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| Number | Title | Issue Date |
| 7384862 | Method for fabricating semiconductor device and display device It is an object of the present invention to alleviate unevenness due to an opening for making a contact with the lower layer even when the opening has a large diameter (1 μm or more). Thus, it is a further object of the invention to reduce defects caused by the une... | 06/10/2008 |
| 7321133 | Heteroatomic regioregular poly(3-substitutedthiophenes) as thin film conductors in diodes which are not light emitting or photovoltaic Regio-regular polythiophenes used in diodes which are not light emitting or photovoltaic. High quality, processable thin film polymer films can be made. The thin film can have a thickness of about 50 nm to about one micron, and the conductive thin film can be applie... | 01/22/2008 |
| 7282779 | Device, method of manufacture thereof, manufacturing method for active matrix substrate, electro-optical apparatus and electronic apparatus A device includes banks formed on a substrate, a conducting film formed by droplet ejection onto a predetermined pattern formation region in a groove between the banks, and a second conductive film formed by droplet ejection disposed outside the pattern formation re... | 10/16/2007 |
| 7126228 | Apparatus for processing semiconductor devices in a singulated form Improved methods and apparatus are provided for the handling and testing of semiconductor devices. One embodiment comprises a die carrier for one or more semiconductor dice having very fine pitch electrical I/O (input/output) elements. The semiconductor dice are tem... | 10/24/2006 |
| 6685853 | Energy sensitive electrically conductive admixtures, uses thereof, methods of fabrication and structures fabricated therewith The present invention is an admixture of an electrically conductive material and an energy sensitive material resulting in a conductive energy sensitive composition. The structures are useful for lithography in microelectronic fabrication to avoid the eff... | 02/03/2004 |
| 6635406 | Method of producing vertical interconnects between thin film microelectronic devices and products comprising such vertical interconnects The present invention provides a method of photochemically producing a vertical interconnect between a first and a second thin-film microelectronic device in an vertical interconnect area which comprises an overlap of a stack of a first electrically condu... | 10/21/2003 |
| 6602732 | Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate A method for manufacturing a semiconductor device includes the steps of providing a semiconductor chip having a pad-mounting surface with a bonding pad, forming an inner bump on the bonding pad, and forming a conductive body on the pad-mounting surface. T... | 08/05/2003 |
| 6506321 | Silicon based conductive material and process for production thereof A silicon based conductive material based on a semiconductor silicon and having an electric resistivity of 10-3 (Ω.multidot.m) or less at ambient temperature which has been unattainable heretofore, while facilitating production and handling. A... | 01/14/2003 |
| 6455941 | Chip scale package A chip scale package comprises a film substrate attached to the active surface of a semiconductor chip by an adhesive layer. The adhesive layer has a plurality of apertures formed corresponding to bonding pads on the chip. The film substrate includes a fi... | 09/24/2002 |
| 6437448 | Semiconductor device adapted for mounting on a substrate A method for manufacturing a semiconductor device includes the steps of providing a semiconductor chip having a pad-mounting surface with a bonding pad, forming a first bump on the bonding pad, forming a photoresist layer on the pad-mounting surface, form... | 08/20/2002 |
| 6400016 | Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate A method for manufacturing a semiconductor device includes the steps of providing a semiconductor chip having a pad-mounting surface with a bonding pad, forming an inner bump on the bonding pad, and forming a conductive body on the pad-mounting surface. T... | 06/04/2002 |
| 6400024 | Method of providing a vertical interconnect between thin film microelectronic devices A simple and reliable method of providing a vertical interconnect between thin-film microelectronic devices is provided. In said method, a tool tip is used to make a notch in a vertical interconnect area of two organic electrically conducting areas separa... | 06/04/2002 |
| 6333561 | Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate A semiconductor device is adapted for mounting on a substrate that has a chip-mounting region provided with a plurality of solder points. The semiconductor device includes a semiconductor chip having a pad-mounting surface provided with a plurality of bon... | 12/25/2001 |
| 6326936 | Electrode means, comprising polymer materials, with or without functional elements and an electrode device formed of said means In an electrode device for addressing a functional element a layer of electrical isolating materials is provided between first and second electrodes intersecting without direct physical or electrical contact and forming a bridge structure. Over both elect... | 12/04/2001 |
| 6246102 | Integrated circuits, transistors, data processing systems, printed wiring boards, digital computers, smart power devices, and processes of manufacture An integrated circuit includes conductive elements and a radiation sensitive material interposed between the conductive elements and dosed to different conductivities in different portions thereof. Another aspect is a process of integrated circuit fabrica... | 06/12/2001 |
| 6239488 | Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate A semiconductor device is adapted for mounting on a substrate that has a chip-mounting region provided with a plurality of solder points. The semiconductor device includes a semiconductor chip having a pad-mounting surface provided with a plurality of bon... | 05/29/2001 |
| 6214259 | Dispersion containing Cu ultrafine particles individually dispersed therein A dispersion containing Cu ultrafine particles individually dispersed therein comprises an organic solvent which is hardly evaporated at room temperature, but can be evaporated during a drying-firing step upon forming Cu-distributing wires on a semiconduc... | 04/10/2001 |
| 6153724 | Preparation of cross-linked 2-dimensional polymers with sidedness from ,ଲ-lactones Polymers and processes for synthesizing the polymers from ,ଲ-unsaturated lactones, particularly 2(5H)-furanone, and amines with side chains. The polymers are used as hydrogels, as polymers that can bind metals and form complexes that are solu... | 11/28/2000 |
| 6138348 | Method of forming electrically conductive polymer interconnects on electrical substrates A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a firs... | 10/31/2000 |
| 6132644 | Energy sensitive electrically conductive admixtures The present invention is an admixture of an electrically conductive material and an energy sensitive material resulting in a conductive energy sensitive composition. The structures are useful for lithography in microelectronic fabrication to avoid the eff... | 10/17/2000 |
| 6134118 | Conductive epoxy flip-chip package and method A method and apparatus for producing a multichip package comprising semiconductor chip and a substrate. The semiconductor chip includes conventional inner bond pads that are rerouted to other areas on the chip to facilitate connection with the substrate. ... | 10/17/2000 |
| 6121688 | Anisotropic conductive sheet and printed circuit board An anisotropic conductive sheet material includes a resin and conductive fillers, such as metallic particles, added in the resin. A conductive layer is formed on one of the surfaces of the anisotropic conductive sheet material. A circuit board includes a ... | 09/19/2000 |
| 5918364 | Method of forming electrically conductive polymer interconnects on electrical substrates A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a firs... | 07/06/1999 |
| 5886415 | Anisotropic conductive sheet and printed circuit board An anisotropic conductive sheet material includes a resin and conductive fillers, such as metallic particles, added in the resin. A conductive layer is formed on one of the surfaces of the anisotropic conductive sheet material. A circuit board includes a ... | 03/23/1999 |
| 5879761 | Method for forming electrically conductive polymer interconnects on electrical substrates A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a firs... | 03/09/1999 |
| 5689428 | Integrated circuits, transistors, data processing systems, printed wiring boards, digital computers, smart power devices, and processes of manufacture An integrated circuit includes conductive elements and a radiation sensitive material interposed between the conductive elements and dosed to different conductivities in different portions thereof. Another aspect is a process of integrated circuit fabrica... | 11/18/1997 |
| 5685939 | Process for making a Z-axis adhesive and establishing electrical interconnection therewith A Z-axis adhesive is produced by dispersing electrically-conductive particles in an organic binder and then imagewise exposing the material to electromagnetic radiation, preferably from a laser or a flash lamp, under conditions sufficient to transfer the ... | 11/11/1997 |
| 5677576 | Chip sized semiconductor device A chip sized semiconductor device includes a semiconductor chip having upper and lower surfaces. The chip has electrodes formed on the upper surface thereof. An electrically insulating passivation film is formed on the upper surface of the semiconductor c... | 10/14/1997 |
| 5657206 | Conductive epoxy flip-chip package and method A method and apparatus for producing a multichip package comprising semiconductor chip and a substrate. The semiconductor chip includes conventional inner bond pads that are rerouted to other areas on the chip to facilitate connection with the substrate. ... | 08/12/1997 |
| 5611140 | Method of forming electrically conductive polymer interconnects on electrical substrates A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a firs... | 03/18/1997 |
| 5604379 | Semiconductor device having external electrodes formed in concave portions of an anisotropic conductive film A semiconductor device comprising a semiconductor chip, a plurality of electrode pads formed on the semiconductor chip, a metal wiring having a desired pattern and connected to the electrode pads, an anisotropic conductive film containing fine conductive ... | 02/18/1997 |
| 5473119 | Stress-resistant circuit board A circuit board resists shear stress caused by the unequal thermal coefficients of expansion of a mounted electronic component and a circuit board upon which it is mounted. The circuit board is defined by a support layer, a shear stress-relieving layer an... | 12/05/1995 |
| 5302548 | Semiconductor device manufacturing method A semiconductor device includes at least one wiring layer containing aluminum as the major constituent and provided through an insulating film on a semiconductor substrate on which components or elements are formed, and a heat resistant high molecular org... | 04/12/1994 |
| 5289035 | Tri-layer titanium coating for an aluminum layer of a semiconductor device A tri-layer titanium coating for an aluminum layer of a semiconductor device. An aluminum layer used for interconnecting individual devices of an integrated circuit is formed on a semiconductor material. A first titanium nitride layer is deposited on the ... | 02/22/1994 |
| 5270253 | Method of producing semiconductor device A semiconductor device which includes an electrode portion formed on a wafer; a passivation film deposited on said wafer except for said electrode portion; an insulating film deposited only on said passivation film so as to have a predetermined thickness ... | 12/14/1993 |
| 5260115 | Organic electro-conductive thin films and process for production thereof The present invention relates to electrical and optical materials, and particularly to organic electro-conductive thin films exhibiting electro-conductivity and non-linear optical effect, and to processes for the production thereof. Further, the above pro... | 11/09/1993 |
| 5237130 | Flip chip technology using electrically conductive polymers and dielectrics A method is presented for interconnecting bond pads of a flip chip with bond pads of a substrate by an electrically conductive polymer. An organic protective layer is selectively formed over a surface of a flip chip to thereby leave exposed bond pads on t... | 08/17/1993 |
| 5235212 | Semiconductor device having a mechanical buffer A metal having a Knoop hardness of 40 or more is used as an electrode, Cu or a Cu alloy is used as a thin metal wire, and a mechanical buffer layer is formed between the electrode and an insulating material layer. Silicon nitride or metal vanadium is used... | 08/10/1993 |
| 5231053 | Process of forming a tri-layer titanium coating for an aluminum layer of a semiconductor device A tri-layer titanium coating for an aluminum layer of a semiconductor device. An aluminum layer used for interconnecting individual devices of an integrated circuit is formed on a semiconductor material. A first titanium nitride layer is deposited on the ... | 07/27/1993 |
| 5196371 | Flip chip bonding method using electrically conductive polymer bumps A method is presented for interconnecting bond pads of a flip chip with bond pads of a substrate by an electrically conductive polymer. A first organic protective layer is selectively formed over a surface of a flip chip to thereby leave exposed bond pads... | 03/23/1993 |
