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| Number | Title | Issue Date |
| 7432132 | Integrated diamond carrier method for laser bar arrays A method of making efficient Integrated Diamond Carrier heat sink and mounting structures usable typically to mount the solid-state laser bars often employed for pumping high power lasers, for example. The disclosed method forms the Integrated Diamond Carrier on a s... | 10/07/2008 |
| 7432532 | Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die. ... | 10/07/2008 |
| 7427807 | Chip heat dissipation structure and manufacturing method This invention discloses a manufacturing method and a structure for a chip heat dissipation. This heat dissipation structure includes a bottom plate of circuit structure, a die of central processing unit and a cap. The cover is often used in conducting the waste hea... | 09/23/2008 |
| 7391061 | Light emitting diode with thermal spreading layer A light emitting diode and the method of the same are provided. The light emitting diode includes a substrate, a thermal spreading layer, a connecting layer and an epitaxial structure. The substrate is selected from a transparent substrate or a non-transparent subst... | 06/24/2008 |
| 7384821 | Diamond composite heat spreader having thermal conductivity gradients and associated methods A diamond composite heat spreader having a variable thermal conductivity gradient can improve control of heat transfer based on a specific application. A diamond-containing region of the heat spreader can contain diamond particles such that the diamond concentration... | 06/10/2008 |
| 7268011 | Diamond composite heat spreader and associated methods Diamond heat spreaders are produced having thermal properties approaching that of pure diamond. Diamond particles of relatively large grain size are tightly packed to maximize diamond-to-diamond contact. Subsequently, smaller diamond particles may be introduced into... | 09/11/2007 |
| 7193318 | Multiple power density chip structure A multiple power density packaging structure with two or more semiconductor chips on a common wiring substrate having a common thermal spreader with a planar surface in thermal contact with the non-active surfaces of the chips. The semiconductor chips have different... | 03/20/2007 |
| 7173334 | Diamond composite heat spreader and associated methods Diamond heat spreaders are produced having thermal properties approaching that of pure diamond. Diamond particles of relatively large grain size are tightly packed to maximize diamond-to-diamond contact. Subsequently, smaller diamond particles may be introduced into... | 02/06/2007 |
| 7026191 | Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same A stereolithographically fabricated heat sink includes a heat transfer element cofigured to be disposed proximate a semiconductor device so as to absorb heat from the semiconductor device during use thereof. The heat sink also has a heat dissipation element that is ... | 04/11/2006 |
| 6689471 | Thermal management device and method of making such a device A thermal management device includes anisotropic carbon encapsulated in an encapsulating material that is applied directly to the anisotropic carbon, wherein the anisotropic carbon includes graphite. An electrical system includes the thermal management de... | 02/10/2004 |
| 6653730 | Electronic assembly with high capacity thermal interface To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to an integrated heat spreader (IH... | 11/25/2003 |
| 6649937 | Semiconductor device with components embedded in backside diamond layer A semiconductor substrate with integrated circuit devices on its front side and a high thermal conductivity layer such as diamond on its back side, with components such as capacitors embedded in the high thermal conductivity layer and coupled to the front... | 11/18/2003 |
| 6641861 | Heatsink and fabrication method thereof A method of fabricating a heatsink including a substrate of a sintered compact containing Cu and W, and a thin diamond film layer formed on the surface of the substrate with good adherence, involves immersing the substrate in acid to reduce the Cu content... | 11/04/2003 |
| 6579743 | Chip packaging system and method using deposited diamond film A chip packaging system and method for providing enhanced thermal cooling including a first embodiment wherein a diamond thin film is used to replace at least the surface layer of the existing packaging material in order to form a highly heat conductive p... | 06/17/2003 |
| 6573565 | Method and structure for providing improved thermal conduction for silicon semiconductor devices Thermal cooling structures of diamond or diamond-like materials are provided for conducting heat away from semiconductor devices. A first silicon-on-insulator embodiment comprises a plurality of thermal paths, formed after shallow trench and device fabric... | 06/03/2003 |
| 6563212 | Semiconductor device A semiconductor device in which a semiconductor chip 1 is bonded by a metal bond 2 to one surface of a heat sink 4 formed of a material with a thermal expansion coefficient is close to he semiconductor chip 1, the heat sink 4 is glued to a stiffener with ... | 05/13/2003 |
| 6559534 | Thermal capacity for electronic component operating in long pulses A thermal capacitor component which includes, on a substrate, a stack of different layers defined in the form of a mesa terminating at its upper part in an electrical contact layer, which layer is coated with an electrically and thermally conducting layer... | 05/06/2003 |
| 6541303 | Method for conducting heat in a flip-chip assembly A method and apparatus for thermally conducting heat from a semiconductor device, namely, a flip-chip assembly. In one embodiment, a heat sink, such as a diamond layer having openings therein is provided over a surface of a semiconductor device. Conductiv... | 04/01/2003 |
| 6536509 | Diamond body The invention concerns a diamond body designed to enable thermal contacting with at least one source of heat (30) and presenting at least one recess (13, 15) defining an angular position in relation to the mechanical tensions generated by said or any sour... | 03/25/2003 |
| 6534792 | Microelectronic device structure with metallic interlayer between substrate and die A microelectronic device structure includes a diamond-containing substrate, and a metallic interlayer affixed to the diamond. The interlayer is made of a metal such as copper, silver, or gold, has a thickness of from about 0.003 inch to about 0.009 inch, ... | 03/18/2003 |
| 6531226 | Brazeable metallizations for diamond components A multilayer brazeable metallization structure for diamond components is described. The brazeable metallization finds particular application for the attachment of diamond components such as heat spreaders in electronic packages that incorporate high power... | 03/11/2003 |
| 6514616 | Thermal management device and method of making such a device A thermal management device includes an isotropic carbon encapsulated in an encapsulating material that improves the strength of the carbon. The encapsulating material may be e.g. polyimide, epoxy resin, acrylic, polyurethane, polyester, or any other suit... | 02/04/2003 |
| 6498394 | IC packages with diamond substrate thermal conductor A method for manufacturing a plastic encapsulated integrated circuit (IC) package has steps for placing a diamond substrate in a lower cavity of an encapsulation mold such that the diamond substrate in the finished package underlies the die attach pad and... | 12/24/2002 |
| 6489634 | Microelectronic device structure utilizing a diamond inlay in a package flange A microelectronic device structure includes a package flange with a body having a body upper surface, a substantially circular body interior sidewall defining an opening in the body upper surface, and a substantially circular inlay made of CVD diamond. Th... | 12/03/2002 |
| 6483040 | Package and method of manufacturing the same The present invention provides a package whose heat dissipation performance by a semiconductor device has been improved, which synchronizes with the rapid development of high transmission density in multiplex communications. In place of the conventional p... | 11/19/2002 |
| 6466446 | Integrated circuit package with diamond heat sink An IC package includes a high thermal conductivity insulating material substrate, such as polycrystalline diamond, on which the IC is mounted for thermal management. The electrical lead pins of the package are electrically connected to the IC and thermall... | 10/15/2002 |
| 6461889 | Method of fabricating semiconductor device with diamond substrate A method of fabricating a semiconductor device that makes it possible to decrease the thermal resistance of the semiconductor device is provided. First, a semiconductor base layer is formed over a main surface of a semiconductor substrate. Then, the semic... | 10/08/2002 |
| 6423982 | Diamond interconnection substrate and a manufacturing method therefor An electrical connection board includes a diamond substrate and an implantation metal layer constituted by the presence of metal elements in the diamond substrate. The metal layer has a thickness of at least 10 nm and a concentration of at least 1020... | 07/23/2002 |
| 6414847 | Integral dielectric heatspreader Integral dielectric heatspreader for transferring heat from semiconductor devices. A semiconductor device is mounted to a thermally conductive electrically insulating substrate, which forms the integral dielectric heatspreader. The heatspreader is then mo... | 07/02/2002 |
| 6404049 | Semiconductor device, manufacturing method thereof and mounting board A semiconductor device in which a semiconductor chip 1 is bonded by a metal bond 2 to one surface of a heat sink 4 formed of a material with a thermal expansion coefficient is close to the semiconductor chip 1, the heat sink 4 is glued to a stiffener with... | 06/11/2002 |
| 6390181 | Densely finned tungsten carbide and polycrystalline diamond cooling module An actively cooled, heat-dissipating module is presented for dissipating thermal energy from a heat producing integrated circuit device. The heat-dissipating module features a tungsten carbide body having high-density fins and a base with an interfacial s... | 05/21/2002 |
| 6361857 | Heatsink and fabrication method thereof A thin diamond film layer is formed on a substrate with good adherence. A heatsink includes a substrate of a sintered compact including Cu and W, and a thin diamond film layer formed on the surface of the substrate. The Cu content in the substrate is at l... | 03/26/2002 |
| 6337513 | Chip packaging system and method using deposited diamond film A chip packaging system and method for providing enhanced thermal cooling including a first embodiment wherein a diamond thin film is used to replace at least the surface layer of the existing packaging material in order to form a highly heat conductive p... | 01/08/2002 |
| 6335863 | Package for semiconductors, and semiconductor module that employs the package A low-cost package for semiconductors that is superior in heat dissipation and capable of preventing the cracking of semiconductor elements at the time of mounting, and a semiconductor module employing the package. The package for semiconductors comprises... | 01/01/2002 |
| 6324060 | Heat transfer interface A heat transfer interface is disclosed. The surface of the heat dissipating panel of a radiator formed by a heat dissipating substrate is machined, and then a second heat transfer layer is added thereon. The heat transfer layer is connected to the heat di... | 11/27/2001 |
| 6316826 | Semiconductor mounting package A semiconductor mounting package includes at least one diamond member having a first surface on which at least one semiconductor chip is mounted and a second surface opposite the first surface, and a high thermal conductivity metal member adhered to the s... | 11/13/2001 |
| 6292367 | Thermally efficient semiconductor chip A heat sink assembly and process for fabricating the assembly in which a semiconductor chip is formed with at least one high conductivity layer on its back side and some of the integrated circuits are high power circuits and, during operation, generate "h... | 09/18/2001 |
| 6281574 | High power microwave transistor amplifier A method for operating a microwave amplifier wherein a packaging arrangement is provided. The packaging arrangement includes: (i) a mounting thermally conducting mounting flange; (ii) an isomorphic, thermally conductive material disposed on the flange; (i... | 08/28/2001 |
| 6270848 | Heat sink material for use with semiconductor component and method for fabricating the same, and semiconductor package using the same A heat sink material for use with a semiconductor component having a coefficient of thermal expansion near to that of a semiconductor material and a high thermal conductivity, comprising a plurality of diamond particles, a metal, and a metal carbide, wher... | 08/07/2001 |
| 6251706 | Method for cooling the backside of a semiconductor device using an infrared transparent heat slug An apparatus and method that permits the removal of heat from the back side surface of an integrated circuit semiconductor substrate while performing optical based testing through or at the back side surface of the semiconductor substrate. In one embodime... | 06/26/2001 |
