Class 257/E23.108 - Semiconductor materials (EPO)

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: This subclass is indented under subclass E23.106. This subclass
No. of patents: 27
Last issue date: 03/18/2008

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Number	Title	Issue Date
7345364	Structure and method for improved heat conduction for semiconductor devices A thermally conductive structure for a semiconductor integrated circuit and a method for making the structure. The structure comprises one or more vertical and/or horizontal thermally conductive elements disposed proximate a device for improving thermal conductivity...	03/18/2008
7287320	Method for programming a routing layout design through one via layer A method for programming a routing layout design through one via layer includes forming a plurality of metal traces on a first routing layer and a second routing layer, and positioning a plurality of vias within a via layer disposed between the first and second rout...	10/30/2007
7273812	Microprobe tips and methods for making Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b...	09/25/2007
6489005	Method of making silicon article having columns A silicon article including a silicon base and columns extending from the silicon base. The columns define a gap between the columns which is devoid of material so that the article can act as a filter or heat sink. Also disclosed is a method of making the...	12/03/2002
6462405	Semiconductor package A semiconductor package is proposed, in which a lid is attached to a semiconductor chip and appropriately spaced apart from a heat sink having a top surface thereof exposed to the outside an encapsulant, so as to prevent external moisture from condensing ...	10/08/2002
6452265	Multi-chip module utilizing a nonconductive material surrounding the chips that has a similar coefficient of thermal expansion A multi-chip module is constructed by aligning prewired chips on a support wafer and depositing a nonconductive thermally conductive and electrically nonconductive material having a coefficient of thermal expansion that approximate that of the chips (e.g....	09/17/2002
6343647	Thermal joint and method of use A thermal joint for facilitating heat transfer between two components is described. The thermal joint is formed from an alloy of at least two constituents. The alloy has a liquid temperature and a solid temperature. When the operating temperature falls be...	02/05/2002
6251706	Method for cooling the backside of a semiconductor device using an infrared transparent heat slug An apparatus and method that permits the removal of heat from the back side surface of an integrated circuit semiconductor substrate while performing optical based testing through or at the back side surface of the semiconductor substrate. In one embodime...	06/26/2001
6191944	Heat sink for electric and/or electronic devices A heat sink adapted for use with an electrical and/or electronic device, in particular with a semiconductor chip such as an integrated circuits, or with a casing for such a device, is formed from a material including whiskers....	02/20/2001
6187412	Silicon article having columns and method of making A silicon article including a silicon base and columns extending from the silicon base. The columns define a gap between the columns which is devoid of material so that the article can act as a filter or heat sink. Also disclosed is a method of making the...	02/13/2001
5948689	Integrated thermal coupling for heat generating device In order to provide a thermal coupling between a heat source and a heat sink, an integrated interleaved-fin connector is provided. A first substrate includes a first side surface and a second side surface. A plurality of heat generating devices are formed...	09/07/1999
5895972	Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug An apparatus and method that permits the removal of heat from the back side surface of an integrated circuit semiconductor substrate while performing optical based testing through or at the back side surface of the semiconductor substrate. In one embodime...	04/20/1999
5838065	Integrated thermal coupling for heat generating device In order to provide a thermal coupling between a heat source and a heat sink, an integrated interleaved-fin connector is provided. A first substrate includes a first side surface and a second side surface. A plurality of heat generating devices are formed...	11/17/1998
5757081	Surface mount and flip chip technology for total integrated circuit isolation An integrated circuit chip has full trench dielectric isolation of each portion of the chip. Initially the chip substrate is of conventional thickness and has semiconductor devices formed in it. After etching trenches in the substrate and filling them wit...	05/26/1998
5753529	Surface mount and flip chip technology for total integrated circuit isolation An integrated circuit chip has full trench dielectric isolation of each portion of the chip. Initially the chip substrate is of conventional thickness and has semiconductor devices formed in it. After etching trenches in the substrate and filling them wit...	05/19/1998
5402004	Heat transfer module for ultra high density and silicon on silicon packaging applications A system for dissipating heat from semiconductor chips disposed on a substrate which may individually produce differing amounts of heat, the substrate secured to a device uniformly distributing the heat produced by the chips thereover in the form of a met...	03/28/1995
5339216	Device and method for reducing thermal cycling in a semiconductor package In semiconductor packing, a method and device for reducing thermal stress on a die and for reinforcing the strength of a die, A thermally-conductive member is positioned in a cooperating manner with the die during the packaging process....	08/16/1994
5332695	Method of manufacturing semi conductor device mounted on a heat sink A semiconductor device having a semiconductor element and a heat sink radiating heat generated by the semiconductor element incudes an amorphous semiconductor film disposed on the heat sink and the semiconductor element disposed on the amorphous semicondu...	07/26/1994
5304846	Narrow channel finned heat sinking for cooling high power electronic components Dissipation of the heat produced by the operation of electronic circuitry may be improved by a heat sink which comprises a flat base from which a number of vertical fins extend. The fins are parallel to one another and define a number of parallel channels...	04/19/1994
5247203	Semiconductor device mounted on a heat sink with an intervening amorphous semiconductor material A semiconductor device having a semiconductor element and a heat sink radiating heat generated by the semiconductor element includes an amorphous semiconductor film disposed on the heat sink and the semiconductor element disposed on the amorphous semicond...	09/21/1993
5206713	Mounting silicon chips A mounting for a semiconductor chip is composed substantially of polysilicon materials and incorporates integral heat dissipating elements into its design. The mounting can be cast from molten polysilicon or machined from a block of solid polysilicon depe...	04/27/1993
5173764	Semiconductor device having a particular lid means and encapsulant to reduce die stress A semiconductor device (20) has reduced die stress by incorporating a lid (30) which constrains the expansion and contraction of an encapsulant. In one embodiment, a semiconductor die (22) having an active surface (23) is coupled to a plurality of leads (...	12/22/1992
5164884	Device for cooling a power transistor The invention relates to a cooling construction for cooling a power transistor (4) having a plastic encapsulation, wherein the waste heat produced is conducted away mainly via the collector lead (6), the collector lead being connected to the collector str...	11/17/1992
5051814	Method of providing stress-free thermally-conducting attachment of two bodies A body having a surface for facilitating liquid adherence includes a substrate and a layer of etchable material on a surface of the substrate. Grooves having re-entrant surfaces are formed in the layer of material. In one embodiment, a heat sink for a sem...	09/24/1991
5016083	Submount for semiconductor laser device A semiconductor laser device submount disposed between a semiconductor laser chip and a metal block for securing them together includes a metallization structure on each of two opposing surfaces of an Sb-doped submount body. The metallization includes a f...	05/14/1991
4698662	Multichip thin film module A package for thermal dissipation of heat from multiple integrated circuit chips is described. The package includes a silicon substrate for electrical connection to silicon integrated-circuit chips. The silicon substrate provides a high degree of thermal ...	10/06/1987
4567505	Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like Two bodies such as an integrated circuit and a heat sink are maintained in a low stress and high thermal conductance abutment by pressure from capillary attraction. A surface of one of the bodies is provided with grooves preferably having reentrant surfac...	01/28/1986

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Class 257/E23.108 - Semiconductor materials (EPO)