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| Number | Title | Issue Date |
| 7423341 | Plastic overmolded packages with mechanically decoupled lid attach attachment The specification describes a lidded MCM IC plastic overmolded package with chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug. ... | 09/09/2008 |
| 7414311 | Ball grid array housing having a cooling foil A ball grid array housing, a semiconductor device having a ball grid array housing and an electronic circuit are disclosed. In one embodiment, a ball grid array housing includes a substrate with solder ball connections pointing out from a housing and at least one se... | 08/19/2008 |
| 7411290 | Integrated circuit chip and method for cooling an integrated circuit chip An integrated circuit chip is provided, the integrated circuit chip having: a base portion, the base portion having a peripheral wall forming an elevated perimeter depending away from a surface of the base potion; a plurality of extensions extending away from the su... | 08/12/2008 |
| 7372146 | Semiconductor module A semiconductor module includes a parts-mounting or packaging substrate, a plurality of power metal insulator semiconductor (MIS) chips which have top surfaces and back surfaces and are mounted by flip chip bonding on or above the package substrate while letting the... | 05/13/2008 |
| 7365422 | Package of leadframe with heatsinks A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink... | 04/29/2008 |
| 7358605 | Heat dissipation structure for electronic device A heat dissipation structure for an electronic device comprises a plurality of covering members made of a compressed wooden material, and a metal heat dissipation frame held between the covering members, and a portion of the heat dissipation frame is exposed outside... | 04/15/2008 |
| 7348604 | Light-emitting module The light-emitting module according to the present invention comprises a heat dissipation element, a substrate for example a metal core printed circuit board (MCPCB), or FR4 board which is coupled to one or more light-emitting elements and provides a means for opera... | 03/25/2008 |
| 7320177 | Radiator and method of manufacturing the same In a method of manufacturing a radiator, the blade of a carving tool is applied at a specific angle to the surface of a metal plate with a high coefficient of thermal conductivity, the carving tool is advanced while the angle is maintained, and the surface of the me... | 01/22/2008 |
| 7316789 | Conducting liquid crystal polymer nature comprising carbon nanotubes, use thereof and method of fabrication Conducting liquid crystal polymer matrix comprising carbon nanotubes aligned in the matrix is provided, along with use thereof and method of fabrication. ... | 01/08/2008 |
| 7304372 | Semiconductor package A semiconductor package including a bidirectional compound semiconductor component and two power semiconductor devices connected in a cascode configuration. ... | 12/04/2007 |
| 7301232 | Integrated circuit package with carbon nanotube array heat conductor An integrated circuit package includes a die mounted on a substrate, an integrated heat spreader set above the die, and an array of carbon nanotubes mounted between the die and the integrated heat spreader. The integrated heat spreader is fixed on the substrate, and... | 11/27/2007 |
| 7298043 | Semiconductor device A semiconductor device having a wiring substrate, a semiconductor element mounted on the wiring substrate via a heat sink, a wire electrically connecting the wiring substrate and the semiconductor element, the wiring substrate having through holes each connected to ... | 11/20/2007 |
| 7288840 | Structure for cooling a surface An apparatus for cooling a surface having a metal structure made of a material with high thermal conductivity, and designed to provide efficient cooling of the surface while minimizing mechanical stress between the metal structure and the surface. ... | 10/30/2007 |
| 7268426 | High-frequency chip packages A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit panel so as to provide enhanced thermal conductivity to the circuit panel and electromagnetic shielding and a conductive e... | 09/11/2007 |
| 7256493 | Ball grid array housing having a cooling foil A ball grid array housing, a semiconductor device having a ball grid array housing and an electronic circuit are disclosed. In one embodiment, a ball grid array housing includes a substrate with solder ball connections pointing out from a housing and at least one se... | 08/14/2007 |
| 7235889 | Integrated heatspreader for use in wire bonded ball grid array semiconductor packages The present invention is directed toward systems, packages, and methods for providing improved thermal performance in such packages and systems. Embodiments of the invention include a semiconductor integrated circuit (IC) package having a substrate with a heat sprea... | 06/26/2007 |
| 7119433 | Packaging for enhanced thermal and structural performance of electronic chip modules In an integrated circuit packaging structure, such as in a SCM, DCM, or MCM, a method and apparatus for increasing heat spreader size and thus thermal performance is disclosed. The packaging structure includes a first substrate; an electronic device operably coupled... | 10/10/2006 |
| 7084496 | Method and apparatus for providing optoelectronic communication with an electronic device An optoelectronic assembly for an electronic system includes a transparent substrate having a first surface and an opposite second surface, the transparent substrate being thermally conductive and being metallized on the surface. A support electronic chip set is con... | 08/01/2006 |
| 7009290 | Heat sink for semiconductor components or similar devices, method for producing the same and tool for carrying out said method A heat sink for semiconductor components or similar devices, especially produced from an extruded aluminum alloy. The heat sink comprises cooling ribs which rise at a distance from a base plate and which are clamped in an insert groove made in the surface of the bas... | 03/07/2006 |
| 6698505 | Cooler for an electronic device A cooler for an electronic device of the present invention is provided with a heatsink and a cross flow blower with an electric motor. The heatsink comprises a base and heat exchanging means made as flat disks, fins or flat plates. The base provides therm... | 03/02/2004 |
| 6698500 | Heat sink with fins A heat sink with fins comprising a group of heat dissipating fins which comprise combination of heat dissipating fins made of at least two kinds of metals having different heat conductivity, and a metal base plate on which surface portion the group of hea... | 03/02/2004 |
| 6698511 | Vortex heatsink for high performance thermal applications A method, apparatus, and article of manufacture for improving the thermal efficiency for heat transfer from an electronic device using a vortex heatsink arrangement. The apparatus comprises a fin array having a plurality of fins and having a variable fin ... | 03/02/2004 |
| 6691769 | Heat sink for convection cooling in horizontal applications A heat sink for free convection cooling in horizontal applications is provided. Specifically, the heat sink includes a plurality of spaced apart cooling fins, which are supported by an angled base. The cooling fins are transversely attached to the base an... | 02/17/2004 |
| 6684501 | Foil heat sink and a method for fabricating same A design and method for fabricating a foil heat sink including a fin body, wherein the fin body includes a plurality of heat sink fins having a fin head and a fin foot and wherein the plurality of heat sink fins are disposed in a parallel fashion so as to... | 02/03/2004 |
| 6681847 | Radiator fin formed by sintering operation This invention relates to a radiator fin formed by sintering operation, which comprises a base board formed by means of powder metallurgical sintering and a radiator fin formed by the bent metal sheet. The base board has a plurality of equidistant trenche... | 01/27/2004 |
| 6675885 | Heat-dissipating device for electronic components A heat dissipating device includes a plurality of plates each having a three-sided base plate portion and a pair of fin plate portions. The base plate portion has a contact side adapted to contact a heat generating object, and two opposite sides forming a... | 01/13/2004 |
| 6672379 | Positioning and buckling structure for use in a radiator A radiator with positioning and buckling structure includes multiple metal plates, each of which has a main body, and a folded side portion is connected to one or two sides of the main body. The positioning and buckling structure is disposed on each of th... | 01/06/2004 |
| 6671957 | Method of the manufacture of cooling devices A method for manufacturing cooling devices for mounting on semiconductor devices. These cooling devices are made from several extruded shaped section part elements. These shaped section part elements are made from an aluminum alloy and have grooves and be... | 01/06/2004 |
| 6671172 | Electronic assemblies with high capacity curved fin heat sinks An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air f... | 12/30/2003 |
| 6659168 | Heatsink with multiple fin types A heat sink includes a base having first and second regions, a first fin of a first type disposed on the first region of the base, and a second fin of a second type disposed on the second region of the base. The first and second regions of the base may be... | 12/09/2003 |
| 6655448 | Radiator with heat dissipation pieces connected in series A radiator. The radiator includes heat dissipating pieces secured together in series by a connection device. Each of the heat dissipating pieces includes upper and lower bending edges, and at least one opening. An insert is inserted into the openings of t... | 12/02/2003 |
| 6657865 | Heat dissipating structure A heat dissipating structure is formed via the assembly of metallic fins. An upper side, an inner side, and a lower side of each fin respectively form a first, second, and third folded edge. At least each first folded edge includes a groove through one ri... | 12/02/2003 |
| 6657862 | Radial folded fin heat sinks and methods of making and using same Non-prismatic radial folded fin heat sinks include fin arrays comprised of folded fins joined to a thermally conductive central core. The fin arrays can have either a constant or variable bend radius. The non-prismatic radial folded fins can be made by st... | 12/02/2003 |
| 6651733 | Heat sink A heat sink includes a plurality of fins made of a heat-conductive material. Each of the fins is integrally formed on opposed side edges thereof with four couplers, each having a first bent plate extending forward from the fin and a second bent plate exte... | 11/25/2003 |
| 6650215 | Finned heat sinks A method of enhancing the heat dissipating properties of a rigid substrate plate through creation of an array of erect spaced-apart parallelly disposed metallic fins projecting from the heat dissipating surface of the plate. The fins are created by superi... | 11/18/2003 |
| 6650559 | Power converting device A radiation container where a noise filter unit is sealed and accommodated with a resinous insulation material having a thermal conductive characteristic nearly equal to that of the radiation container, and a driving unit are directly installed on a radia... | 11/18/2003 |
| 6644397 | Combination sink A combination sink is comprised of multiple heat sinks made of sheet metal overlapped one another; each heat sink being provided with a base plate, a side wall being each provided to both longer sides of the base plate, one or more than one tab being adap... | 11/11/2003 |
| 6646875 | Axle tube structure for a motor A heat sink includes a plurality of adjoined heat-dissipating elements made of a thermally conductive material. Each of the elements has a flat lamina with a pair of first hems extending at a certain angle from two opposed sides of the flat lamina and a p... | 11/11/2003 |
| 6644386 | Engaging mechanism for heat-dissipating member A heat-dissipating member includes a sheet, an upper extension, and a lower extension. Each extension includes an engaging portion having a pair of opposed engaging hooks with an engaging slot defined therebetween. Each engaging hook is connected to an as... | 11/11/2003 |
| 6640883 | Computer heat sink A computer heat sink, it especially suits heat sinking of various chip sets or processors which may generate high temperature during running, and has the effect of better efficiency of heat sinking and inexpensiveness of production. It includes many heat ... | 11/04/2003 |
