Celebrity Inventors
Glam girl Heddy Lamar may have used her good looks to good effect on the silver screen, but she put her smarts to better use as an inventor. During World War II, she co-patented a frequency-switching system for torpedo guidance that was considered years ahead of its time.
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| Number | Title | Issue Date |
| 7439614 | Circuit device with dummy elements In a manufacturing method of a hybrid integrated circuit device 10 according to the present invention, a first dummy pattern D1 is provided on a first wiring layer 18A. Furthermore, a second dummy pattern D2 is provided on a second wiring... | 10/21/2008 |
| 7429502 | Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink An integrated circuit device incorporating a metallurgical bond to enhance thermal conduction to a heat sink. In a semiconductor device, a surface of an integrated circuit die is metallurgically bonded to a surface of a heat sink. In an exemplary method of manufactu... | 09/30/2008 |
| 7416923 | Underfill film having thermally conductive sheet An underfill film for an electronic device includes a thermally conductive sheet. The electronic device may include a printed circuit board, an electrical component, an underfill, and the thermally conductive sheet. The underfill is situated between the circuit boar... | 08/26/2008 |
| 7414313 | Polymeric conductor donor and transfer method The present invention relates to a donor laminate for transfer of a conductive layer comprising at least one electronically conductive polymer on to a receiver, wherein the receiver is a component of a device. The present invention also relates to methods pertinent ... | 08/19/2008 |
| 7400489 | System and a method of driving a parallel-plate variable micro-electromechanical capacitor A method of driving a parallel-plate variable micro-electromechanical capacitor includes establishing a first charge differential across first and second conductive plates of a variable capacitor in which the first and second conductive plates are separated by a var... | 07/15/2008 |
| 7399919 | Flexible heat sink Provided is a flexible heat sink article comprising a base comprising a polymer and a plurality of polymeric protrusions extending away from the base, each protrusion having a major dimension and a minor dimension. The base comprises thermally conductive particles, ... | 07/15/2008 |
| 7340828 | Method for producing metal/ceramic bonding circuit board There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required to carry out etching, when a molten metal is caused to contact to a c... | 03/11/2008 |
| 7327029 | Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink An integrated circuit device incorporating a metallurgical bond to enhance thermal conduction to a heat sink. In a semiconductor device, a surface of an integrated circuit die is metallurgically bonded to a surface of a heat sink. In an exemplary method of manufactu... | 02/05/2008 |
| 7327028 | Embedded heat spreader for folded stacked chip-scale package In some embodiments, a T-shaped heat spreader may be provided centrally within a folded stacked chip-scale package. The dice may be situated around the T-shaped heat spreader which may be made of high conductivity material. Heat may be dissipated through the T-shape... | 02/05/2008 |
| RE39992 | Morphing fillers and thermal interface materials A thermally conductive mechanically compliant pad including a quantity of gallium and/or indium alloy liquid at temperatures below about 120° C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined wi... | 01/01/2008 |
| 7279407 | Selective nickel plating of aluminum, copper, and tungsten structures A method of selectively plating nickel on an intermediate semiconductor device structure. The method comprises providing an intermediate semiconductor device structure having at least one aluminum or copper structure and at least one tungsten structure. One of the a... | 10/09/2007 |
| 7230332 | Chip package with embedded component A chip package is provided. The chip package includes at least one chip, an interconnection structure, a plurality of second pads and at least one panel-shaped component, wherein the chip includes a plurality of first pads on a surface thereof. The interconnection s... | 06/12/2007 |
| 7148136 | Method of producing ceramic multi-layer substrate A composite laminate, including shrink-prevention ceramic green sheets arranged on the main surfaces of an unfired ceramic laminate and having a sintering temperature greater than the firing temperature of the unfired ceramic laminate, is fired at a temperature whic... | 12/12/2006 |
| 7132746 | Electronic assembly with solder-bonded heat sink A process and electronic assembly for conducting heat from a semiconductor circuit device mounted to a substrate. The substrate is supported by a housing member equipped with a heat-conductive member. A surface of the device opposite the substrate is bonded to the h... | 11/07/2006 |
| 7115996 | Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped A method to selectively cap interconnects with indium or tin bronzes and copper oxides thereof is provided. The invention also provides the interconnect and copper surfaces so formed. ... | 10/03/2006 |
| 6873043 | Electronic assembly having electrically-isolated heat-conductive structure An electronic assembly equipped with a heat-conductive structure, and to a method of conducting heat from a circuit device within such an assembly. The heat-conductive structure comprises an interconnect layer, a contact layer, and an electrically insulating layer b... | 03/29/2005 |
| 6783692 | Heat softening thermally conductive compositions and methods for their preparation A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired... | 08/31/2004 |
| 6699571 | Devices and methods for mounting components of electronic circuitry Devices and methods for mounting components of electronic circuitry and these mounting devices are capable of surviving repeated thermal cycling. The devices comprise two metal laminate members brazed to a ceramic member on each of the two major surfaces ... | 03/02/2004 |
| 6690087 | Power semiconductor module ceramic substrate with upper and lower plates attached to a metal base A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed integrally. The ceramic substrate of the module has a struct... | 02/10/2004 |
| 6686030 | Metal/ceramic circuit board There is provided a metal/ceramic circuit board capable of eliminating discrepancy during mounting of parts to improve the reliability of mounting of the parts. The metal/ceramic circuit board has a ceramic substrate 10, and a metal circuit plate (a coppe... | 02/03/2004 |
| 6667548 | Diamond heat spreading and cooling technique for integrated circuits A semiconductor chip is shown containing an integral heat spreading layer that more effectively transmits heat from the die to ambient as a result of spreading the heat out on the die over a larger cross sectional area. Local hot spots are minimized which... | 12/23/2003 |
| 6660942 | Semiconductor device with an exposed external-connection terminal A wiring substrate equipped with a rerouted wiring having one end connected to an electronic-part mounting pad for electrically connecting an electronic part and another end connected to an external-connection terminal. In the wiring substrate, a low-elas... | 12/09/2003 |
| 6660203 | Formed sheet of thermalconductive silicone gel and method for producing the same A formed sheet of thermalconductive silicone gel is provided. The formed sheet has (i) a thin film reinforcement layer hardened into rubber only in a surface layer on the upper side, the lower side, or both sides, (ii) a sheet-shaped reinforcement materia... | 12/09/2003 |
| 6653741 | Thermal interface material and heat sink configuration A thermal interface material for use in electronic packaging, the thermal interface material comprises a solder with relatively high heat flow characteristics and a CTE modifying component to reduce or prevent damage due to thermal cycling. The thermal in... | 11/25/2003 |
| 6653710 | Fuse structure with thermal and crack-stop protection Thermal degradation of a low-k organic dielectric material is avoided or limited in the proximity of a heat source such as a fusible element by overlaying the low-k material with a thermally conductive material and providing a low thermal resistance path ... | 11/25/2003 |
| 6649325 | Thermally conductive dielectric mounts for printed circuitry and semi-conductor devices and method of preparation Methods and formulations for use in preparing thermally conductive dielectric mounts for heat generating semi-conductor devices and associated circuitry. The formulations include a thermoplastic resin selected from the group consisting of polysulfone, pol... | 11/18/2003 |
| 6646344 | Composite material, and manufacturing method and uses of same Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied. This compos... | 11/11/2003 |
| 6647310 | Temperature control of an integrated circuit An apparatus and method for controlling temperature during pre-delivery testing of microprocessors and integrated circuits wherein a testing package, including a thermally conductive lid overlying and in thermal contact with the microprocessor or integrat... | 11/11/2003 |
| 6646340 | Thermally coupling electrically decoupling cooling device for integrated circuits A thermally coupling electrically decoupling cooling device is described. The cooling device may be thermally disposed between a self-heating electrically conductive line and a semiconductor substrate to cool the line by transferring heat from the line to... | 11/11/2003 |
| 6644395 | Thermal interface material having a zone-coated release linear A release liner particularly adapted for use with a layer of a thermal interface material having a first surface and a second surface which is bondable to the heat transfer surface of a thermal dissipation member. The liner has an exterior surface and an ... | 11/11/2003 |
| 6638592 | Ceramic/metal substrate, especially composite substrate The invention relates to a novel ceramic/metal substrate, especially to a multiple substrate with a ceramic plate or ceramic layer.... | 10/28/2003 |
| 6630734 | Composite material, and manufacturing method and uses of same Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied. This compos... | 10/07/2003 |
| 6614105 | Chip-type semiconductor device A TRIAC which is one species of chip-type semiconductors includes an element body made of silicon, electrodes provided on one face of the element body, a molybdenum plate provided on one of the electrodes by an alloy plate made of aluminum and silicon, a ... | 09/02/2003 |
| 6614107 | Thin-film heat sink and method of manufacturing same A thin-film heat sink comprises a heat sink film functioning as a heat sink and a bonding film for bonding the heat sink film to a base. The bonding film is an aluminum oxide (Al2 O3) film formed using the CVD method and the heat sin... | 09/02/2003 |
| 6611056 | Composite material, and manufacturing method and uses of same Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied. This compos... | 08/26/2003 |
| 6586279 | Method of integrating a heat spreader and a semiconductor, and package formed thereby A method of integrating a heat spreader into a semiconductor package includes depositing an adhesion metal layer on the back of a wafer at low temperature. A heat transfer metal layer is subsequently deposited on the adhesion metal layer at low temperatur... | 07/01/2003 |
| 6586783 | Substrate for an electronic power circuit, and an electronic power module using such a substrate An electronic power circuit substrate including a wafer of electrically insulating material, wherein said wafer presents a face supporting one or more conductive tracks directly connected to one or more electronic power components, said conductive tracks ... | 07/01/2003 |
| 6583505 | Electrically isolated power device package A packaged power device includes a substrate including a first conductive layer, a second dielectric layer, and a third conductive layer. The first conductive layer is bonded to the second dielectric layer, and the second dielectric layer is bonded to the... | 06/24/2003 |
| 6574106 | Mounting structure of semiconductor device A mounting structure for a semiconductor device of the present invention includes a substrate, a semiconductor device, a plurality of connecting members and a member. The substrate has a first surface and a plurality of pads on the first surface. The semi... | 06/03/2003 |
| 6566166 | Method of manufacturing a cavity-down plastic ball grid array (CD-PBGA) substrate An organic substrate and a heat spreader are separately made, and are then combined with a partially cured liquid-type adhesive layer. In making the organic substrate, a solder mask and a cavity as a pocket for an IC die are first formed on one side of an... | 05/20/2003 |
