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A method of swing on a swing is disclosed, in which a user positioned on a standard swing suspended by two chains from a substantially horizontal tree branch induces side to side motion by pulling alternately on one chain and then the other.
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| Number | Title | Issue Date |
| 7432597 | Semiconductor device and method of manufacturing the same In a semiconductor device including a memory region and a logic region, one or more of a plurality of logic transistor connection plugs, buried in a first insulating layer and connected to a diffusion layer of a logic transistor, are left unconnected to a first inte... | 10/07/2008 |
| 7414275 | Multi-level interconnections for an integrated circuit chip Multilevel metallization layouts for an integrated circuit chip including transistors having first, second and third elements to which metallization layouts connect. The layouts minimize current limiting mechanism including electromigration by positioning the connec... | 08/19/2008 |
| 7411304 | Semiconductor interconnect having conductive spring contacts An interconnect for testing a semiconductor component includes a substrate, and interconnect contacts on the substrate configured to electrically engage component contacts on a semiconductor component. Each interconnect contact includes a compliant conductive layer ... | 08/12/2008 |
| 7400044 | Semiconductor integrated circuit device To improve a degree of integration and reliability of a semiconductor integrated circuit device. There are included third wire 14 arranged in the same layer as first wire 11 and second wire 12 and arranged in a direction intersecting with the fi... | 07/15/2008 |
| 7391117 | Method for fabricating semiconductor components with conductive spring contacts An interconnect for testing a semiconductor component includes a substrate, and interconnect contacts on the substrate configured to electrically engage component contacts on a semiconductor component. Each interconnect contact includes a compliant conductive layer ... | 06/24/2008 |
| 7385295 | Fabrication of nano-gap electrode arrays by the construction and selective chemical etching of nano-crosswire stacks Methods of fabricating nano-gap electrode structures in array configurations, and the structures so produced. The fabrication method involves depositing first and second pluralities of electrodes comprising nanowires using processes such as lithography, deposition o... | 06/10/2008 |
| 7378340 | Method of manufacturing semiconductor device and semiconductor device The present invention provides a method of manufacturing a semiconductor device and a semiconductor device that allow use of interlayer and interconnect insulating films having a low dielectric constant in forming a dual damascene structure. A first insulating film,... | 05/27/2008 |
| 7368803 | System and method for protecting microelectromechanical systems array using back-plate with non-flat portion Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate, an interferometric modulation display array formed on the substrate, and a back-plate. The back-plate is placed over the dis... | 05/06/2008 |
| 7358179 | Method of manufacturing semiconductor device including air space formed around gate electrode After a HEMT is formed, side walls are formed on a semiconductor substrate. Next, a sacrificial layer is formed to cover the HEMT. Next, contact holes are formed in the sacrificial layer to expose upper surfaces of source electrodes. Next, a metal interconnect line ... | 04/15/2008 |
| 7332812 | Memory card with connecting portions for connection to an adapter Semiconductor devices having conductive lines with extended ends and methods of extending conductive line ends by a variable distance are disclosed. An end of a first conductive feature of an interconnect structure is extended by a first distance, and an end of a se... | 02/19/2008 |
| 7327030 | Apparatus and method incorporating discrete passive components in an electronic package An apparatus and method for incorporating discrete passive components into an integrated circuit package. A metal layer is formed over a surface of a substrate. A layer of photosensitive material is then formed over the metal layer. Using standard photolithographic ... | 02/05/2008 |
| 7291931 | Semiconductor device, semiconductor substrate and fabrication process of a semiconductor device A semiconductor device includes a first insulation layer including a first conductor pattern, a second insulation layer formed on the first insulation layer and including a second conductor pattern, and a third conductor pattern formed on the second insulation layer... | 11/06/2007 |
| 7245019 | Semiconductor device with improved wiring arrangement utilizing a projecting portion and a method of manufacturing the same In a method of manufacturing a semiconductor device having a first wiring extending in a first direction and a second wiring connected to the first wiring through a connection and extending in a second direction orthogonal to the first direction, the second wiring h... | 07/17/2007 |
| 7245016 | Circuit layout structure A circuit layout structure for a chip is provided. The chip has a bonding pad area, a nearby device area, and a substrate. The circuit layout structure essentially comprises a plurality of circuit layers, a plurality of dielectric layers and a plurality of vias. The... | 07/17/2007 |
| 7180168 | Stacked semiconductor chips A groove is formed on a semiconductor substrate having integrated circuits and electrodes from a first surface. An insulating layer is formed on an inner surface of the groove. A conductive layer is formed on the insulating layer above the inner surface of the groov... | 02/20/2007 |
| 6576848 | Integrated circuit chip wiring structure with crossover capability and method of manufacturing the same A wiring structure with crossover capability is disclosed. The wiring utilizes a connection stud in a contact layer, beneath the plane of the otherwise-intersecting lines as a crossover. Thus, a first wire in a first metallization layer passes below a sec... | 06/10/2003 |
| 6509623 | Microelectronic air-gap structures and methods of forming the same An improved microelectronic structure is disclosed. The improved structure includes an air-gap region formed by removing an insulating material through an aperture residing in a mask.... | 01/21/2003 |
| 6509590 | Aluminum-beryllium alloys for air bridges A typical air bridge is an aluminum conductor suspended across an air-filled cavity to connect two components of an integrated circuit, two transistors for example. The air-filled cavity has a low dielectric constant which reduces cross-talk between neigh... | 01/21/2003 |
| 6498396 | Semiconductor chip scale package and ball grid array structures An external interconnection unit including a pad provided on a semiconductor chip, a bump electrode formed on a main surface of a semiconductor chip for connection with the board, and a connection interconnection for connecting the pad and the bump electr... | 12/24/2002 |
| 6495399 | Method of vacuum packaging a semiconductor device assembly A semiconductor chip device package comprised of a semiconductor substrate having semiconductor devices formed on the semiconductor substrate. At least one dielectric layer is over the semiconductor substrate. At least one layer of interconnects is over t... | 12/17/2002 |
| 6492705 | Integrated circuit air bridge structures and methods of fabricating same Airbridge structures and processes for making air bridge structures and integrated circuits are disclosed. One airbridge structure has metal conductors 24 encased in a sheath of dielectric material 249. The conductors extend across a cavity 244 and a semi... | 12/10/2002 |
| 6472740 | Self-supporting air bridge interconnect structure for integrated circuits A method for forming a multilevel interconnect structure for an integrated circuit is disclosed. In an exemplary embodiment of the invention, the method includes forming a starting structure upon a substrate, the starting structure having a number of meta... | 10/29/2002 |
| 6469330 | Process for manufacturing integrated devices comprising microstructures and associated suspended electrical interconnections An integrated device comprises an epitaxial layer forming a first and a second region separated by at least one air gap. The first region forms, for example, a suspended mass of an accelerometer. A bridge element extends on the air gap and has a suspended... | 10/22/2002 |
| 6433431 | Coating of copper and silver air bridge structures An improved electrical interconnect for an integrated circuit and methods for providing the same are disclosed. The interconnect includes an air bridge extending through an air space so as to reduce the capacitance of the interconnect. The air bridge is s... | 08/13/2002 |
| 6211056 | Integrated circuit air bridge structures and methods of fabricating same Conductive elements which provide interconnections (air bridges between circuits) and components such as capacitors and inductors may be incorporated in the devices in a manner to reduce parasitic effects in the operation of the devices while providing cl... | 04/03/2001 |
| 6057573 | Design for high density memory with relaxed metal pitch A method and design for stitching polysilicon wordlines to straps formed of interconnected metal line segments formed in two or more metallization levels. Each strap comprises a continuous conductive metal line passing alternatively from one metal layer t... | 05/02/2000 |
| 6057224 | Methods for making semiconductor devices having air dielectric interconnect structures A method of making an integrated circuit interconnect structure having air as the effective dielectric between metallization layers includes the steps of: a) providing an air dielectric formation layer of a sacrificial material over a substrate; b) formin... | 05/02/2000 |
| 5994777 | Method and support structure for air bridge wiring of an integrated circuit A process of manufacturing integrated circuits is disclosed for designing and implementing a hierarchical wiring system. The interconnection requirements are sorted and designed into a particular wiring level according to length. Support structures may be... | 11/30/1999 |
| 5933725 | Word line resistance reduction method and design for high density memory with relaxed metal pitch A method and design for stitching polysilicon wordlines to straps formed of interconnected metal line segments formed in two or more metallization levels. Each strap comprises a continuous conductive metal line passing alternatively from one metal layer t... | 08/03/1999 |
| 5898223 | Chip-on-chip IC packages The specification describes interconnection layouts for chip-on-chip packages using solder bump interchip connections as vias between a single level metal interconnection pattern on the lower support IC chip and another single level interconnection patter... | 04/27/1999 |
| 5891797 | Method of forming a support structure for air bridge wiring of an integrated circuit A process of manufacturing integrated circuits is disclosed for designing and implementing a hierarchical wiring system. The interconnection requirements are sorted and designed into a particular wiring level according to length. Support structures may be... | 04/06/1999 |
| 5818110 | Integrated circuit chip wiring structure with crossover capability and method of manufacturing the same An integrated circuit chip wiring structure having crossover and contact capability without an interlock via layer and a method of making the wiring structure all disclosed. The method utilizes a multi-damascene approach, using the standard damascene proc... | 10/06/1998 |
| 5817446 | Method of forming airbridged metallization for integrated circuit fabrication A method for forming an airbridge for interconnecting metal contacts on an integrated circuit. The airbridge is formed by initially patterning a support photoresist between the metal contacts to be interconnected, over the metal contact to be crossed. The... | 10/06/1998 |
| 5798559 | Integrated circuit structure having an air dielectric and dielectric support pillars A method of making an integrated circuit interconnect structure having air as the effective dielectric between metallization layers includes the steps of: a) providing an air dielectric formation layer of a sacrificial material over a substrate; b) formin... | 08/25/1998 |
| 5757072 | Structure for protecting air bridges on semiconductor chips from damage A protective cap is deposited over the top and sides of an air bridge structure located on an integrated circuit chip. The protective cap provides mechanical strength during the application of a high density interconnect structure over the chips, to preve... | 05/26/1998 |
| 5719433 | Semiconductor component with integrated heat sink A semiconductor component that could be a power transistor type of component comprises mesa-structured elementary bipolar transistors. This component has a thick, metal heat sink of which a part (PI) takes the form of a bridge and a part is in contact wit... | 02/17/1998 |
| 5686743 | Method of forming airbridged metallization for integrated circuit fabrication A method for forming an airbridge for interconnecting metal contacts on an integrated circuit. The airbridge is formed by initially patterning a support photoresist between the metal contacts to be interconnected, over the metal contact to be crossed. The... | 11/11/1997 |
| 5670801 | Heterojunction bipolar transistor A method of fabricating a semiconductor device includes producing a collector layer, a base layer, and an emitter layer on a semiconductor substrate; producing a dummy emitter electrode on a region of the emitter layer; forming a first resist except where... | 09/23/1997 |
| 5652157 | Forming a gate electrode on a semiconductor substrate by using a T-shaped dummy gate A new design concept is presented and demonstrated for the fabrication of active and passive components in integrated circuit (IC) devices for microwave signal transmission. High circuit packing density is desirable but the current configurations of the c... | 07/29/1997 |
| 5639686 | Method of fabricating circuit elements on an insulating substrate A new design concept is presented and demonstrated for the fabrication of active and passive components in integrated circuit (IC) devices for microwave signal transmission. High circuit packing density is desirable but the current configurations of the c... | 06/17/1997 |
