |
| 6288561 | Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus A single gas tight system which performs multi-functions including reducing the thickness of oxides on contact pads and probing, testing, burn-in, repairing, programming and binning of integrated circuits. A system according to one embodiment of the prese... | 09/11/2001 |
| 6268262 | Method for forming air bridges Disclosed is a method for making an air bridge in an electronic device. This method uses amorphous silicon carbide to protect electrical conductors in the device during formation of the bridge. The silicon carbide also provides hermetic and physical prote... | 07/31/2001 |
| 6229203 | Semiconductor interconnect structure for high temperature applications A circuit module includes at least one high temperature semiconductor chip having chip pads; a substrate having substrate metallization, the chip pads and the substrate metallization being substantially planar; and a deposited flexible pattern of electric... | 05/08/2001 |
| 6008126 | Membrane dielectric isolation IC fabrication General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a sem... | 12/28/1999 |
| 5985693 | High density three-dimensional IC interconnection General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a sem... | 11/16/1999 |
| 5977575 | Semiconductor sensor device comprised of plural sensor chips connected to function as a unit The semiconductor image sensor device of the multiple chip mount type is constructed such that electrical and mechanical connections are carried out concurrently among chips. Coupling chips 4 are utilized to couple a plurality of semiconductor image senso... | 11/02/1999 |
| 5949133 | Semiconductor interconnect structure for high temperature applications A circuit module includes at least one high temperature semiconductor chip having chip pads; a substrate having substrate metallization, the chip pads and the substrate metallization being substantially planar; and a deposited flexible pattern of electric... | 09/07/1999 |
| 5946559 | Membrane dielectric isolation IC fabrication General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a sem... | 08/31/1999 |
| 5898223 | Chip-on-chip IC packages The specification describes interconnection layouts for chip-on-chip packages using solder bump interchip connections as vias between a single level metal interconnection pattern on the lower support IC chip and another single level interconnection patter... | 04/27/1999 |
| 5869354 | Method of making dielectrically isolated integrated circuit General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a sem... | 02/09/1999 |
| 5864169 | Semiconductor device including plated heat sink and airbridge for heat dissipation A semiconductor device includes a semiconductor substrate having opposite front and rear surfaces; a semiconductor element disposed on the front surface of the semiconductor substrate and including an electrode; a PHS for dissipating heat generated in the... | 01/26/1999 |
| 5840593 | Membrane dielectric isolation IC fabrication General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a sem... | 11/24/1998 |
| 5834334 | Method of forming a multi-chip module from a membrane circuit General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a sem... | 11/10/1998 |
| 5744379 | Semiconductor device composed of plural semiconductor chips and coupling means which couple the semiconductor chips together The semiconductor image sensor device of the multiple chip mount type is constructed such that electrical and mechanical connections are carried out concurrently among chips. Coupling chips 4 are utilized to couple a plurality of semiconductor image senso... | 04/28/1998 |
| 5719748 | Semiconductor package with a bridge for chip area connection A semiconductor package including a base having a chip receiving portion and a surrounding portion; a bridge having conductive strips extending over the chip and supported at the surrounding portion; wires connect the conductive strips to power and ground... | 02/17/1998 |
| 5712767 | Circuit elements mounting The invention provides a circuit element mounting structure including (a) a substrate having a pattern A of wirings therein, (b) at least one cavity formed at a surface the substrate, and (c) a cap for covering the cavity therewith, the cap including a pa... | 01/27/1998 |
| 5677574 | Airbridge wiring structure for MMIC An airbridge wiring structure includes a substrate having a surface; a first wiring layer disposed on the surface of the substrate; and a second wiring layer disposed partially on the surface of the substrate and including an airbridge wiring layer crossi... | 10/14/1997 |
| 5672546 | Semiconductor interconnect method and structure for high temperature applications A method for interconnecting at least one semiconductor chip (14 or 36) having chip pads (16 or 38) includes applying a removable polymer layer (22 or 44) over the chip; forming vias (26 or 50) in the polymer layer aligned with predetermined chip pads; de... | 09/30/1997 |
| 5654220 | Method of making a stacked 3D integrated circuit structure General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a sem... | 08/05/1997 |
| 5637907 | Three dimensional semiconductor circuit structure with optical interconnection General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a sem... | 06/10/1997 |
| 5633209 | Method of forming a circuit membrane with a polysilicon film General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a sem... | 05/27/1997 |
| 5614442 | Method of making flip-chip microwave integrated circuit A flip-chip integrated circuit 1100 having a transistor 1108 formed at a frontside surface of a substrate 1104. An airbridge 1106 may be formed over portions of the transistor wherein a top surface of the airbridge is spaced from the frontside surface by ... | 03/25/1997 |
| 5612257 | Method of making flip-chip microwave integrated circuit A flip-chip integrated circuit having passive 302, 304, 306 as well as active 308, 310 components on a frontside surface of a substrate. The active devices have airbridges which contact a heatsink to provide heat dissipation from the junctions of the devi... | 03/18/1997 |
| 5592007 | Membrane dielectric isolation transistor fabrication General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a sem... | 01/07/1997 |
| 5592018 | Membrane dielectric isolation IC fabrication General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a sem... | 01/07/1997 |
| 5580687 | Contact stepper printed lithography method General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a sem... | 12/03/1996 |
| 5571741 | Membrane dielectric isolation IC fabrication General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a sem... | 11/05/1996 |
| 5532506 | Integrated circuit adapted for improved thermal impedance A flip-chip integrated circuit 1100 having a transistor 1108 formed at a frontside surface of a substrate 1104. An airbridge 1106 may be formed over portions of the transistor wherein a top surface of the airbridge is spaced from the frontside surface by ... | 07/02/1996 |
| 5521406 | Integrated circuit with improved thermal impedance A flip-chip integrated circuit having passive 302, 304, 306 as well as active 308, 310 components on a frontside surface of a substrate. The active devices have airbridges which contact a heatsink to provide heat dissipation from the junctions of the devi... | 05/28/1996 |
| 5401687 | Process for high density interconnection of substrates and integrated circuit chips containing sensitive structures In a method for preserving an air bridge structure on an integrated circuit chip used in an overlay process, a patternable protective layer is applied for providing mechanical strength to prevent deformation during subsequent processing. A polymeric film ... | 03/28/1995 |
| 5402003 | Low dielectric constant interconnect for multichip modules A substrate applicable to be used in a multichip module including a plurality of integrated circuits. The substrate includes a series of interrelated metal layers, ceramic layers and lattice structures formed by the ceramic layers. The metal layers provid... | 03/28/1995 |
