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| Number | Title | Issue Date |
| 7436056 | Electronic component package An electronic component package includes a dielectric substrate having a first surface where an electronic component is sealed. A first signal line connecting to the electronic component and a first ground conductor are formed on the first surface of the dielectric ... | 10/14/2008 |
| 7417294 | Microelectronic imaging units and methods of manufacturing microelectronic imaging units Microelectronic imaging units and methods for manufacturing microelectronic imaging units are disclosed herein. In one embodiment, a method includes placing a plurality of singulated imaging dies on a support member. The individual imaging dies include an image sens... | 08/26/2008 |
| 7416913 | Methods of manufacturing microelectronic imaging units with discrete standoffs Microelectronic imaging units and methods for manufacturing microelectronic imaging units are disclosed herein. In one embodiment, a method includes placing a plurality of singulated imaging dies on a support member. The individual imaging dies include an image sens... | 08/26/2008 |
| 7417315 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging A Negative Thermal Expansion system (NTEs) device for TCE compensation or CTE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging. One aspect of the present invention provides a method for fabricating micromachine... | 08/26/2008 |
| 7402454 | Molded integrated circuit package with exposed active area An integrated circuit die having an active area that must remain exposed after packaging is secured by a compliant die attachment by which the integrated circuit die is held in position within a transfer mold during encapsulation. The compliant die attachment may co... | 07/22/2008 |
| 7388282 | Micro-electro-mechanical system (MEMS) package having hydrophobic layer A micro-electro-mechanical system (MEMS) package having a hydrophobic layer is disclosed. The MEMS package includes: a base substrate, with an MEMS element provided on a surface of the base substrate; a lid, spaced apart from the MEMS element provided on the base su... | 06/17/2008 |
| 7378301 | Method for molding a small form factor digital memory card A method for molding digital storage memory cards such as, for example, multimedia cards (MMC), secure digital cards (SD), and similar small form factor digital memory cards. A PCA subassembly including, for example, a leadframe (TSOP) package for enclosing a flash ... | 05/27/2008 |
| 7368816 | Micro-electro-mechanical system (MEMS) package having metal sealing member A micro-electro-mechanical system (MEMS) package having a metal sealing member is disclosed. The MEMS package is formed by forming a metal layer on a substrate by patterning so that the metal layer surrounds an MEMS element provided on the substrate; joining a lid t... | 05/06/2008 |
| 7344920 | Integrated circuit package and method for fabricating same A process for fabricating an integrated circuit package includes: selectively etching a first side of a substrate thereby providing etched regions of the substrate to partially define at least a plurality of contact pads; adding a dielectric material to the etched r... | 03/18/2008 |
| 7304362 | Molded integrated circuit package with exposed active area An integrated circuit die having an active area that must remain exposed after packaging is secured by a compliant die attachment by which the integrated circuit die is held in position within a transfer mold during encapsulation. The compliant die attachment may co... | 12/04/2007 |
| 7300823 | Apparatus for housing a micromechanical structure and method for producing the same Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure ... | 11/27/2007 |
| 7291513 | Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy A method is disclosed for making a wafer-level package for a plurality of MEMS devices. The method involves preparing a MEMS wafer and a lid wafer, each having respective bonding structures. The lid and MEMS wafers are then bonded together through the bonding struct... | 11/06/2007 |
| 7259449 | Method and system for sealing a substrate A method of sealing a microelectromechanical system (MEMS) device from ambient conditions is described, wherein the MEMS device is formed on a substrate and a substantially hermetic seal is formed as part of the MEMS device manufacturing process. The method comprise... | 08/21/2007 |
| 7250328 | Microelectronic component assemblies with recessed wire bonds and methods of making same The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, a subs... | 07/31/2007 |
| 7247521 | Semiconductor assembly encapsulation mold and method for forming same An encapsulation mold for forming an encapsulation layer over a semiconductor assembly is disclosed. A semiconductor assembly with multiple semiconductor dies secured to a single semiconductor support structure is inserted into an encapsulation mold. The mold contai... | 07/24/2007 |
| 7245009 | Hermetic cavity package A packaging structure (10) is provided having a hermetic sealed cavity for microelectronic applications. The packaging structure (10) comprises first and second packaging layers (12, 28) forming a cavity. Two liquid crystal polymer (LCP) layers ... | 07/17/2007 |
| 7217594 | Alternative flip chip in leaded molded package design and method for manufacture A semiconductor package is disclosed. The package includes a leadframe structure comprising a die attach region and plurality of leads. A molding material is molded around at least a portion of the leadframe structure, and comprises a window. A semiconductor die com... | 05/15/2007 |
| 7196410 | Wafer packaging and singulation method A multi-device lid for a micro device wafer has a plurality of micro devices. The multi-device lid includes a multi-lid substrate configured to cover the plurality of micro devices of the micro device wafer. The multi-lid substrate has a trench pattern with intersec... | 03/27/2007 |
| 7173331 | Hermetic sealing cap and method of manufacturing the same A hermetic sealing cap member capable of suppressing deterioration of characteristics of an electronic component resulting from a sealant such as solder coming into contact with the electronic component in a package is obtained. This hermetic sealing cap, which is a... | 02/06/2007 |
| 7151011 | Integrated circuit die having an interference shield A package for housing a device (e.g., an integrated circuit chip or die) includes a Faraday cage. The Faraday cage is at least partially formed in the integrated circuit die. The die includes conductive vias and solder balls surrounding a circuit. The package can be... | 12/19/2006 |
| 7102224 | Encapsulated component and method for the production thereof A component includes a chip having a first chip face and a second chip face, where the first chip face includes component structures and connector metallizations associated with the component structures. The component also includes a frame structure on the first chi... | 09/05/2006 |
| 6628043 | Electronic component and method of production thereof An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electricall... | 09/30/2003 |
| 6590293 | Electronic component, having projection electrodes and methods for manufacturing thereof An electronic component includes a projection electrode to be bonded to a circuit board. The projection electrode is prevented from being contaminated or oxidized during a period from manufacturing of the electronic component until mounting of the compone... | 07/08/2003 |
| 6583355 | Bladder insert for encapsulant displacement An encapsulated device and method for making such encapsulated device containing a bladder disposed between a wall of the case and the encapsulant. The bladder defines a space devoid of encapsulant and contains a collapsible insert such as an open cell fo... | 06/24/2003 |
| 6454160 | Method for hermetically encapsulating microsystems in situ The method for hermetically encapsulating microsystems in situ consists, in a first phase, of mounting on a common substrate (1), several microsystems (6) surrounded by a metal adhesion layer (4) deposited on the substrate (1). In a second phase, in a com... | 09/24/2002 |
| 6384332 | Bladder insert for encapsulant displacement An encapsulated device and method for making such encapsulated device containing a bladder disposed between a wall of the case and the encapsulant. The bladder defines a space devoid of encapsulant and contains a collapsible insert such as an open cell fo... | 05/07/2002 |
| 6303860 | Bladder insert for encapsulant displacement An encapsulated device containing a bladder disposed between a wall of the case and the encapsulant. The bladder defines a space devoid of encapsulant, thereby allowing the unimpeded thermal expansion of the encapsulant. By reducing thermal expansion stre... | 10/16/2001 |
| 6291263 | Method of fabricating an integrated circuit package having a core-hollowed encapsulation body An integrated circuit packaging method is provided for fabriacting an integrated circuit package of the type having a core-hollowed encapsulation body. The provided method includes the steps: preparing a leadframe including a die-bonding area and a wire-b... | 09/18/2001 |
| 6262513 | Electronic component and method of production thereof An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electricall... | 07/17/2001 |
| 6001673 | Methods for packaging integrated circuit devices including cavities adjacent active regions A method for packaging an integrated circuit device includes forming a dielectric support layer on the surface of a substrate wherein the dielectric support layer includes an opening therein exposing at least a portion of an active region of the substrate... | 12/14/1999 |
| 5973337 | Ball grid device with optically transmissive coating A semiconductor device (10) coupled to ball grid array substrate (11) and encapsulated by an optically transmissive material (29, 31). The ball grid array substrate (11) has conductive interconnects (14) and a semiconductor receiving area (17) on a top su... | 10/26/1999 |
| 5946556 | Fabrication method of plastic-packaged semiconductor device A fabrication method of a plastic-packaged semiconductor device is provided, which prevents the high-frequency characteristics of a semiconductor element chip from degrading without complicating a package configuration. In the first step, a wax with a pro... | 08/31/1999 |
| 5905301 | Mold package for sealing a chip A package of the present invention comprises a base molded integrally with a lead frame by resin, a chip mounted on the lead frame, and a cap made of resin, which covers the chip and is fixed to the base. The base includes a substrate portion sealing the ... | 05/18/1999 |
| 5804884 | Surface electrical field delimiting structure for an integrated circuit The resin sealing layer enclosing the device is biased to a low voltage by means of an anchoring structure formed close to high-voltage contact pads. The anchoring structure is formed by a metal region deposited on the surface of the device and contacting... | 09/08/1998 |
| 5744858 | Semiconductor packaging technique yielding increased inner lead count for a given die-receiving area A greater lead count for a given die area can be achieved with "certain non-square" geometries formed by the inner ends of conductive lines. These include various triangular configurations, as well as "greatly elongated" rectangular, parallelogram and tra... | 04/28/1998 |
| 5744856 | Non-square die for integrated circuits and systems containing the same Electronic systems using certain non-square dies, such as triangular dies, greatly elongated rectangular dies, parallelogram dies, trapezoidal, and the like, are able to be laid out in the area of a circular semiconductor wafer more "efficiently" than squ... | 04/28/1998 |
| 5663872 | Encapsulation of electronic components For physical protection and to reduce stress, an electronic device (10) is mounted within a cavity in a housing (14) which constitutes an encapsulating member. The housing is preferably formed as two premoulded piece parts (14a, 14b). A leadframe (12) ext... | 09/02/1997 |
| 5650659 | Semiconductor component package assembly including an integral RF/EMI shield A semiconductor component package assembly including an integral radio frequency and electromagnetic interference shield is disclosed herein. The assembly includes a support member which supports an IC chip and defines an array of conductive leads. An ele... | 07/22/1997 |
| 5635424 | High-density bond pad layout arrangements for semiconductor dies, and connecting to the bond pads Composite bond pad structure and geometry increases bond pad density and reduces lift-off problems. Bond pad density is increased by laying out certain non-square bond pads which are shaped, sized and oriented such that each bond pad closely conforms to t... | 06/03/1997 |
| 5608267 | Molded plastic semiconductor package including heat spreader There is provided a molded plastic electronic package having improved thermal dissipation. A thermal dissipator, such as a heat spreader or a heat slug is partially encapsulated in the molding resin. The thermal dissipator has a density less than that of ... | 03/04/1997 |
