Class 257/E23.102 - Cooling facilitated by shape of device (EPO)

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: This subclass is indented under subclass E23.101. This subclass
No. of patents: 249
Last issue date: 04/29/2008

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Number	Title	Issue Date
7365422	Package of leadframe with heatsinks A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink...	04/29/2008
7358606	Apparatus to compensate for stress between heat spreader and thermal interface material A device and method identify and compensate for tensile stress due to heat-caused expansion and contraction between an integrated heat spreader and thermal interface material. This device and method change the shape of the integrated heat spreader based upon the ide...	04/15/2008
7345364	Structure and method for improved heat conduction for semiconductor devices A thermally conductive structure for a semiconductor integrated circuit and a method for making the structure. The structure comprises one or more vertical and/or horizontal thermally conductive elements disposed proximate a device for improving thermal conductivity...	03/18/2008
7288840	Structure for cooling a surface An apparatus for cooling a surface having a metal structure made of a material with high thermal conductivity, and designed to provide efficient cooling of the surface while minimizing mechanical stress between the metal structure and the surface. ...	10/30/2007
7268427	Semiconductor package, printed board mounted with the same, and electronic apparatus having the printed board A holding fixture that holds a component and mounts the component on an electronic circuit board includes a holding member that holds the component at a side of a first surface of the electronic circuit board, a first fixing member that includes a first base that is...	09/11/2007
7259458	Integrated circuit with increased heat transfer A technique for improving the thermal power dissipation of an integrated circuit includes reducing the thermal resistivity of the integrated circuit by increasing heat transfer in vertical and/or lateral directions. These results are achieved by increasing the surfa...	08/21/2007
7205651	Thermally enhanced stacked die package and fabrication method A substrate is provided. A first die is attached to the substrate. The first die is electrically connected to the substrate. A heat sink having an undercut around its periphery is attached to the first die. A second die is attached to the heat sink. The second die i...	04/17/2007
7202561	Semiconductor package with heat dissipating structure and method of manufacturing the same A semiconductor package in which heat is easily dissipated and a semiconductor chip is not damaged during a molding process, and a method of manufacturing the same. The semiconductor package with a heat dissipating structure includes a substrate, a semiconductor chi...	04/10/2007
7193316	Integrated circuit coolant microchannel with movable portion According to some embodiments, a microchannel is provided to transport a coolant. The microchannel may be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. Moreover, a movable portion may be provided to adjust a volume o...	03/20/2007
7193317	Semiconductor module and power conversion device One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semico...	03/20/2007
6969907	Cooling structure for multichip module A first electronic device, a second electronic device which generates less heat than the first electric device, and an electrode are connected by a heat leveling plate formed of an electrically conductive material having high thermal conductivity. A heat radiation p...	11/29/2005
6702002	Hydronic pump type heat radiator The present invention provides a hydronic pump type heat radiator, which comprises an outer ring heat spreader, a plurality of outer heat-radiating fins, a plurality of inner heat-radiating fins, a cavity, and a pump. The outer ring heat spreader has an a...	03/09/2004
6700182	Thermally conductive substrate, thermally conductive substrate manufacturing method and power module By providing an end portion of a radiation plate located on and near an end portion of an insulator sheet, to which a lead frame extends, at a position away from the end portion of the insulator sheet inside of the insulator sheet in a plane direction of ...	03/02/2004
6691768	Heatsink design for uniform heat dissipation The present invention discloses improved heatsink designs and methods for cooling a heat source. One embodiment is a heatsink assembly for removing heat from an electronic component, the heatsink assembly comprising a copper-based core section having a fi...	02/17/2004
6666260	Scalable and modular heat sink-heat pipe cooling system Modular heat sinks utilizing heat pipes to provide a more uniform temperature distribution over a packaged integrated circuit and efficient heat sinking in either free or forced convection environments. The heat sinks utilize both horizontal and vertical ...	12/23/2003
6651734	Multi-element heat dissipating module A heat dissipating module comprises a large heat dissipating element having a base and a first fin set on an upper side of the base; a lateral side of the base having a plurality of holes; a plurality of small heat dissipating elements; each small heat di...	11/25/2003
6653167	Facilitating heat transfer from an integrated circuit package In accordance with the present invention, a method is described which facilitates heat transfer from a silicon die after the silicon die is bonded to a substrate. The thermal conductor is placed on the silicon layer after the silicon layer has been bonded...	11/25/2003
6649108	Method of manufacturing a U-shaped heat sink assembly A method of manufacturing a net-shape moldable U-shaped heat sink assembly includes injection molding a thermally conductive polymer composite material. The method includes forming a heat sink assembly base member with a number of integrated fins members ...	11/18/2003
6646340	Thermally coupling electrically decoupling cooling device for integrated circuits A thermally coupling electrically decoupling cooling device is described. The cooling device may be thermally disposed between a self-heating electrically conductive line and a semiconductor substrate to cool the line by transferring heat from the line to...	11/11/2003
6643137	Heat-dissipating device with grounding capability A heat-dissipating device is adapted for use with a multi-layer circuit board having a grounding layer and that has an electronic component mounted thereon. The heat-dissipating device includes a heat-dissipating member, a grounding member and a connectin...	11/04/2003
6633075	Heterojunction bipolar transistor and method for fabricating the same A heterojunction bipolar transistor includes an emitter layer, a base layer and a collector layer laminated on a top surface of a semiconductor substrate, and a heat sink layer made of a metal and provided on a rear surface of the substrate. A via hole is...	10/14/2003
6621705	Miniature surface mount heatsink element and method of use A printed circuit board (PCB) has at least a first surface. A patterned electrically and thermally conductive layer is disposed on the first surface. A surface mount device (SMD) is disposed on an area of the layer and is attached thereto with solder. Hea...	09/16/2003
6605778	Circuit carrier, in particular printed circuit board A circuit carrier (2) (printed circuit board 2) has two metallic outer layers (13, 14) and at least one metallic intermediate layer (11, 12). Insulating layers (8, 9) are arranged between the outer layers (13, 14) and the intermediate layer (11, 12). A co...	08/12/2003
6597065	Thermally enhanced semiconductor chip having integrated bonds over active circuits An integrated circuit (IC) chip has a metal network of electrical power distribution lines which have a thermal conductance at least an order of magnitude greater than underlying thin film electrical interconnects. These lines are deposited on the surface...	07/22/2003
6573596	Non-rectangular thermo module wafer cooling device using the same A non-rectangular thermo module is formed by disposing a plurality of Peltier devices between a pair of heat radiating plates, wherein the heat radiating plate has a circular or straight outer peripheral contour portion and inner peripheral contour portio...	06/03/2003
6571859	Heat sink and process and molding tool for production of same A heat sink of metal material, in particular a light metal alloy, for semi-conductor elements or similar components, has plate-like cooling ribs projecting from a base plate at intervals (f) and approximately parallel to each other, protrude with a connec...	06/03/2003
6569380	Enclosure for a semiconductor device A method to form a combined enclosure and heat sink structure for a semiconductor device is achieved. A first feedstock comprising a first mixture of powdered metal materials, lubricants, and binders is prepared. A second feedstock comprising a second mix...	05/27/2003
6549411	Flexible heat sinks and method of attaching flexible heat sinks This invention teaches that the heat sink and/or the object from which heat is to be removed may have significant flexibility. Indeed, it may be advantageous for one or both to have significant flexibility in that it allows good conformity for good therma...	04/15/2003
6548882	Power transistor cell A power transistor cell includes an air bridge and a plurality of individual transistors. Each of the plurality of individual transistors has at least one separate connection contact. Each of the at least one separate connection contact of the plurality o...	04/15/2003
6549404	Semiconductor module apparatus and cooling apparatus A semiconductor module apparatus is configured such that the upper surface of a substrate on which are mounted a plurality of heat-generating semiconductor devices is covered with a radiation plate serving as a support frame for supporting the substrate. ...	04/15/2003
6543521	Cooling element and cooling apparatus using the same The cooling element of the present invention comprises a base section in contact with a heat producing element, and a heat dissipation section integrally formed with the base section. The cooling element of the present invention is constructed such that a...	04/08/2003
6538322	Semiconductor device in a recess of a semiconductor plate A semiconductor device provided with one or more semiconductor pellets arranged on the bottom surface of a recess produced along a surface of a semiconductor plate having wirings arranged on the surface thereof, wirings extending toward the surface of the...	03/25/2003
6538884	Method and apparatus for removing heat from a component An apparatus for removing heat (118) from a component (102) located on a surface (104) of an electronics module (100). The apparatus includes a heat removal device (108) mounted to electronics module (100) a radial distance (110) away from component (102)...	03/25/2003
6534857	Thermally balanced power transistor A high power transistor structure comprised of a plurality of field effect transistors fabricated in parallel on a common semiconductor chip and wherein the gate electrodes of the field effect devices are in the form of parallel finger elements having a v...	03/18/2003
6525419	Thermally coupling electrically decoupling cooling device for integrated circuits A thermally coupling electrically decoupling cooling device is described. The cooling device may be thermally disposed between a self-heating electrically conductive line and a semiconductor substrate to cool the line by transferring heat from the line to...	02/25/2003
6525354	FET circuit block with reduced self-heating A field effect transistor (FET) is disclosed that includes a heat spreader adapted to reduced the thermal resistance and channel operating temperature of a field effect transistor used in a circuit block susceptible to self-heating effects. In one embodim...	02/25/2003
6519154	Thermal bus design to cool a microelectronic die A novel thermal bus is shown that more effectively transmits heat away from a die of an IC. The innovative thermal bus is capable of transmitting heat to other heat dissipating devices such as heat sinks, which eventually transmit the heat out to ambient....	02/11/2003
6512674	Package for semiconductor device having radiating substrate and radiator fin A package according to the present invention includes a radiating substrate, a concave portion for a screw formed on a first side of the radiating substrate, a first groove formed on the first surface between a chip mounting portion and the concave portio...	01/28/2003
6478082	Heat dissipating apparatus with nest wind duct A heat dissipating apparatus with nest wind duct is arranged corresponding to a horizontal flow of air. The heat dissipating apparatus is composed of nest wind duct with a plurality of through passages to form at least two vertical porous surfaces for the...	11/12/2002
6455924	Stress-relieving heatsink structure and method of attachment to an electronic package A stress-relieving heatsink structure and method of forming thereof for an electronic package, for instance, that including a semiconductor chip package which is mounted on a wired carrier, such as a circuitized substrate. The heatsink structure is consti...	09/24/2002

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Class 257/E23.102 - Cooling facilitated by shape of device (EPO)