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| Number | Title | Issue Date |
| 7239016 | Semiconductor device having heat radiation plate and bonding member A semiconductor device includes a heat generation element; a bonding member; first and second heat radiation plates disposed on first and second sides of the heat generation element through the bonding member; a heat radiation block disposed between the first heat r... | 07/03/2007 |
| 6690583 | Carrier for electronic components A carrier intended for one or several electronic components and having spaces provided for the components on at least one surface is provided. The carrier has an at least partly conductive Low Temperature Cofire Ceramic (LTCC) material with good thermal c... | 02/10/2004 |
| 6597070 | Semiconductor device and method of manufacturing the same A semiconductor device includes a passivation film (19) having opening portions through which an electrode pads (18) formed on a semiconductor chip (21) are exposed, projecting electrode portions (20) whose one end faces are connected to the electrode pad... | 07/22/2003 |
| 6558821 | Ceramic sinter, and wear resistant member and electronic component member using thereof In ceramic sinter consisting of at least one kind selected from a group consisting of silicon nitride, zirconia, silicon carbide, cermet, SIALON, aluminum nitride and alumina, wear resistant member and electronic component member using thereof, skewness a... | 05/06/2003 |
| 6511866 | Use of diverse materials in air-cavity packaging of electronic devices Semiconductor circuit devices (dies) are incorporated into moisture-impenetrable electronic packages by forming enclosures around the die in three separate parts--base, sidewalls, and lid. The die is first soldered or otherwise bonded to the base, followe... | 01/28/2003 |
| 6414847 | Integral dielectric heatspreader Integral dielectric heatspreader for transferring heat from semiconductor devices. A semiconductor device is mounted to a thermally conductive electrically insulating substrate, which forms the integral dielectric heatspreader. The heatspreader is then mo... | 07/02/2002 |
| 6384342 | Heat-resistant electronic systems and circuit boards with heat resistant reinforcement dispersed in liquid metal A heat resistant system have electronic circuit components fusion bonded onto a circuit board substrate with a heat-resistant composite material. The composite material consists essentially of a solid heat-resistant reinforcement dispersed in a liquid met... | 05/07/2002 |
| 6292367 | Thermally efficient semiconductor chip A heat sink assembly and process for fabricating the assembly in which a semiconductor chip is formed with at least one high conductivity layer on its back side and some of the integrated circuits are high power circuits and, during operation, generate "h... | 09/18/2001 |
| 6286206 | Heat-resistant electronic systems and circuit boards Methods of making improved electronic systems and circuits boards, and more specifically to methods of making improved electronic systems and circuits boards using heat-resistant composite materials having superior mechanical, thermal, and electrical prop... | 09/11/2001 |
| 5937514 | Method of making a heat-resistant system Methods of making improved electronic systems and circuits boards, and more specifically to methods of making improved electronic systems and circuits boards using heat-resistant composite materials.... | 08/17/1999 |
| 5932348 | Composite with non-segregating reinforcing elements A method of making an improved composite containing substantially non-segregating solid reinforcing elements therein is disclosed. New composites and non-segregating solid reinforcing elements for these composites are also disclosed.... | 08/03/1999 |
| 5869890 | Insulation substrate for a semiconductor device A Ceramic Bonding Copper (CBC) substrate used in semiconductor modules includes a ceramic plate having foil-shaped copper plates bonded to the ceramic plate by the direct copper bonding method. A circuit pattern is formed on one of the copper plates. The ... | 02/09/1999 |
| 5821612 | Heat radiative electronic component An electronic component provided with a heat radiative ceramic plate that is protected from cracks. Such a heat radiative electronic component is composed of an electronic device, such as a semiconductor device with an integrated circuit built therein, ha... | 10/13/1998 |
| 5821617 | Surface mount package with low coefficient of thermal expansion A surface mount package for use with large area silicon device. The package uses a pressed ceramic frame and solid metal pads which are closely matched for coefficient of thermal expansion (CTE) to each other and to the silicon die. The package is specifi... | 10/13/1998 |
| 5786097 | Assembly substrate and method of making An assembly substrate includes a substrate (11, 31, 41), a composite layer (12, 32, 42) overlying the substrate (11, 31, 41), and an electrically conductive layer (13, 33, 43) overlying the composite layer (12, 32, 42). The composite layer (12, 32, 42) in... | 07/28/1998 |
| 5767028 | Aluminum nitride sintered body and method for manufacturing the same The aluminum nitride sintered body according to the present invention comprises 1-10 % by weight of at least one element selected from a group consisting of a group IIIa element listed in periodic table, Ca, Sr and Ba in terms of the amount of an oxide th... | 06/16/1998 |
| 5763093 | Aluminum nitride body having graded metallurgy Disclosed is an aluminum nitride body having graded metallurgy and a method for making such a body. The aluminum nitride body has at least one via and includes a first layer in direct contact with the aluminum nitride body and a second layer in direct con... | 06/09/1998 |
| 5751552 | Semiconductor device balancing thermal expansion coefficient mismatch A hybrid multi-chip module includes semiconductor chips (27, 31) bonded to a base plate (24). The base plate includes a substrate (11) having two surfaces (12, 13) and a conductive material (16) molded on the two surfaces (12, 13). A coefficient of therma... | 05/12/1998 |
| 5744411 | Aluminum nitride sintered body with high thermal conductivity and its preparation An aluminum nitride sintered product with a high thermal conductivity (at least 100 W/m.K) can be prepared at a sintering temperature of less than 1850° C. (often less than 1650° C.) using a sinterable combination of aluminum nitride powder with at leas... | 04/28/1998 |
| 5736787 | Transistor package structured to provide heat dissipation enabling use of silicon carbide transistors and other high power semiconductor devices A package for relatively high power transistors including heat conducting mounting flange having a relatively large "footprint" relative to the area covered by at least one active chip supported thereby and comprised of a plurality of bipolar silicon-carb... | 04/07/1998 |
| 5714246 | Conductive silver low temperature cofired metallic green tape The present invention provides a thermally conductive material which can be used as a heat sink in a multi-chip module or multilayer circuit structure. The material is formed by firing a composition including a solids portion comprising from about 1% to a... | 02/03/1998 |
| 5703397 | Semiconductor package having an aluminum nitride substrate A semiconductor ceramic multilayer package comprising an aluminum nitride substrate having a semiconductor element mounted on one surface thereof and a wiring pattern electrically connected to the semiconductor element, connecting terminals connected to t... | 12/30/1997 |
| 5698896 | High thermal conductive silicon nitride structural member, semiconductor package, heater and thermal head A high thermal conductive silicon nitride structural member of the present invention contains a rare earth element in the range of 1.0 to 7.5 wt. % calculated as oxide thereof and Li, Na, K, Fe, Ca, Mg, Sr, Ba, Mn and B as impurity cationic elements in a ... | 12/16/1997 |
| 5682589 | Aluminum nitride body having graded metallurgy Disclosed is an aluminum nitride body having graded metallurgy and a method for making such a body. The aluminum nitride body has at least one via and includes a first layer in direct contact with the aluminum nitride body and a second layer in direct con... | 10/28/1997 |
| 5649593 | Radiator member A radiator member for efficiently releasing heat to the surrounding area. Cordierite powder and copper powder are mixed in a base material of dimethyl silicone. Near one surface of the radiator member the mixture ratio of copper powder is increased, while... | 07/22/1997 |
| 5639562 | Co-sintered surface metallization for pin-join, wire-bond and chip attach A co-sintered ceramic substrate structure is formed through punching and screening of a plurality of ceramic green sheets with a plurality of composite metal pastes and/or inks and laminating the structure. The co-sintered surface metallization comprises ... | 06/17/1997 |
| 5552107 | Aluminum nitride body having graded metallurgy Disclosed is an aluminum nitride body having graded metallurgy and a method for making such a body. The aluminum nitride body has at least one via and includes a first layer in direct contact with the aluminum nitride body and a second layer in direct con... | 09/03/1996 |
| 5552232 | Aluminum nitride body having graded metallurgy Disclosed is an aluminum nitride body having graded metallurgy and a method for making such a body. The aluminum nitride body has at least one via and includes a first layer in direct contact with the aluminum nitride body and a second layer in direct con... | 09/03/1996 |
| 5508559 | Power circuit package A method for forming a power circuit package (45) having a porous base structure (20) electrically isolated from a first porous die mount (21) and a second porous die mount (22) by a dielectric material (29). The porous base structure (20) is bonded to a ... | 04/16/1996 |
| 5422788 | Technique for enhancing adhesion capability of heat spreaders in molded packages Adhesion between a heat spreader (15) and a substance (19) to be adhered to the heat spreader can be enhanced by using thermal spray deposition to apply a coating (23) to the heat spreader. The substance to be adhered is applied to the coated heat spreade... | 06/06/1995 |
| 5411924 | Ceramic body The invention provides a ceramic body and a method of manufacturing such a body. The body is characterized by its composition, which comprises 20-30 at. % of magnesium, 20-30 at. % of silicon, 40-60 at. % of nitrogen and maximally 15 at. % of oxygen. A pr... | 05/02/1995 |
| 5412160 | Circuit board A circuit board comprising a substrate, at least one dielectric film formed on the substrate and made of at least one selected from the group consisting of AlN, BN, diamond, diamond-like carbon, BeO and SiC, the dielectric film having pores of a porosity ... | 05/02/1995 |
| 5371043 | Method for forming a power circuit package A method for forming a power circuit package (45) having a porous base structure (20) electrically isolated from a first porous die mount (21) and a second porous die mount (22) by a dielectric material (29). The porous base structure (20) is bonded to a ... | 12/06/1994 |
| 5362551 | Ceramic substrate A ceramic substrate is described consisting essentially of a crystallized glass and having at least one throught-hole filled with a conductor material having 100 parts by weight of copper and form 1 to 30 parts by weight of a glass having a softening poin... | 11/08/1994 |
| 5362680 | Technique for enhancing adhesion capability of heat spreaders in molded packages Adhesion between a heat spreader (15) and a substance (19) to be adhered to the heat spreader can be enhanced by using thermal spray deposition to apply a coating (23) to the heat spreader. The substance to be adhered is applied to the coated heat spreade... | 11/08/1994 |
| 5355942 | Cooling multi-chip modules using embedded heat pipes A method and apparatus is disclosed for cooling a multi-chip module using embedded heat pipes. Semiconductor chips are disposed into the multi-chip module through cavities in the module substrate. The semiconductor chips engage heat pipes embedded within ... | 10/18/1994 |
| 5352482 | Process for making a high heat-conductive, thick film multi-layered circuit board A high heat-conductive, thick film multilayered circuit board for high speed signal transmission in a high frequency region has a substrate having high heat conductivity. An oxidized layer is formed on a surface of the substrate. Electrically conductive l... | 10/04/1994 |
| 5332629 | Boron nitride system including an hBN starting material with a catalyst and a sintered cNB body having a high heat conductivity based on the catalyst A boron nitride system starts with an hBN material and yields a directly converted sintered cBN body having a high heat conductivity within the range of at least 4 W/cm.°C. to about 6.2 W/cm.°C. For this purpose the hBN starting material of the system h... | 07/26/1994 |
| 5304846 | Narrow channel finned heat sinking for cooling high power electronic components Dissipation of the heat produced by the operation of electronic circuitry may be improved by a heat sink which comprises a flat base from which a number of vertical fins extend. The fins are parallel to one another and define a number of parallel channels... | 04/19/1994 |
| 5294750 | Ceramic packages and ceramic wiring board A ceramic package for containing a semiconductor chip including a heat radiating plate, a base plate for wiring, and a ceramic package for containing a semiconductor chip. The package contains a ceramic board, a ceramic cap and a metal lead frame. The hea... | 03/15/1994 |
