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| Number | Title | Issue Date |
| 7420273 | Thinned die integrated circuit package A method and apparatus provide an integrated circuit package with improved heat dissipation and easier fabrication. The integrated circuit package includes a thinned semiconductor die attached to a heat spreader using a thermally conductive material. The thinned die... | 09/02/2008 |
| 7397139 | Epoxy resin molding material for sealing use and semiconductor device An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 μm or less and a specific surface area of 3.0 m2/g or more.... | 07/08/2008 |
| 7347955 | Heat conducting polymer mold products A mold product comprising liquid crystal composition for conducting heat. The liquid crystal composition contains liquid crystal polymer having an orientation degree α obtained by equation 1 below: Orientation degree α=(180−Δβ)/180 equation 1 | 03/25/2008 |
| 7344919 | Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached ... | 03/18/2008 |
| 7342306 | High performance reworkable heatsink and packaging structure with solder release layer A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are s... | 03/11/2008 |
| 7332807 | Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of t... | 02/19/2008 |
| RE39992 | Morphing fillers and thermal interface materials A thermally conductive mechanically compliant pad including a quantity of gallium and/or indium alloy liquid at temperatures below about 120° C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined wi... | 01/01/2008 |
| 7301232 | Integrated circuit package with carbon nanotube array heat conductor An integrated circuit package includes a die mounted on a substrate, an integrated heat spreader set above the die, and an array of carbon nanotubes mounted between the die and the integrated heat spreader. The integrated heat spreader is fixed on the substrate, and... | 11/27/2007 |
| 7189778 | Thermally conductive polymer molded article and method for producing the same A thermally conductive polymer molded article formed by molding a thermally conductive composition which comprises a liquid crystalline polymer and thermally conductive filler having magnetic anisotropy, wherein the liquid crystalline polymer and the thermally condu... | 03/13/2007 |
| 7090482 | Semiconductor device package manufacturing method and semiconductor device package manufactured by the method A bump is formed on each element electrode of a semiconductor device, and a thermoplastic resin sheet is aligned in position with the semiconductor device. The sheet and the semiconductor device are subjected to hot pressing to melt the sheet, forming a thermoplasti... | 08/15/2006 |
| 7013555 | Method of applying phase change thermal interface materials The present invention discloses a method of providing an integral thermal interface on an interface surface of a heat dissipation device, such as a heat sink. In accordance with the present invention, the phase change material is applied directly onto the interface ... | 03/21/2006 |
| 6783692 | Heat softening thermally conductive compositions and methods for their preparation A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired... | 08/31/2004 |
| 6690583 | Carrier for electronic components A carrier intended for one or several electronic components and having spaces provided for the components on at least one surface is provided. The carrier has an at least partly conductive Low Temperature Cofire Ceramic (LTCC) material with good thermal c... | 02/10/2004 |
| 6663969 | Heat conductive adhesive film and manufacturing method thereof and electronic component A heat conductive adhesive film, wherein a magnetic field is applied to a film composition comprising boron nitride powder for orientating and solidifying the boron nitride powder in the composition in a given direction, an manufacturing method thereof, a... | 12/16/2003 |
| 6660566 | Heat conductive molded body and manufacturing method thereof and semiconductor device A heat conductive molded body effectively radiating heat generated from semiconductor elements, power supply or light source used for electric apparatuses, and a manufacturing method thereof and a semiconductor device excellent in heat radiation. A heat c... | 12/09/2003 |
| 6660203 | Formed sheet of thermalconductive silicone gel and method for producing the same A formed sheet of thermalconductive silicone gel is provided. The formed sheet has (i) a thin film reinforcement layer hardened into rubber only in a surface layer on the upper side, the lower side, or both sides, (ii) a sheet-shaped reinforcement materia... | 12/09/2003 |
| 6656389 | Thermal paste for low temperature applications A thermal paste for low temperature applications made from a combination of a thermally conducting solid filler, dispersant and linear alkylbenzene carrier. The thermal paste may be applied to an electronic component to increase the cooling of the electro... | 12/02/2003 |
| 6657297 | Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads A flexible plastic thermally conductive multilayer semiconductor mounting pad having a highly thermally conductive bulk layer with thermally conductive surface skin layers bonded integrally to opposed major surfaces thereof. The bulk layer and the surface... | 12/02/2003 |
| 6652958 | Thermally conductive polymer sheet A thermally conductive polymer sheet includes a polymer matrix and graphitized carbon fibers as a thermally conductive filler. The graphitized carbon fibers are formed by spinning, infusibilization, carbonization, pulverized mesophase pitch before graphit... | 11/25/2003 |
| 6651331 | Method of establishing a thermal joint on a heat sink A method for depositing a thermal interface onto a heat sink including the selection of a highly thixotropic compound formed into a bulk form so as to present a tip which is melted upon contact with a preheated heat sink. The tip cross section preferably ... | 11/25/2003 |
| 6649258 | Heat conductive silicone composition and semiconductor device A heat conductive silicone composition comprising (A) an alkenyl group-bearing organopolysiloxane, (B) an organohydrogenpolysiloxane having Si--H groups on side chains, (C) an organohydrogenpolysiloxane having an Si--H group at either end, (D) a filler co... | 11/18/2003 |
| 6649325 | Thermally conductive dielectric mounts for printed circuitry and semi-conductor devices and method of preparation Methods and formulations for use in preparing thermally conductive dielectric mounts for heat generating semi-conductor devices and associated circuitry. The formulations include a thermoplastic resin selected from the group consisting of polysulfone, pol... | 11/18/2003 |
| 6644395 | Thermal interface material having a zone-coated release linear A release liner particularly adapted for use with a layer of a thermal interface material having a first surface and a second surface which is bondable to the heat transfer surface of a thermal dissipation member. The liner has an exterior surface and an ... | 11/11/2003 |
| 6635959 | Thermally conductive silk-screenable interface material The present invention provides a novel visible light curable composition for forming a thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic devic... | 10/21/2003 |
| 6631078 | Electronic package with thermally conductive standoff A heat dissipating flexible or resilient standoff is mechanically clamped between an electronic module and substrate, such as, PCB. The clamping arrangement comprises a heat sink compressing a thermally conductive flexible interface pad over the upper sur... | 10/07/2003 |
| 6624224 | Method of preparing thermally conductive compounds by liquid metal bridged particle clusters A thermally conductive mechanically compliant pad of high stability including a quantity of gallium and/or indium alloy liquid at temperatures below about 120° C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. ... | 09/23/2003 |
| 6620515 | Thermally conductive phase change materials A phase change composition comprises: a matrix comprising an organofunctional silicone wax, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any des... | 09/16/2003 |
| 6610635 | Dry thermal interface material A thermal interface material including a compound which has high thermal conductivity, is dry-to-the-touch, but naturally tacky, and may be formed into various shapes, such as sheets and blocks, to serve as a heat transfer material for electronic componen... | 08/26/2003 |
| 6599775 | Method for forming a flip chip semiconductor package, a semiconductor package formed thereby, and a substrate therefor A method of forming an underfilled semiconductor package comprises the steps of: providing a substrate (300) with raised terminal portions (305), disposing underfill compound (5) with filler (27) on the substrate (300), placing a bumped semiconductor die ... | 07/29/2003 |
| 6597070 | Semiconductor device and method of manufacturing the same A semiconductor device includes a passivation film (19) having opening portions through which an electrode pads (18) formed on a semiconductor chip (21) are exposed, projecting electrode portions (20) whose one end faces are connected to the electrode pad... | 07/22/2003 |
| 6578262 | Heat transfer material for an improved die edge contacting socket An improved die edge contacting socket incorporates particles of a thermally conducting material into an elastomeric compression pad disposed in the sealing cap of the socket. The elastomeric compression pad is preferably composed of an electrically insul... | 06/17/2003 |
| 6569711 | Methods and apparatus for balancing differences in thermal expansion in electronic packaging CTE differentials between chips and organic dielectric carriers, boards or other substrates to which the chips are attached are accommodated with a layer of a thermoplastic material, preferably a thermotropic polymer whose physical properties can be alter... | 05/27/2003 |
| 6563198 | Adhesive pad having EMC shielding characteristics The present invention is directed to the present invention is directed to an adhesive pad with electromagnetic compatibility (EMC) characteristics. An adhesive pad suitable for bonding electrical components may include a thermal bonding adhesive material ... | 05/13/2003 |
| 6555905 | Heat conductive silicone composition and semiconductor device A heat conductive silicone composition comprising (A) an alkenyl group-bearing organopolysiloxane, (B) an organohydrogenpolysiloxane having at least two Si--H groups, (C) a filler consisting of aluminum powder and zinc oxide powder in a weight ratio of fr... | 04/29/2003 |
| 6555486 | Thermally conductive silk-screenable interface material The present invention provides a novel visible light curable composition for forming a thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic devic... | 04/29/2003 |
| 6552421 | Semiconductor device and a method of manufacturing the same The present invention provides a semiconductor device which is stably operated even with respect to heat generated upon its operation and makes no use of an environmental harmful substance (lead). The semiconductor device includes a support plate for supp... | 04/22/2003 |
| 6544864 | METHODS EMPLOYING HYBRID ADHESIVE MATERIALS TO SECURE COMPONENTS OF SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES TO ONE ANOTHER AND ASSEMBLIES AND PACKAGES INCLUDING COMPONENTS SECURED TO ONE ANOTHER WITH SUCH HYBRID ADHESIVE MATERIALS A method for securing two or more semiconductor device components to one another. A hybrid adhesive material, including a pressure sensitive component and a thermoset component, is used to at least temporarily secure the semiconductor device components to... | 04/08/2003 |
| 6531771 | Dissipation of heat from a circuit board having bare silicon chips mounted thereon A method is disclosed for making a heat dissipation arrangement for a circuit board on which are mounted bare silicon chips having an exposed face. A heat spreader has a planar portion, on whose inner face (facing the circuit board) are applied one or mor... | 03/11/2003 |
| 6522555 | Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein A sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein a... | 02/18/2003 |
| 6508595 | Assembly of opto-electronic module with improved heat sink A heat sink for a transceiver optoelectronic module including dual direct heat paths and structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical ... | 01/21/2003 |
