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| Number | Title | Issue Date |
| 7417311 | Semiconductor device and method of fabricating the same A semiconductor wafer is thinned to a predetermined thickness by grinding the backside thereof (which is opposite to the side where a plurality of devices are formed and metal posts are further formed), and then a metal layer made of metal having a linear thermal ex... | 08/26/2008 |
| 7332807 | Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of t... | 02/19/2008 |
| 7316789 | Conducting liquid crystal polymer nature comprising carbon nanotubes, use thereof and method of fabrication Conducting liquid crystal polymer matrix comprising carbon nanotubes aligned in the matrix is provided, along with use thereof and method of fabrication. ... | 01/08/2008 |
| 7301232 | Integrated circuit package with carbon nanotube array heat conductor An integrated circuit package includes a die mounted on a substrate, an integrated heat spreader set above the die, and an array of carbon nanotubes mounted between the die and the integrated heat spreader. The integrated heat spreader is fixed on the substrate, and... | 11/27/2007 |
| 7285852 | Semiconductor device capsule A semiconductor device capsule comprising a semiconductor assembly mounted between opposed poles. At least one of the poles includes slots around the locality of the or each chip or group of chips within the semiconductor assembly to define a contact body portion on... | 10/23/2007 |
| 7285856 | Package for semiconductor devices To prevent the occurrence of stress in the junction portion between the semiconductor element and the semiconductor package mounting the semiconductor element, so that cracks will not occur even when there is mounted a semiconductor element having a small strength. ... | 10/23/2007 |
| 7239016 | Semiconductor device having heat radiation plate and bonding member A semiconductor device includes a heat generation element; a bonding member; first and second heat radiation plates disposed on first and second sides of the heat generation element through the bonding member; a heat radiation block disposed between the first heat r... | 07/03/2007 |
| 7224050 | Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging Integrated circuit packages and their manufacture are described, wherein the packages comprise dendrimers or hyperbranched polymers. In some implementations, the dendrimers or hyperbranched polymers include repeat units having one or more ring structures and having ... | 05/29/2007 |
| 7119434 | Efficiency CPU cooling arrangement A CPU cooling assembly having a first, covering layer of conductive material above the upper surface of an enclosed, heat producing chip and a third, upper layer of conductive material (a heat sink base plate) thermally bonded to the first by an intermediate, second... | 10/10/2006 |
| 7064451 | Area array semiconductor device and electronic circuit board utilizing the same An area array semiconductor device is constituted of a circuit wiring substrate having a circuit wiring and a semiconductor chip mounted on the circuit wiring substrate and electrically connected with the circuit wiring. A sealing layer composed of a sealing resin i... | 06/20/2006 |
| 6680015 | Method of manufacturing a heat sink assembly with overmolded carbon matrix A net-shape molded heat sink is provided which includes a thermally conductive main body and a number of thermally conductive fins integrally connected to and emanating from the main body. The heat sink is formed by overmolding a carbon-carbon matrix core... | 01/20/2004 |
| 6661317 | Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly A microwave monolithic integrated circuit assembly includes a microwave monolithic integrated circuit having an MMIC circuit plane and having a first region of relatively high heat production and a second region of relatively low heat production. A heat-d... | 12/09/2003 |
| 6538892 | Radial finned heat sink A radial finned heat sink assembly for an electrical component is constructed from a graphite material, which may be resin impregnated. The assembly includes a base, and a plurality of spaced parallel planar fin members supported by the base. Each fin mem... | 03/25/2003 |
| 6503626 | Graphite-based heat sink The present invention relates to a system for managing the heat from a heat source like an electronic component. More particularly, the present invention relates to a system effective for dissipating the heat generated by an electronic component using a h... | 01/07/2003 |
| 6482520 | Thermal management system The present invention relates to a system for managing the heat from a heat source like an electronic component. More particularly, the present invention relates to a system effective for dissipating the heat generated by an electronic component using a t... | 11/19/2002 |
| 6428886 | Method for attenuating thermal sensation when handling objects at non-body temperature A method for fabricating an object to attenuate thermal sensation when handling the object at non-body temperature, and an object fabricated in accord with the method. There is first provided a substrate which has a first surface subject to handling. Ther... | 08/06/2002 |
| 6413623 | Method for attenuating thermal sensation when handling objects at non-body temperature A method for fabricating an object to attenuate thermal sensation when handling the object at non-body temperature, and an object fabricated in accord with the method. There is first provided a substrate which has a first surface subject to handling. Ther... | 07/02/2002 |
| 6259157 | Hybrid integrated circuit device, and method of manufacturing thereof A hybrid integrated circuit device comprising: a substrate having an insulated surface and superior thermal conductivity; conductor patterns provided on the substrate; an element mounted on the surface so as to connect with the conductor patterns through ... | 07/10/2001 |
| 6251706 | Method for cooling the backside of a semiconductor device using an infrared transparent heat slug An apparatus and method that permits the removal of heat from the back side surface of an integrated circuit semiconductor substrate while performing optical based testing through or at the back side surface of the semiconductor substrate. In one embodime... | 06/26/2001 |
| 6132823 | Superconducting heat transfer medium A superconducting heat transfer medium that has three basic layers, the first layer being various combinations of sodium, beryllium, a metal such as manganese or aluminum, calcium, boron and dichromate radical; the second layer formed over the first layer... | 10/17/2000 |
| 6125921 | Radiator A radiator at least comprises a seat and a heat dissipating body. The seat have a receiving space; and the heat dissipating body is formed by a plurality of top portions, middle portions and bottoms which are connected continuously as a bending grid. A ve... | 10/03/2000 |
| 6033787 | Ceramic circuit board with heat sink A ceramic circuit board with a heat sink which has a long life under heat cycles. First and second aluminum plates are laminated and bonded onto both sides of a ceramic substrate through Al--Si-based brazing solders, respectively. A heat sink formed of an... | 03/07/2000 |
| 5895972 | Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug An apparatus and method that permits the removal of heat from the back side surface of an integrated circuit semiconductor substrate while performing optical based testing through or at the back side surface of the semiconductor substrate. In one embodime... | 04/20/1999 |
| 5786633 | Semiconductor module having high insulating power and high thermal conductivity A semiconductor module having a high dissipated power has an electrically insulating and thermally conducting layer of crystalline carbon provided between a semiconductor chip and a heat elimination element, whereby the semiconductor chip, the insulating ... | 07/28/1998 |
| 5523260 | Method for heatsinking a controlled collapse chip connection device A controlled collapse chip connection device can be heat sinked in the following manner. A carbon composition heat sink (102) having a thermal expansion coefficient substantially equal to a thermal expansion coefficient of the controlled collapse connecti... | 06/04/1996 |
| 5494753 | Articles having thermal conductors of graphite Graphite is employed as a heat sink material, preferably with its c-planes perpendicular to the surface on which the heat-generating source is mounted at least in the portion in immediate contact with said source. The thermal conductivity of the graphite ... | 02/27/1996 |
| 5316080 | Heat transfer device Gas derived graphite fibers generated by the decomposition of an organic gas are joined with a suitable binder. This produces a high thermal conductivity composite material which passively conducts heat from a source, such as a semiconductor, to a heat si... | 05/31/1994 |
| 5258726 | Voltage controlled oscillator with low operating supply voltage A voltage controlled oscillator (VCO) circuit (10) for operating at low supply voltages has been provided. The VCO circuit includes an oscillation stage which utilizes a negative resistance technique for oscillation and includes a first inductor (38) for ... | 11/02/1993 |
| 5224030 | Semiconductor cooling apparatus Gas derived graphite fibers generated by the decomposition of an organic gas are joined with a suitable binder. This produces a high thermal conductivity composite material which passively conducts heat from a source, such as a semiconductor, to a heat si... | 06/29/1993 |
| 5221575 | Thermally conductive sheet A thermally conductive sheet comprising a metal foil of which at least one side is coated with a graphite powder-containing silicone rubber layer to gain improved thermally conductive efficiency without attended by decrease in thermal conductivity with ti... | 06/22/1993 |
| 5049981 | Heat sink for electronic circitry A thermally balanced electronic circuit having an element mounted on a suitable support base, a heat-sink having a bottom portion contacting the element and at least one flange projecting from the bottom portion, and a stress-balancing insert positioned o... | 09/17/1991 |
| 4704626 | Graded sealing systems for semiconductor package A graded seal assembly adapted for hermetically sealing a semiconductor package is disclosed. First and second members having first and second coefficients of thermal expansion respectively are provided. A leadframe is disposed between the first and secon... | 11/03/1987 |
| 4703339 | Package having a heat sink suitable for a ceramic substrate A package including a heat sink especially suitable for a ceramic substrate is disclosed. The heat sink is formed of aluminum-silicon alloy material and is fixed to a surface of the ceramic substrate opposing a second surface on which at least one heat ge... | 10/27/1987 |
| 4471837 | Graphite heat-sink mountings Efficient dissipation and uniform spreading of heat from electronic solid-state devices by their associated heat-sink structures is promoted by thin broad-area thermally-conductive mountings built up from layers of a special form of substantially pure fle... | 09/18/1984 |
| 3993123 | Gas encapsulated cooling module A gas encapsulated cooling unit is provided for one or more heat generating components mounted on a substrate. A heat conductive cap is sealed to the substrate enclosing the heat generating components. The wall of the cap opposite the substrate contains e... | 11/23/1976 |
