Celebrity Inventors
Mark Twain (Samuel L. Clemens) received Patent No. 121,992 for "An Improvement in Adjustable and Detachable Straps for Garments." He later received two more patents: one for a self-pasting scrapbook and one for a game to help players remember important historical dates.
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| Number | Title | Issue Date |
| 7411275 | Semiconductor device comprising an inorganic insulating film and method of manufacturing the same It is an object to provide an insulating film having a very low dielectric constant and a great mechanical strength. Moreover, it is another object to provide a semiconductor device capable of reducing both a capacity between wiring layers and a capacity between wir... | 08/12/2008 |
| 7399919 | Flexible heat sink Provided is a flexible heat sink article comprising a base comprising a polymer and a plurality of polymeric protrusions extending away from the base, each protrusion having a major dimension and a minor dimension. The base comprises thermally conductive particles, ... | 07/15/2008 |
| 7393771 | Method for mounting an electronic part on a substrate using a liquid containing metal particles An electronic part mounting method, a semiconductor module, and a semiconductor device, which can reduce a mounting area and a device thickness. In an electronic part mounting method for bonding an electrode formed on a substrate and an electrode formed on an electr... | 07/01/2008 |
| 7315068 | Interface layer for the fabrication of electronic devices The present invention is directed to methods for making electronic devices with a thin anisotropic conducting layer interface layer formed between a substrate and an active device layer that is preferably patterned conductive layer. The interface layer preferably pr... | 01/01/2008 |
| 7282798 | Spontaneous emission enhanced heat transport method and structures for cooling, sensing, and power generation A method and structure for heat transport, cooling, sensing and power generation is described. A photonic bandgap structure (3) is employed to enhance emissive heat transport from heat sources such as integrated circuits (2) to heat spreaders (4... | 10/16/2007 |
| 6835889 | Passive element component and substrate with built-in passive element The present invention provides a composite material such as a passive element, a passive element composite component, a substrate with a built-in passive element and a composite wiring substrate which are free from, for example, a layer peeling problem and enables h... | 12/28/2004 |
| 6703128 | Thermally-capacitive phase change encapsulant for electronic devices An encapsulation material suitable for dissipating heat generated by an electronic module, such as by directly contacting a heat-generating power device or contacting a heat sink of a heat-generating power device. The encapsulation material comprises phas... | 03/09/2004 |
| 6693353 | Semiconductor package and method for producing heat-radiating substrate for it A package to be mounted with semiconductor chips has a heat-radiating substrate having a thickness of smaller than 0.4 mm of a Cu--Mo composite as prepared by impregnating from 30 to 40% by mass of copper (Cu) melt into a green compact of molybdenum. The ... | 02/17/2004 |
| 6689471 | Thermal management device and method of making such a device A thermal management device includes anisotropic carbon encapsulated in an encapsulating material that is applied directly to the anisotropic carbon, wherein the anisotropic carbon includes graphite. An electrical system includes the thermal management de... | 02/10/2004 |
| 6676796 | Transferrable compliant fibrous thermal interface Described is a transferrable fibrous thermal interface. The interface comprises flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive. An encapsulant fil... | 01/13/2004 |
| 6668912 | Heat exchanger cast in metal matrix composite and method of making the same The specification and drawings describe and show an embodiment of and method of forming a liquid flow through heat exchanger structure cast in a metal matrix composite. The composite comprises a preform reinforcement material infiltrated with molten metal... | 12/30/2003 |
| 6660203 | Formed sheet of thermalconductive silicone gel and method for producing the same A formed sheet of thermalconductive silicone gel is provided. The formed sheet has (i) a thin film reinforcement layer hardened into rubber only in a surface layer on the upper side, the lower side, or both sides, (ii) a sheet-shaped reinforcement materia... | 12/09/2003 |
| 6649265 | Carbon-based metal composite material, method for preparation thereof and use thereof According to the present invention, there is provided a carbon-based metal composite material comprising a carbonaceous matrix and a metal component dispersed in said carbonaceous matrix, wherein at least 90 volume percent of the pores of the carbonaceous... | 11/18/2003 |
| 6618941 | Method of forming freestanding metal dendrites A technique for making acicular, branched, conductive dendrites, and a technique for using the dendrites to form a conductive compressible pad-on-pad connector are provided. To form the dendrites, a substrate is provided on which dendrites are grown, pref... | 09/16/2003 |
| 6621702 | Method and apparatus for absorbing thermal energy An apparatus for absorbing thermal energy has an electronic component, a support structure for the electronic component having a first set of surfaces defining an interior volume containing a plurality of secondary surfaces, and a thermal energy absorbing... | 09/16/2003 |
| 6617199 | Electronic device having fibrous interface Described is an electronic device having a compliant fibrous interface. The interface comprises a free fiber tip structure having flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers... | 09/09/2003 |
| 6597574 | Radiator plate and process for manufacturing the same A radiator plate includes a metallic matrix and a dispersant. The metallic matrix exhibits a predetermined coefficient of thermal expansion. The dispersant is dispersed in the metallic matrix, and exhibits a coefficient of thermal expansion being smaller ... | 07/22/2003 |
| 6596139 | Discontinuous high-modulus fiber metal matrix composite for physical vapor deposition target backing plates and other thermal management applications The invention includes the use of a high-modulus fiber metal matrix composite material as a backing plate for physical vapor deposition targets, as a lid for microelectronics packages, as a heat spreader, and as a heat sink. In one implementation, copper-... | 07/22/2003 |
| 6569524 | High thermal conductivity composite material, and method for producing the same The present invention provides a composite material having comparatively high thermal conductivity and a small coefficient of thermal expansion, which is low cost and preferable as a heatsink material. A graphite powder and an alloy powder, whose main con... | 05/27/2003 |
| 6542371 | High thermal conductivity heat transfer pad A thermal pad for use in facilitating heat flow between a heat source surface and a heat sink surface includes a carbon fiber fabric that is impregnated with a thermal substance.... | 04/01/2003 |
| 6514616 | Thermal management device and method of making such a device A thermal management device includes an isotropic carbon encapsulated in an encapsulating material that improves the strength of the carbon. The encapsulating material may be e.g. polyimide, epoxy resin, acrylic, polyurethane, polyester, or any other suit... | 02/04/2003 |
| 6508595 | Assembly of opto-electronic module with improved heat sink A heat sink for a transceiver optoelectronic module including dual direct heat paths and structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical ... | 01/21/2003 |
| 6507105 | Member for semiconductor device and method for producing the same A member for semiconductor devices comprising a composite alloy of aluminum or an aluminum alloy and silicon carbide, wherein silicon carbide grains are dispersed in aluminum or the aluminum alloy in an amount of from 10 to 70% by weight, the amount of ni... | 01/14/2003 |
| 6503626 | Graphite-based heat sink The present invention relates to a system for managing the heat from a heat source like an electronic component. More particularly, the present invention relates to a system effective for dissipating the heat generated by an electronic component using a h... | 01/07/2003 |
| 6486542 | Semiconductor-supporting devices, processes for the production of the same, joined bodies and processes for the production of the same A semiconductor-supporting device comprising a substrate made of an insulating material, a conductive member buried in the substrate, and a terminal connected to the conductive member and made of an electrically conductive metallic matrix-ceramic composit... | 11/26/2002 |
| 6482520 | Thermal management system The present invention relates to a system for managing the heat from a heat source like an electronic component. More particularly, the present invention relates to a system effective for dissipating the heat generated by an electronic component using a t... | 11/19/2002 |
| 6479095 | Composite material for heat sinks for semiconductor devices and method for producing the same A high-pressure vessel is allowed to be in an initial state, and a first chamber is disposed downward. Copper or copper alloy is placed in the first chamber, and SiC is set in a second chamber. The high-pressure vessel is tightly sealed, and then the insi... | 11/12/2002 |
| 6475429 | Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same A heat sink substrate comprises a Cu--Mo composite substrate composed of a molybdenum (Mo) green compact with which Copper (Cu) of 20-60 wt % is impregnated. It is preferable that the heat sink substrate is a rolled plate obtained by repeatedly warm rolli... | 11/05/2002 |
| 6475327 | Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrier A stiff heat spreader element for making a cavity down plastic chip carrier having benefits of excellent heat dissipation property, low weight, small thickness, low warpage and low twist is disclosed. The stiff heat spreader element is formed by bonding a... | 11/05/2002 |
| 6473303 | Cooling device for a high-power semiconductor module A cooling device for a high-power semiconductor module has a cooler lower part (1) and a cooler upper part (2), with the cooler upper part (2) being connected to the cooler lower part (1) by an integral material connection. The cooler upper part (2) has a... | 10/29/2002 |
| 6469381 | Carbon-carbon and/or metal-carbon fiber composite heat spreader A heat spreader, comprised of a plurality of carbon fibers oriented in a plurality of directions, with a carbon or metal matrix material dispersed about the fibers, is described. The carbon fibers facilitate the spreading of heat away from the smaller sem... | 10/22/2002 |
| 6460598 | Heat exchanger cast in metal matrix composite and method of making the same The specification and drawings describe and show an embodiment of and method of forming a liquid flow through heat exchanger structure cast in a metal matrix composite. The composite comprises a preform reinforcement material infiltrated with molten metal... | 10/08/2002 |
| 6462410 | Integrated circuit component temperature gradient reducer An integrated circuit device including an integrated circuit die having at least a first and a second heat-generating components formed thereon, and a heat dissipation structure thermally coupled to the die to dissipate heat generated by the components. T... | 10/08/2002 |
| 6451418 | Heat conductive resin substrate and semiconductor package This invention relates to a heat conductive resin substrate which polybenzasol fibers are oriented in a thick direction and/or a direction of a surface of a resin substrate, further to the heat conductive resin substrate and a semiconductor package excell... | 09/17/2002 |
| 6447894 | Silicon carbide composite, method for producing it and heat dissipation device employing it A silicon carbide composite which is a flat composite comprising a porous preform of silicon carbide and a metal containing aluminum as the main component, infiltrated into the porous preform, said composite having a warpage of at most 250 μm per 10 cm o... | 09/10/2002 |
| 6436506 | Transferrable compliant fibrous thermal interface Described is a transferrable fibrous thermal interface. The interface comprises flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive. An encapsulant fil... | 08/20/2002 |
| 6424529 | High performance heat exchange assembly Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate, at least three fins and at least one porous reticulated foam block that fills the space between the fins.... | 07/23/2002 |
| 6424531 | High performance heat sink for electronics cooling Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate, at least three fins arranged radially around the spreader plate and an array of porous reticulated foam blocks tha... | 07/23/2002 |
| 6406790 | Composite material and manufacturing method therefor A composite material incorporating vapor-phase-epitaxial carbon fibers and metal.... | 06/18/2002 |
| 6404070 | Semiconductor device A semiconductor device having a heat dissipation plate which is lighter in weight and smaller in thickness than the conventional metal plate while ensuring a good thermal dissipation and mechanical support, which comprises: a semiconductor chip having a b... | 06/11/2002 |
