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| Number | Title | Issue Date |
| 7336486 | Synthetic jet-based heat dissipation device A synthetic jet array in a computing device, such as a mobile computing device, to dissipate heat generated by a heat generating component of the mobile computer is described. In one embodiment, a microscale synthetic jet array is integrated within a heat generating... | 02/26/2008 |
| 7282799 | Thermal interface with a patterned structure An interface is formed by pressing a patterned first surface and a second surface together, with a particle-loaded interface material in between. The first surface is fabricated with a pattern of channels designed to redistribute the velocity gradients that occur in... | 10/16/2007 |
| 7061078 | Semiconductor package A semiconductor package includes a chip and a carrier. The chip has an active surface and a lateral surface. The active surface has a number of first bumps and a number of second bumps. The first bumps are spaced by the second bumps. The first bumps are farther from... | 06/13/2006 |
| 6650542 | Piezoelectric actuated jet impingement cooling Embodiments in accordance with the present invention provides active thermal management of the heat generated at localized hot spots on the microelectronic die by using fluid impingement cooling. The combination of orifices constructed using piezoelectric... | 11/18/2003 |
| 6644058 | Modular sprayjet cooling system A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within ... | 11/11/2003 |
| 6646879 | Spray evaporative cooling system and method A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase f... | 11/11/2003 |
| 6612120 | Spray cooling with local control of nozzles A semiconductor chip cooling system configured with thermal inkjet type sprayers controlled by a control system. The control system can operate groups of the sprayers at different rates to controllably cool separate regions of a chip at different rates. A... | 09/02/2003 |
| 6604370 | Variably configured sprayjet cooling system A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within ... | 08/12/2003 |
| 6595014 | Spray cooling system with cooling regime detection A cooling system for cooling one or more components that produce heat. The cooling system includes sprayers configured to spray cooling fluid toward the components. A detection system includes a radiation source and a radiation sensor that pass radiant en... | 07/22/2003 |
| 6580610 | Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the poin... | 06/17/2003 |
| 6580609 | Method and apparatus for cooling electronic components A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase f... | 06/17/2003 |
| 6571569 | Method and apparatus for high heat flux heat transfer The subject invention pertains to a method and apparatus for high heat flux heat transfer. The subject invention can be utilized to transfer heat from a heat source to a coolant such that the transferred heat can be effectively transported to another loca... | 06/03/2003 |
| 6550263 | Spray cooling system for a device A semiconductor chip cooling system having a body that forms a cavity configured to create a spray chamber when conformingly adjoined to a chip, or to a substrate or printed circuit board carrying one or more chips. The cooling system uses thermal inkjet ... | 04/22/2003 |
| 6519151 | Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof Impingement plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a thermally conductive plate having a first main surface and a second main surface with a plurality of concave surface portions forme... | 02/11/2003 |
| 6507492 | Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the poin... | 01/14/2003 |
| 6484521 | Spray cooling with local control of nozzles A semiconductor chip cooling system configured with thermal inkjet type sprayers controlled by a control system. The control system can operate groups of the sprayers at different rates to controllably cool separate regions of a chip at different rates. A... | 11/26/2002 |
| 6459581 | Electronic device using evaporative micro-cooling and associated methods An electronic device includes a package surrounding at least one integrated circuit, a micro-fluidic cooler in the package, and a controller for controlling the micro-fluidic cooler so that the cooling fluid provides evaporative cooling, such as droplet i... | 10/01/2002 |
| 6457321 | Spray cooling system A spray cooling system for semiconductor devices. An ink-jet type spray device sprays droplets of a cooling fluid onto the semiconductor devices. The devices vaporize the liquid, which gets passed through a roll bond panel, or other heat exchanger, and is... | 10/01/2002 |
| 6431260 | Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof Cavity plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a cavity plate having one or more blind holes formed therein and one or more jet nozzles each configured to reside within a respective bli... | 08/13/2002 |
| 6377458 | Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the poin... | 04/23/2002 |
| 6354370 | Liquid spray phase-change cooling of laser devices An open loop liquid spray phase-change cooling system for a laser comprised of an expendable supply of a compressed liquid refrigerant, a laser heat sink, an on/off valve, and a means for controlling the on/off valve in response to the measured heat sink ... | 03/12/2002 |
| 6349760 | Method and apparatus for improving the thermal performance of heat sinks A heat removal system for removing heat from an electric device. The heat removal system includes a heat sink coupled to an electric device. The heat sink absorbs heat generated by the electric device, and may be in direct contact or remotely thermally co... | 02/26/2002 |
| 6349554 | Spray cooling system A spray cooling system for semiconductor devices. An ink-jet type spray device sprays droplets of a cooling fluid onto the semiconductor devices. The devices vaporize the liquid, which gets passed through a roll bond panel, or other heat exchanger, and is... | 02/26/2002 |
| 6215166 | Radio frequency electronic device and method for regulating an amount of power delivered to a radio frequency electronic device The device (10) includes a semiconductor die (12) positioned to receive a fluid cooling medium (45) and a power input lead (25) attached to the semiconductor die. The power input lead having a characteristic such that at a first temperature a first curren... | 04/10/2001 |
| 6205799 | Spray cooling system A spray cooling system for semiconductor devices. An ink-jet type spray device sprays droplets of a cooling fluid onto the semiconductor devices. The devices vaporize the liquid, which gets passed through a roil bond panel, or other heat exchanger, and is... | 03/27/2001 |
| 6104610 | EMI shielding fluid control apparatus An EMI shielding fluid control shroud is adapted for use in spray cooling EMI producing or EMI sensitive components. The EMI shielding shroud, carried between a printed circuit board and a spray plate, defines an interior spray cavity which prevents inter... | 08/15/2000 |
| 5999404 | Spray cooled module with removable spray cooled sub-module An electronic system that may include an electronic card sub-module that is electrically connected to, and in fluid communication with, an electronic card module. The electronic card module can be mated with a motherboard and coupled to a manifold of a co... | 12/07/1999 |
| 5854092 | Method for spray-cooling a tunable semiconductor device The method includes providing a substrate (18) having a semiconductor die (12) thereon, the semiconductor die having a major surface (23); disposing an input region (24) an active region (32) and a conductive region (34) on the major surface, the conducti... | 12/29/1998 |
| 5846852 | Process for mounting an electronic component to a substrate and process for spray-cooling the electronic component mounted to a substrate The electronic component (10) has a die (22) and a terminal (14) coupled to the die (22). The substrate has a first side (20) and a second side (82) and a passage (26) therethrough. The terminal (14) is in communication with the first side (20) and the di... | 12/08/1998 |
| 5777384 | Tunable semiconductor device The device includes a substrate (18). A first semiconductor die (12) is disposed on the substrate (18). The first semiconductor die (12) has a major surface (23) and at least a portion of the major surface (23) is positioned to receive a cooling medium. A... | 07/07/1998 |
| 5768103 | Circuit board apparatus and apparatus and method for spray-cooling an electronic component The apparatus includes a housing having a cavity, the cavity sized to enclose an electronic component. The housing includes a first layer having a first aperture and a second layer having a second aperture. The second aperture is in communication with the... | 06/16/1998 |
| 5761035 | Circuit board apparatus and method for spray-cooling a circuit board The circuit board apparatus (10) includes a first layer (12, 14), a second layer (12, 14) and an inner plate (19) disposed between the first layer (12, 14) and the second layer (12, 14). A fluid distributing conduit (38) is disposed in the inner plate (19... | 06/02/1998 |
| 5731542 | Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic component mounted to a substrate The electronic component (10) has a die (22) and a terminal (14) coupled to the die (22). The substrate has a first side (20) and a second side (82) and a passage (26) therethrough. The terminal (14) is in communication with the first side (20) and the di... | 03/24/1998 |
| 5687577 | Apparatus and method for spray-cooling an electronic module The apparatus includes a plate (10) having a first layer (12) and a second layer (14) opposed to the first layer (12). The second layer (14) includes a first substrate. A fluid distributing manifold (28) is disposed proximate the first layer (12). A nozzl... | 11/18/1997 |
| 5553394 | Radial jet reattachment nozzle heat sink module for cooling electronics A radial jet nozzle for use in cooling a subject body. The radial jet nozzle includes a duct communicating with a plenum and a tapered flow diverter body positioned within the duct for comtrollably diverting the flow of a heat transfer medium through the ... | 09/10/1996 |
| 5522452 | Liquid cooling system for LSI packages In a liquid cooling system for a printed circuit board on which integrated circuit packages are mounted, heat sinks are secured respectively to the packages in heat transfer contact therewith. Nozzles are provided in positions corresponding to the heat si... | 06/04/1996 |
| 5465192 | Cooling apparatus for integrated circuit chips for preventing forcible contact between a cooling member and the chips A cooling apparatus for integrated circuit chips in which the pressure of coolant does not affect the pressure exerted by the cooling apparatus on the chip. A block is provided with a plurality of holes, and cooling members are inserted in these holes. An... | 11/07/1995 |
| 5436501 | Cooling structure for integrated circuit A cooling structure for an integrated circuit that uses a liquid coolant to absorb heat directly from the integrated circuit includes a wiring substrate, an integrated circuit mounted on the wiring substrate, and a hollow cooling block, in which liquid co... | 07/25/1995 |
| 5420753 | Structure for cooling an integrated circuit In a structure for cooling an integrated circuit (IC), a hollow cylindrical member is mounted on a cold plate and receives a heat conductor therein. The heat conductor is a cylindrical member which is closed by a flat plate at one end thereof. Silicone ge... | 05/30/1995 |
| 5394299 | Topology matched conduction cooling module The pistons of a cold plate frame orient themselves as a result of being free to move along one axis and about two other axes by the reflowing of solder tinning on the external surfaces of the pistons and the walls of the recesses within which the pistons... | 02/28/1995 |
