Bizarre Patents
Combination Beverage Container and Spittoon
A combination beverage container and spittoon includes a bottom portion including outer wall and a first inner wall defining a spittoon space.
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| Number | Title | Issue Date |
| 7391612 | Dual impeller push-pull axial fan sink A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to t... | 06/24/2008 |
| 7385815 | Dual impeller push-pull axial fan A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to t... | 06/10/2008 |
| 7385816 | Dual impeller push-pull axial fan heat sink A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to t... | 06/10/2008 |
| 7324339 | Dual impeller push-pull axial fan heat sink A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to t... | 01/29/2008 |
| 7323776 | Elevated heat dissipating device The elevated heat dissipating device of the present invention comprises a thermal substrate connecting onto a heat source and at least one heat conductive pipe connecting to the thermal substrate. The heat conductive pipe further comprises a connecting part connecte... | 01/29/2008 |
| 7304847 | Heat sink A heat sink includes a plurality of fins parallel to each other, and one heat pipe extending through these fins. A flow channel is formed between each pair of neighboring fins for channeling an airflow generated by an electric fan. A guiding member having a curved s... | 12/04/2007 |
| 7289324 | Heat dissipation device having power wires fixture A wire fixture (27) is for fastening power wires (246) of a heat-dissipating fan (24) to a supporting surface of a heat dissipation device (20). The heat dissipation device is for dissipating heat from a heat-generating electronic compone... | 10/30/2007 |
| 7289330 | Heat sink assembly having a fan mounting device A heat sink assembly (100) includes a heat sink (10) having a plurality of fins (14), a fan handle (24) buckled with the fins and a fan (30) mounted on the heat sink (10) via the fan handle. The fan handle includes a retaini... | 10/30/2007 |
| 7242028 | Light emitting diode light source A light source that utilizes light emitting diodes that emit white light is disclosed. The diodes are mounted on an elongate member having at least two surfaces upon which the light emitting diodes are mounted. The elongate member is thermally conductive and is util... | 07/10/2007 |
| 7202562 | Integrated circuit cooling system and method A system and method for cooling an integrated circuit is provided. One aspect of this disclosure relates to a cooling system that utilizes sound waves to cool a semiconductor structure. The system includes a container to hold at least one semiconductor chip having s... | 04/10/2007 |
| 7091604 | Three dimensional integrated circuits A three-dimensional integrated circuit that provides reduced interconnect signal delay over known 2-dimensional systems. The three-dimensional integrated circuit also allows improved circuit cooling. The three-dimensional integrated circuit includes two or more elec... | 08/15/2006 |
| 6704199 | Low profile equipment housing with angular fan The present invention is directed to a ventilating or cooling element for airflow cooling in a digital data processing apparatus, and it is particularly suited to such apparatus having a high circuit density, or mounted within a restricted chassis or hous... | 03/09/2004 |
| 6702000 | Heat sink apparatus, blower for use therein and electronic equipment using the same apparatus A blower is provided for effectively cooling heat generating parts in a casing of a personal computer and so on, with a heat sink apparatus using the blower and an electronic equipment using the heat sink apparatus. The blower comprises a fan and an outer... | 03/09/2004 |
| 6698505 | Cooler for an electronic device A cooler for an electronic device of the present invention is provided with a heatsink and a cross flow blower with an electric motor. The heatsink comprises a base and heat exchanging means made as flat disks, fins or flat plates. The base provides therm... | 03/02/2004 |
| 6698499 | Cooling device and method A cooling device includes a heat sink assembly that may also form a housing surrounding a chamber. The housing may be constructed of a plurality of cooling vanes which have elongated openings therebetween allowing air to pass between and cool the vanes. T... | 03/02/2004 |
| 6698500 | Heat sink with fins A heat sink with fins comprising a group of heat dissipating fins which comprise combination of heat dissipating fins made of at least two kinds of metals having different heat conductivity, and a metal base plate on which surface portion the group of hea... | 03/02/2004 |
| 6695045 | Bladed heat sink A bladed heat sink. The sink includes a connecting board, a plurality of blades, a frame and at least one reinforcing rib. The connecting board is enclosed by the frame. The blades radiate from the connecting board to the frame. Furthermore, the blades ar... | 02/24/2004 |
| 6697256 | Fastening device for attaching a heat sink to heat producer A fastening device for attaching a heat sink to a heat producer, which is supported on a board having through-holes aligned with mounting holes of the heat sink. The fastening device includes a tube adjacent to one mounting hole, a fastening member movabl... | 02/24/2004 |
| 6691768 | Heatsink design for uniform heat dissipation The present invention discloses improved heatsink designs and methods for cooling a heat source. One embodiment is a heatsink assembly for removing heat from an electronic component, the heatsink assembly comprising a copper-based core section having a fi... | 02/17/2004 |
| 6691770 | Cooling apparatus A heat sink comprises a core member comprising at least one core member first surface. The core member first surface is adapted to contact or be located adjacent at least a portion of the heat source. At least one outer peripheral surface is located on th... | 02/17/2004 |
| 6691769 | Heat sink for convection cooling in horizontal applications A heat sink for free convection cooling in horizontal applications is provided. Specifically, the heat sink includes a plurality of spaced apart cooling fins, which are supported by an angled base. The cooling fins are transversely attached to the base an... | 02/17/2004 |
| 6690577 | Air guide An adjustable air guide includes a first hollow element located adjacent to an aperture in a wall of an enclosure to allow air to pass freely there through. At least a first rigid adjustable rigid hollow pipe, a first hollow elbow, a second rigid adjustab... | 02/10/2004 |
| 6688379 | Heat dissipation device with high efficiency The heat dissipation device includes a frame and an impeller. The frame has an inlet and an outlet, in which the inlet has a noncircular shape. The inlet can be provided with a blocking board so as to be noncircular. The blocking board suppresses airflow ... | 02/10/2004 |
| 6684942 | Heat sink A heat sink is provided with a box-like body attached to heat dissipating surface of a heat-dissipating element. A separation board separates the box-like body into upper and lower parts. A number of side separation boards divide the lower part into sever... | 02/03/2004 |
| 6681842 | Cooling apparatus A heat sink comprises a core member comprising at least one first surface adapted to contact at least a portion of the heat source. An one outer peripheral surface is located on the core member. At least one cooling fin device comprising an inner peripher... | 01/27/2004 |
| 6673649 | Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages A microelectronic package and method for forming such a package. In one embodiment, the package can include a microelectronic substrate having first connection sites, and a support member having second connection sites and third connection sites, with the... | 01/06/2004 |
| 6671177 | Graphics card apparatus with improved heat dissipation Graphics card apparatus with improved heat dissipation and including a planar metallic cover plate having an external perimeter configuration that generally corresponds to the plan-form of the printed circuit board used in the graphics card assembly, a pl... | 12/30/2003 |
| 6671172 | Electronic assemblies with high capacity curved fin heat sinks An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air f... | 12/30/2003 |
| 6667882 | Cooling assembly for a heat producing assembly A cooling assembly for dissipating heat produced in a heat generating component of an electronic system includes a shroud assembly. The cooling assembly also includes a heat dissipating device removably housed within the shroud assembly and a fan assembly... | 12/23/2003 |
| 6666260 | Scalable and modular heat sink-heat pipe cooling system Modular heat sinks utilizing heat pipes to provide a more uniform temperature distribution over a packaged integrated circuit and efficient heat sinking in either free or forced convection environments. The heat sinks utilize both horizontal and vertical ... | 12/23/2003 |
| 6667884 | Heat dissipating assembly A heat dissipating assembly includes a CPU (35) mounted on a motherboard (30), a fan (20), two clips (60), a heat sink (10), two fasteners (50), a back plate (40) and two posts (70). The heat sink includes a base (12) and a plurality of fins (14). Two ear... | 12/23/2003 |
| 6664673 | Cooler for electronic devices According to the present invention, a cooler for electronic devices comprises a heat exchange element, a blower with a radial type impeller, and an electric drive. The heat exchange element comprises heat exchanging means made on one surface of said heat ... | 12/16/2003 |
| 6659169 | Cooler for electronic devices An apparatus and method for a centrifugal pump (1) for pumping sensitive biological fluids which includes (i) an integral impeller and rotor (21) which is entirely supported and rotated magnetically by electromagnets (52, 54), (ii) a pump housing (12, 14)... | 12/09/2003 |
| 6662136 | Digital temperature sensor (DTS) system to monitor temperature in a memory subsystem A memory subsystem package has a memory controller interface ASIC (application specific integrated circuit) and a plurality of memory modules. The ASIC has a bi-directional serial protocol i2C communication bus to off chip drivers for monitoring temperatu... | 12/09/2003 |
| 6661666 | Device for enhancing the local cooling of electronic packages subject to laminar air flow A device having features for enhancing the cooling of an electronic package subject to laminar air flow. The features include a bluff body, located adjacent the electronic package and within the laminar air flow, for creating turbulence in the air flow to... | 12/09/2003 |
| 6657860 | Heat dissipating device and computer A heat sink, cooling member, semi-conductor substrate cooling system, computer and method for providing sufficient cooling performance through a heat sink is provided. In part, there is provided a heat sink having a radiating portion for diffusing the hea... | 12/02/2003 |
| 6657865 | Heat dissipating structure A heat dissipating structure is formed via the assembly of metallic fins. An upper side, an inner side, and a lower side of each fin respectively form a first, second, and third folded edge. At least each first folded edge includes a groove through one ri... | 12/02/2003 |
| 6651734 | Multi-element heat dissipating module A heat dissipating module comprises a large heat dissipating element having a base and a first fin set on an upper side of the base; a lateral side of the base having a plurality of holes; a plurality of small heat dissipating elements; each small heat di... | 11/25/2003 |
| 6654242 | Electronic apparatus with built-in CPU An electronic apparatus having a built-in CPU is provided, which prevents other electronic devices/units mounted in a casing along with a built-in CPU from being badly affected by the heat generated by the CPU even if the mounting density of electronic de... | 11/25/2003 |
| 6654247 | Computer heat dissipating structure A computer heat dissipating structure of the invention is mounted over a computer main board inside a computer principal unit to dissipate the heat irradiated by at least a principal heat source and a secondary heat source. The computer heat dissipating s... | 11/25/2003 |
