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| Number | Title | Issue Date |
| 7417299 | Direct connection multi-chip semiconductor element structure A direct connection multi-chip semiconductor element structure is proposed. A plurality of semiconductor chips are mounted and supported on a metal heat sink, such that heat generated by the chips during operation can be dissipated via the heat sink. A circuit struc... | 08/26/2008 |
| 7399919 | Flexible heat sink Provided is a flexible heat sink article comprising a base comprising a polymer and a plurality of polymeric protrusions extending away from the base, each protrusion having a major dimension and a minor dimension. The base comprises thermally conductive particles, ... | 07/15/2008 |
| 7372146 | Semiconductor module A semiconductor module includes a parts-mounting or packaging substrate, a plurality of power metal insulator semiconductor (MIS) chips which have top surfaces and back surfaces and are mounted by flip chip bonding on or above the package substrate while letting the... | 05/13/2008 |
| 7365422 | Package of leadframe with heatsinks A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink... | 04/29/2008 |
| 7342305 | Thermally enhanced cavity-down integrated circuit package A cavity-down ball grid includes a flexible circuit tape including a flexible tape laminated to a conductor layer. The flexible circuit tape has an aperture therein. A thermally conductive heat spreader is fixed to a first surface of the flexible circuit tape and th... | 03/11/2008 |
| 7304372 | Semiconductor package A semiconductor package including a bidirectional compound semiconductor component and two power semiconductor devices connected in a cascode configuration. ... | 12/04/2007 |
| 7253520 | CSP semiconductor device having signal and radiation bump groups A semiconductor device comprises a semiconductor chip which has a first surface, a pad which is formed directly on the first surface, an oxide film which is formed on the first surface, an insulating film which is formed on the oxide film and a part of the pad, a co... | 08/07/2007 |
| 7235889 | Integrated heatspreader for use in wire bonded ball grid array semiconductor packages The present invention is directed toward systems, packages, and methods for providing improved thermal performance in such packages and systems. Embodiments of the invention include a semiconductor integrated circuit (IC) package having a substrate with a heat sprea... | 06/26/2007 |
| 7199466 | Package design using thermal linkage from die to printed circuit board A substrate is provided that may include an area designated for mounting of an integrated circuit and one or more areas for retaining a thermal interface material proximate the integrated circuit mounting area. A thermal interface material containment area(s) may be... | 04/03/2007 |
| 7170183 | Wafer level stacked package Disclosed are a wafer level stacked package and its manufacturing method. As one example, in such a wafer level stacked package, a first semiconductor die is electrically connected to an upper surface of a substrate and a second semiconductor die is electrically con... | 01/30/2007 |
| 7109581 | System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed bet... | 09/19/2006 |
| 7084496 | Method and apparatus for providing optoelectronic communication with an electronic device An optoelectronic assembly for an electronic system includes a transparent substrate having a first surface and an opposite second surface, the transparent substrate being thermally conductive and being metallized on the surface. A support electronic chip set is con... | 08/01/2006 |
| 6676796 | Transferrable compliant fibrous thermal interface Described is a transferrable fibrous thermal interface. The interface comprises flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive. An encapsulant fil... | 01/13/2004 |
| 6674163 | Package structure for a semiconductor device A package structure for a semiconductor device comprises a substrate having a main surface and a back surface, a semiconductor chip formed on the main surface of the substrate, a package covering the semiconductor chip, radiation protrude electrodes and c... | 01/06/2004 |
| 6671176 | Method of cooling heat-generating electrical components A method of cooling heat-generating electrical components during service has a heat-removing element. Heat-removing element comprises a plurality of vias therein and is fixedly attached to a tip of the electrical components, typically on opposed charged e... | 12/30/2003 |
| 6664640 | Semiconductor device A semiconductor apparatus comprising: a semiconductor substrate; a first surface of the semiconductor substrate on which a semiconductor device is formed; a second surface opposite to the first surface of the semiconductor substrate; a via hole penetratin... | 12/16/2003 |
| 6657311 | Heat dissipating flip-chip ball grid array A heat dissipating flip-chip Ball Grid Array (BGA) (10) including a substrate (12), a die (14), a first set of solder balls (16) coupling the die with the substrate, a thermal compound (20) attached to a backside of the die, a second set of solder balls (... | 12/02/2003 |
| 6657864 | High density thermal solution for direct attach modules A high power density thermal packaging solution. A highly efficient thermal path is provided using a lid of a unique design configuration that connects the chip back-side to both a heat sink and thermally conductive substrate vias thus establishing two th... | 12/02/2003 |
| 6657296 | Semicondctor package A semiconductor package is proposed, in which at least one chip is mounted on a substrate, and at least one die-attach region is formed on the substrate. A plurality of thermal vias formed in the die-attach region and penetrating the substrate, in a manne... | 12/02/2003 |
| 6643136 | Multi-chip package with embedded cooling element A multi-chip package having one or more embedded cooling elements. The package includes a substrate, a plurality of chips, at least one cooling element, a plurality of solder balls and packaging material. The substrate has a front surface and a correspond... | 11/04/2003 |
| 6633075 | Heterojunction bipolar transistor and method for fabricating the same A heterojunction bipolar transistor includes an emitter layer, a base layer and a collector layer laminated on a top surface of a semiconductor substrate, and a heat sink layer made of a metal and provided on a rear surface of the substrate. A via hole is... | 10/14/2003 |
| 6633484 | Heat-dissipating devices, systems, and methods with small footprint An enhanced heat dissipation system and a method to extract heat from an integrated circuit device include a thermally conductive core having upper and lower outer surface areas. The system further includes a first conductive ring having a first array of ... | 10/14/2003 |
| 6627989 | Semiconductor device and method for manufacturing same To provide a semiconductor device that is capable of transmitting heat evolved in an active element efficiently to a heat sink member, and a manufacturing method for the semiconductor device. One of the terminals (such as drain electrode) of an active ele... | 09/30/2003 |
| 6627988 | Semiconductor device and method for manufacturing the same A resin sealed type semiconductor device is provided with a semiconductor chip which has a pad formed on a main surface thereof, an insulating film which is formed on a part of the pad and on the main surface of the semiconductor chip, an interconnection ... | 09/30/2003 |
| 6627992 | Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set A millimeter wave (MMW) transceiver module includes a microwave monolithic integrated circuit (MMIC) transceiver chip set that is surface mounted on a circuit board. The MMIC transceiver chip set includes a receiver MMIC chip package, a transmitter MMIC c... | 09/30/2003 |
| 6622786 | Heat sink structure with pyramidic and base-plate cut-outs A heat sink structure is formed by stacking a plurality of heat sink layers. Each layer comprises an array of vertically disposed heat dissipating elements extending from a base plate. Cut outs are formed in each of the base plates to form openings so tha... | 09/23/2003 |
| 6624523 | Structure and package of a heat spreader substrate A structure of a heat spreader substrate. A first heat spreader has a first upper surface, a corresponding first lower surface and an opening. A second heat spreader has a second upper surface and a corresponding second lower surface. The second heat spre... | 09/23/2003 |
| 6624063 | Semiconductor device having low dielectric layer and method of manufacturing thereof A semiconductor device including a semiconductor substrate, an insulating layer formed on the substrate, a dielectric organic layer formed on the insulating layer and having a dielectric constant of not more than 3.0, and an interconnection layer in conta... | 09/23/2003 |
| 6625028 | Heat sink apparatus that provides electrical isolation for integrally shielded circuit In one embodiment, a heat sink apparatus that provides electrical isolation for an integrally shielded, electronic circuit. The heat sink apparatus comprises a substrate having a first hole extending between a first and second sides of the substrate, a co... | 09/23/2003 |
| 6624045 | Thermal conducting trench in a seminconductor structure and method for forming the same The invention relates to a method of forming a trench filled with a thermally conducting material in a semiconductor substrate. In one embodiment, the method includes filling a portion of the trench with a thermally conducting material and patterning a co... | 09/23/2003 |
| 6621705 | Miniature surface mount heatsink element and method of use A printed circuit board (PCB) has at least a first surface. A patterned electrically and thermally conductive layer is disposed on the first surface. A surface mount device (SMD) is disposed on an area of the layer and is attached thereto with solder. Hea... | 09/16/2003 |
| 6618252 | Heat sink of module with built-in IC Disclosed is a heat sink of a module with a built-in integrated circuit (IC) including a circuit board formed with a plurality of first through holes extending from an upper surface of the circuit board to a lower surface of the circuit board, a metal-att... | 09/09/2003 |
| 6617682 | Structure for reducing die corner and edge stresses in microelectronic packages A microelectronic die is aligned with a package substrate and attached to it using solder balls. A specially shaped heat spreader, preferably with a coefficient of thermal expansion (CTE) similar to that of silicon, is attached to the back side of the die... | 09/09/2003 |
| 6614103 | Plastic packaging of LED arrays There is provided a flexible circuit module, including at least one rigid carrier, at least one solid state device mounted over a first side of the at least one rigid carrier, a flexible base supporting a second side of the at least one rigid carrier, a c... | 09/02/2003 |
| 6614657 | Heat sink for cooling an electronic component of a computer The heat sink is described which is used to cool an electronic component of a computer. The heat sink is constructed from a metal sheet which is bent so as to have a horizontal thermally conductive plate and four walls extending upwardly from the plate an... | 09/02/2003 |
| 6610590 | Method of manufacturing a laser impression on a low thermal conductivity layer of a semiconductor device A low thermal conductivity layer is formed on a back surface of a semiconductor wafer or chip, and a laser impression is formed on the low thermal conductivity layer. The laser impression can be formed without damaging the device surface of the semiconduc... | 08/26/2003 |
| 6611055 | Leadless flip chip carrier design and structure One disclosed embodiment comprises a substrate having a top surface for receiving a semiconductor die with a number of solder bumps on its active surface. The disclosed embodiment further comprises a printed circuit board attached to a bottom surface of t... | 08/26/2003 |
| 6605778 | Circuit carrier, in particular printed circuit board A circuit carrier (2) (printed circuit board 2) has two metallic outer layers (13, 14) and at least one metallic intermediate layer (11, 12). Insulating layers (8, 9) are arranged between the outer layers (13, 14) and the intermediate layer (11, 12). A co... | 08/12/2003 |
| 6605779 | Electronic control unit The present invention protects a thin wire connection from oscillation of a resin protecting an electronic circuit module from vibration, impact, and corrosion. An electronic control unit including an electronic circuit module in which a bare chip is moun... | 08/12/2003 |
| 6602737 | Semiconductor package with heat-dissipating structure and method of making the same A semiconductor package with a heat-dissipating structure and a method for making the same are proposed. The heat-dissipating structure includes a heat sink and a plurality of solder columns, wherein the solder columns are attached at ends thereof to the ... | 08/05/2003 |
