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| Number | Title | Issue Date |
| 7427807 | Chip heat dissipation structure and manufacturing method This invention discloses a manufacturing method and a structure for a chip heat dissipation. This heat dissipation structure includes a bottom plate of circuit structure, a die of central processing unit and a cap. The cover is often used in conducting the waste hea... | 09/23/2008 |
| 7388286 | Semiconductor package having enhanced heat dissipation and method of fabricating the same A semiconductor package comprising a semiconductor chip and a first heat spreader adhered to the upper surface of the semiconductor chip is provided. The first heat spreader comprises a flat metal plate and a plurality of metal balls adhered to the flat metal plate.... | 06/17/2008 |
| 7378730 | Thermal interconnect systems methods of production and uses thereof Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated ... | 05/27/2008 |
| 7345364 | Structure and method for improved heat conduction for semiconductor devices A thermally conductive structure for a semiconductor integrated circuit and a method for making the structure. The structure comprises one or more vertical and/or horizontal thermally conductive elements disposed proximate a device for improving thermal conductivity... | 03/18/2008 |
| RE39992 | Morphing fillers and thermal interface materials A thermally conductive mechanically compliant pad including a quantity of gallium and/or indium alloy liquid at temperatures below about 120° C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined wi... | 01/01/2008 |
| 7183641 | Integrated heat spreader with intermetallic layer and method for making Integrated heat spreader and die coupled with solder in a manner forming an intermetallic compound having a higher liquidus temperature than the liquidus temperature of the solder used to create the intermetallic compound are described herein. ... | 02/27/2007 |
| 7169650 | Semi-solid metal injection methods for electronic assembly thermal interface To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of a die to an integrated heat spreader (IHS) through a high capa... | 01/30/2007 |
| 7105922 | Electrode-type heat sink The invention relates to a method of manufacturing a semiconductor device (10), wherein a semiconductor element (1) provided with a number of connection regions (2) is fitted between a first, electroconductive plate (3) and a second plate... | 09/12/2006 |
| 6667191 | Chip scale integrated circuit package An integrated circuit package including a silicon wafer, a plate of intermetallic compound fixed to the back surface of the silicon wafer and a plurality of solder ball contacts. The solder ball contacts are in electrical connection with die circuitry on ... | 12/23/2003 |
| 6656770 | Thermal enhancement approach using solder compositions in the liquid state Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder compositio... | 12/02/2003 |
| 6641861 | Heatsink and fabrication method thereof A method of fabricating a heatsink including a substrate of a sintered compact containing Cu and W, and a thin diamond film layer formed on the surface of the substrate with good adherence, involves immersing the substrate in acid to reduce the Cu content... | 11/04/2003 |
| 6635099 | Aqueous nonferrous feedstock material for injection molding This invention provides a process for forming sintered, molded articles having improved dimensional stability. More particularly, this invention pertains to process for forming heat sinks. This process includes forming a substantially uniform copper compo... | 10/21/2003 |
| 6624224 | Method of preparing thermally conductive compounds by liquid metal bridged particle clusters A thermally conductive mechanically compliant pad of high stability including a quantity of gallium and/or indium alloy liquid at temperatures below about 120° C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. ... | 09/23/2003 |
| 6614105 | Chip-type semiconductor device A TRIAC which is one species of chip-type semiconductors includes an element body made of silicon, electrodes provided on one face of the element body, a molybdenum plate provided on one of the electrodes by an alloy plate made of aluminum and silicon, a ... | 09/02/2003 |
| 6596139 | Discontinuous high-modulus fiber metal matrix composite for physical vapor deposition target backing plates and other thermal management applications The invention includes the use of a high-modulus fiber metal matrix composite material as a backing plate for physical vapor deposition targets, as a lid for microelectronics packages, as a heat spreader, and as a heat sink. In one implementation, copper-... | 07/22/2003 |
| 6589310 | High conductivity copper/refractory metal composites and method for making same The thermal conductivity, thermal conductivity, of a sintered copper/refractory metal composite having a maximum porosity of about 1% is greatly improved when the composite contains phosphorus and sintering aid in a specified weight ratio, "phosphorus/sin... | 07/08/2003 |
| 6586279 | Method of integrating a heat spreader and a semiconductor, and package formed thereby A method of integrating a heat spreader into a semiconductor package includes depositing an adhesion metal layer on the back of a wafer at low temperature. A heat transfer metal layer is subsequently deposited on the adhesion metal layer at low temperatur... | 07/01/2003 |
| 6579623 | Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material member To provide a composite material member for semiconductor device, an insulated semiconductor device and non-insulated semiconductor device using the composite material member, which are effective for obtaining a semiconductor device that alleviates thermal... | 06/17/2003 |
| 6563212 | Semiconductor device A semiconductor device in which a semiconductor chip 1 is bonded by a metal bond 2 to one surface of a heat sink 4 formed of a material with a thermal expansion coefficient is close to he semiconductor chip 1, the heat sink 4 is glued to a stiffener with ... | 05/13/2003 |
| 6504242 | Electronic assembly having a wetting layer on a thermally conductive heat spreader An electronic assembly including a die, having an integrated circuit formed therein, a thermally conductive heat spreader, and indium located between the die and the heat spreader, is described. The heat spreader has a layer of nickel. A gold layer is for... | 01/07/2003 |
| 6461891 | Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple According to one aspect of the invention a method of constructing an electronic assembly is provided. The electronic assembly is constructed from a semiconductor package including a package substrate and a semiconductor chip mounted to the package substra... | 10/08/2002 |
| 6436550 | Sintered compact and method of producing the same A highly reliable sintered compact which can be readily and safely produced, and a method for producing such sintered compact are provided. The sintered compact is preferably formed into a heat sink 1 which comprises a heat sink main body 2. The heat sink... | 08/20/2002 |
| 6404049 | Semiconductor device, manufacturing method thereof and mounting board A semiconductor device in which a semiconductor chip 1 is bonded by a metal bond 2 to one surface of a heat sink 4 formed of a material with a thermal expansion coefficient is close to the semiconductor chip 1, the heat sink 4 is glued to a stiffener with... | 06/11/2002 |
| 6373701 | Heat dissipation assembly A heat dissipation assembly (20) includes a heat sink (10) and a metal plate (30). The heat sink includes a chassis (14) and a plurality of fins (12). The chassis forms a pair of tabs (17) depending from each of two opposite sides of a bottom surface (15)... | 04/16/2002 |
| 6361857 | Heatsink and fabrication method thereof A thin diamond film layer is formed on a substrate with good adherence. A heatsink includes a substrate of a sintered compact including Cu and W, and a thin diamond film layer formed on the surface of the substrate. The Cu content in the substrate is at l... | 03/26/2002 |
| 6359334 | Thermally conductive adhesive tape for semiconductor devices and method using the same A thermally conductive adhesive tape and method for its use in packaging integrated circuits fabricated on semiconductor material. The thermally conductive adhesive tape includes a thermally conductive base upon which an adhesive layer is laminated or coa... | 03/19/2002 |
| 6343647 | Thermal joint and method of use A thermal joint for facilitating heat transfer between two components is described. The thermal joint is formed from an alloy of at least two constituents. The alloy has a liquid temperature and a solid temperature. When the operating temperature falls be... | 02/05/2002 |
| 6341651 | Heat sink and method of fabricating same In fabricating a heat sink from a blank comprising a base plate portion, and a fin-forming portion to be cut and provided on at least one side of the base plate portion by cutting the fin-forming portion to a raised form to make a plurality of fins, an ob... | 01/29/2002 |
| 6339880 | Process for manufacturing heat sink In a process for manufacturing a heat sink comprising a heat dissipating base plate and a multiplicity of tonguelike fins formed on an upper surface of the base plate, a heat sink blank of aluminum extrudate is formed which has a part for forming a thick ... | 01/22/2002 |
| 6339875 | Method for removing heat from an integrated circuit A heatsink interface material for securing a heatsink to an integrated circuit includes a core material having an adhesive forced into opposing surfaces of the core material. It is preferred that an intermediate region of the core material be free of adhe... | 01/22/2002 |
| 6339120 | Method of preparing thermally conductive compounds by liquid metal bridged particle clusters A thermally conductive mechanically compliant pad including a quantity of gallium and/or indium alloy liquid at temperatures below about 120° C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then ... | 01/15/2002 |
| 6300167 | Semiconductor device with flame sprayed heat spreading layer and method A semiconductor device having a heat spreading layer (18,118) of material deposited by flame spraying on a back surface of the semiconductor die (12,112). The semiconductor die (12,112) has a thermal coefficient of expansion substantially similar to the t... | 10/09/2001 |
| 6281573 | Thermal enhancement approach using solder compositions in the liquid state Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder compositio... | 08/28/2001 |
| 6274407 | Method and article for attaching high-operating-temperature electronic component A method and article for attaching an electronic component, such as a semiconductor die, to a substrate includes applying a relatively low-melting-temperature solder preform to the substrate; and applying a bead of a curable bonding material to the substr... | 08/14/2001 |
| 6262481 | Folded heat sink for semiconductor device package A heat conducting metal is placed under a semiconductor chip and wraps around a substrate of the semiconductor device package to serve as the heat sink for the chip. The metal can wrap around a through-hole in the middle of the substrate, or wrap around t... | 07/17/2001 |
| 6225571 | Heatsink with high thermal conductivity dielectric The present invention provides a heatsink for use with a heat-generating electrical component. The heatsink comprises a spine having opposing sides, cooling fins extending from the spine, and a dielectric layer adhered to at least one of the opposing side... | 05/01/2001 |
| 6172415 | Thin plate member for semiconductor package and manufacturing method therefor Disclosed is a thin plate member for forming a semiconductor package, having a recess for receiving a semiconductor chip. The thin plate is composed of sintered metal, e.g. sintered copper or sintered alluminum alloy. A sintered metal body being porous an... | 01/09/2001 |
| 6167949 | Low EMI emissions heat sink device A low electro-magnetic radiation emissions heat sink that dissipates heat away from an integrated circuit package by means of conduction to the electronic chassis. The heat sink may also include a ferrite ring for reducing electro-magnetic radiation emiss... | 01/02/2001 |
| 6166411 | Heat removal from SOI devices by using metal substrates In one embodiment, the present invention relates to a method of forming a silicon-on-insulator substrate involving providing a metal wafer; forming a low melting point oxide layer over the metal wafer; forming a first insulation layer over the low melting... | 12/26/2000 |
| 6144104 | High-operating-temperature electronic component A product for attaching an electronic component, such as a semiconductor die, to a substrate includes a relatively low-melting-temperature solder preform applied to the substrate; and a bead of a curable bonding material applied to the substrate around th... | 11/07/2000 |
