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| Number | Title | Issue Date |
| 7371615 | Heat sink and method for its production A method for producing a heat sink for cooling a semiconductor device including forming plural base members, the base member being each in plate or block-shape, the base member each having paths shaped on one or both sides of surfaces thereof, and the base member ea... | 05/13/2008 |
| 7332823 | Providing a metal layer in a semiconductor package In one embodiment, the present invention includes a semiconductor package having a substrate, a semiconductor die with a first surface opposing the substrate and a second surface, a metal layer formed on the second surface of the semiconductor die, and a mold layer ... | 02/19/2008 |
| 7298046 | Semiconductor package having non-ceramic based window frame A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled ... | 11/20/2007 |
| 7245004 | Semiconductor device A semiconductor device mountable on a wiring board with the bottom surface being opposed to the wiring board including a semiconductor chip; a mold resin encapsulating the semiconductor chip; a first heat spreader joined to the semiconductor chip on the bottom surfa... | 07/17/2007 |
| 7202561 | Semiconductor package with heat dissipating structure and method of manufacturing the same A semiconductor package in which heat is easily dissipated and a semiconductor chip is not damaged during a molding process, and a method of manufacturing the same. The semiconductor package with a heat dissipating structure includes a substrate, a semiconductor chi... | 04/10/2007 |
| 7199470 | Surface-mountable semiconductor component and method for producing it Surface-mountable semiconductor component having a semiconductor chip (1), at least two external electrical connections (31/314/41, 32/324/42), which are electrically conductively connected to at least two electrical contacts of the semiconductor chip ... | 04/03/2007 |
| 7115988 | Bypass capacitor embedded flip chip package lid and stiffener The present invention provides a heat spreader with a bypass capacitor to provide substantially instant power and/or to control simultaneous switching noise (SSN). The present invention also provides a semiconductor device package incorporating this heat spreader. I... | 10/03/2006 |
| 6661661 | Common heatsink for multiple chips and modules A common heatsink for multiple chips and modules which are spaced on electronic packages, and an arrangement for the formation of precision gaps intermediate two or more chips or modules covered by a common heatsink. Furthermore, a precision tool enables ... | 12/09/2003 |
| 6659168 | Heatsink with multiple fin types A heat sink includes a base having first and second regions, a first fin of a first type disposed on the first region of the base, and a second fin of a second type disposed on the second region of the base. The first and second regions of the base may be... | 12/09/2003 |
| 6657864 | High density thermal solution for direct attach modules A high power density thermal packaging solution. A highly efficient thermal path is provided using a lid of a unique design configuration that connects the chip back-side to both a heat sink and thermally conductive substrate vias thus establishing two th... | 12/02/2003 |
| 6656770 | Thermal enhancement approach using solder compositions in the liquid state Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder compositio... | 12/02/2003 |
| 6649443 | System for facilitating alignment of silicon die In accordance with the present invention, a method is described which facilitates heat transfer from a silicon die after the silicon die is bonded to a substrate. An alignment tool is used to align the spacer with the silicon die. A thermal conductor can ... | 11/18/2003 |
| 6646341 | Heat sink apparatus utilizing the heat sink shroud to dissipate heat In one embodiment, the present invention is a heat sink apparatus comprising a heat sink device and a heat sink shroud. The heat sink device is for transferring heat from a heat source. The heat sink shroud is thermally coupled with the heat sink device. ... | 11/11/2003 |
| 6639324 | Flip chip package module and method of forming the same A flip-chip package module consists of a semiconductor chip, a heat sink plate, a dielectric layer and a metal interconnect layer. The semiconductor chip has a positive side with a plurality of die pads located thereon and a back side for mounting onto th... | 10/28/2003 |
| 6626233 | Bi-level heat sink A bi-level assembly comprises a heat sink, a processor and a power supply. The heat sink includes a base and at least one fin structure attached to the base. The base may be a plate with attached heat pipes or the base may be a vapor chamber. The base is ... | 09/30/2003 |
| 6599779 | PBGA substrate for anchoring heat sink In accordance with the objectives of the invention a new method is provided to position and secure a heat sink over the surface of a semiconductor device mounting support, the latter typically being referred to as a semiconductor substrate. A plurality of... | 07/29/2003 |
| 6597582 | Semiconductor device incorporating module structure A semiconductor device comprises a plurality of semiconductor block modules mounted on a system board. The semiconductor block module comprises a block socket and a module board fitted thereto. The block socket assumes an annular shape and has connection ... | 07/22/2003 |
| 6586845 | Semiconductor device module and a part thereof A semiconductor device module includes one or a plurality of semiconductor devices, each including a semiconductor element having first and second surfaces, pads formed on the first surface on which electrode terminals are also formed and curved, flexible... | 07/01/2003 |
| 6577503 | Vertical surface mount apparatus with thermal carrier A high density vertical surface mount package and thermal carrier therefor including a heat sink.... | 06/10/2003 |
| 6566749 | Semiconductor die package with improved thermal and electrical performance A semiconductor die package is disclosed. In one embodiment, the package includes a semiconductor die comprising a vertical power transistor. A source electrode and a gate contact region are at the first surface of the semiconductor die. A drain electrode... | 05/20/2003 |
| 6562662 | Electronic package with bonded structure and method of making An electronic package comprising a semiconductor chip mounted on a substrate is formed by bonding a structure which covers at least an outer surface of the semiconductor chip and has the same or about the same thermal expansion coefficient as the substrat... | 05/13/2003 |
| 6547001 | Flexible glove-like heat sink A heat sink assembly for removing heat from an object having an outer surface includes a main body with an object receiving seat. A pair of flexible securing tabs are connected to the free edge of the open end of the main body which emanate into the open ... | 04/15/2003 |
| 6549407 | Heat exchanger retention mechanism A heat dissipation device including a heat spreader or support structure having a first surface and a second surface with a flange extending from the heat spreader second surface. A heat exchanger is disposed within a housing and the housing is attached t... | 04/15/2003 |
| 6542368 | Heat sink and power source unit employing the same A heat sink and a power source unit employing the same can minimize leakage of plosive outside of the power source unit upon failure of semiconductor parts and can restrict leakage of flashing, odor, smoke and so forth which is possibly caused upon occurr... | 04/01/2003 |
| 6538322 | Semiconductor device in a recess of a semiconductor plate A semiconductor device provided with one or more semiconductor pellets arranged on the bottom surface of a recess produced along a surface of a semiconductor plate having wirings arranged on the surface thereof, wirings extending toward the surface of the... | 03/25/2003 |
| 6537857 | Enhanced BGA grounded heatsink A new method is provided for the establishment of a low resistivity connection between a wire bonded IC chip that is mounted on a heatsink and the heatsink of the package. A copper trace connection is allocated for this purpose on the surface of the subst... | 03/25/2003 |
| 6528347 | Manufacturing method for making a microwave semiconductor device with improved heat discharge and electric properties In this disclosure, the semiconductor is directly mounted on the substrate plate of a package. According to this configuration, heat generated by the semiconductor chip is directly discharged, an excellent heat discharge property is realized. Moreover, th... | 03/04/2003 |
| 6523362 | Support for components used in microsystems technology A support element is described which can combine components used in Microsystems technology to form a single unit. Because of the very small dimensions of the support element, it is difficult to keep the components at different temperatures if this is req... | 02/25/2003 |
| 6525943 | Heat sink with alignment and retaining features An apparatus for providing heat sinks or heat spreaders for stacked semiconductor devices. Alignment apparatus may be included for the alignment of the stacked semiconductor devices. An enclosure may be used as the heat sink or heat spreader.... | 02/25/2003 |
| 6512675 | Heat sink grounded to a grounded package lid An intregrated circuit package, which has an intregrated circuit die thereto, is mounted to a system board. The ground trace of the system board is connected to the package, which has a pluality of ground leads on its surface. An electrically conductive e... | 01/28/2003 |
| 6504723 | Electronic assembly having solder thermal interface between a die substrate and a heat spreader An electronic assembly is provided having a die, a heat spreader, and a solidified solder material. A die includes a die substrate and an integrated circuit on a bottom surface of the die substrate. The heat spreader is located above the die and has left ... | 01/07/2003 |
| 6501647 | Computer with thermal cooling and a thermal cooling system and method A thermal cooling system in which a clamp assembly clamps a heat dissipating device to a heat generating device in the chassis of an electrical device. The clamp assembly ensures that the heat dissipating device exerts a relatively high, constant, uniform... | 12/31/2002 |
| 6496375 | Cooling arrangement for high density packaging of electronic components A cooling arrangement facilitates the cooling of a plurality of integrated circuit elements disposed on a plurality of substrates that are substantially perpendicularly mounted on a main substrate. In an example embodiment, the cooling arrangement provide... | 12/17/2002 |
| 6455929 | Embedded type package of power semiconductor device An embedded type package of power semiconductor device comprises a semiconductor device and a cup. One side of the semiconductor device is connected to a leader and another side of the semiconductor device is connected to the cup. The cup has guiding beve... | 09/24/2002 |
| 6445583 | Snap in heat sink shielding lid A construction and method are provided for electronically shielding an electronic component and for removing heat generated by the component. The construction and method involve the use of a shielding can, formed with EMI shielding material that surrounds... | 09/03/2002 |
| 6442026 | Apparatus for cooling a circuit component An apparatus for cooling circuit components includes a heat sink and circuit components mounted on a base. The heat sink includes a heat receiving portion for receiving heat from the circuit components. The heat sink includes a heat-transfer member provid... | 08/27/2002 |
| 6441499 | Thin form factor flip chip ball grid array A method for making a flip chip ball grid array (BGA) package includes the step of thinning a die for matching a composite coefficient of thermal expansion to that of a second level board.... | 08/27/2002 |
| 6426877 | Semiconductor device incorporating module structure A semiconductor device comprises a plurality of semiconductor block modules mounted on a system board. The semiconductor block module comprises a block socket and a module board fitted thereto. The block socket assumes an annular shape and has connection ... | 07/30/2002 |
| 6421241 | Heat exchanging chassis A novel apparatus for cooling, supporting, and packaging power electronics. An elongated heat exchanger having a rectangular cross-section may carry and cool plural electronic devices. Plural heat exchangers may be arranged to form a chassis for two-sided... | 07/16/2002 |
| 6418023 | Vertical surface mount apparatus with thermal carrier A high density vertical surface mount package and thermal carrier therefor including a heat sink.... | 07/09/2002 |
